NL6717634A - - Google Patents

Info

Publication number
NL6717634A
NL6717634A NL6717634A NL6717634A NL6717634A NL 6717634 A NL6717634 A NL 6717634A NL 6717634 A NL6717634 A NL 6717634A NL 6717634 A NL6717634 A NL 6717634A NL 6717634 A NL6717634 A NL 6717634A
Authority
NL
Netherlands
Application number
NL6717634A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6717634A priority Critical patent/NL6717634A/xx
Priority to US780085A priority patent/US3555375A/en
Priority to DE1812942A priority patent/DE1812942C3/de
Priority to FR1595201D priority patent/FR1595201A/fr
Priority to GB60379/68A priority patent/GB1245610A/en
Priority to CH1899468A priority patent/CH485322A/de
Priority to AT1235268A priority patent/AT302418B/de
Priority to BE725859D priority patent/BE725859A/xx
Publication of NL6717634A publication Critical patent/NL6717634A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
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    • H01L2924/301—Electrical effects
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
NL6717634A 1967-12-22 1967-12-22 NL6717634A (xx)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL6717634A NL6717634A (xx) 1967-12-22 1967-12-22
US780085A US3555375A (en) 1967-12-22 1968-11-29 High frequency power transistor having crossing input and output leads
DE1812942A DE1812942C3 (de) 1967-12-22 1968-12-05 Halbleiteranordnung und Schaltungsanordnung mit einer solchen Halbleiteranordnung
FR1595201D FR1595201A (xx) 1967-12-22 1968-12-17
GB60379/68A GB1245610A (en) 1967-12-22 1968-12-19 Improvements in and relating to semiconductor devices
CH1899468A CH485322A (de) 1967-12-22 1968-12-19 Halbleitervorrichtung
AT1235268A AT302418B (de) 1967-12-22 1968-12-19 Halbleitervorrichtung, insbesondere Transistor
BE725859D BE725859A (xx) 1967-12-22 1968-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6717634A NL6717634A (xx) 1967-12-22 1967-12-22

Publications (1)

Publication Number Publication Date
NL6717634A true NL6717634A (xx) 1969-06-24

Family

ID=19802087

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6717634A NL6717634A (xx) 1967-12-22 1967-12-22

Country Status (8)

Country Link
US (1) US3555375A (xx)
AT (1) AT302418B (xx)
BE (1) BE725859A (xx)
CH (1) CH485322A (xx)
DE (1) DE1812942C3 (xx)
FR (1) FR1595201A (xx)
GB (1) GB1245610A (xx)
NL (1) NL6717634A (xx)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3671793A (en) * 1969-09-16 1972-06-20 Itt High frequency transistor structure having an impedance transforming network incorporated on the semiconductor chip
US3649872A (en) * 1970-07-15 1972-03-14 Trw Inc Packaging structure for high-frequency semiconductor devices
DE2203892C3 (de) * 1971-02-08 1982-05-27 TRW Inc., Los Angeles, Calif. Transistoranordnung mit mehreren zur Leistungserhöhung bei hohen Frequenzen parallel geschalteten Transistorelementen
JPS52120768A (en) * 1976-04-05 1977-10-11 Nec Corp Semiconductor device
US4193083A (en) * 1977-01-07 1980-03-11 Varian Associates, Inc. Package for push-pull semiconductor devices
US4107728A (en) * 1977-01-07 1978-08-15 Varian Associates, Inc. Package for push-pull semiconductor devices
EP1237189A1 (en) 2001-02-28 2002-09-04 Motorola, Inc. Arrangement and method for impedance matching
US8034666B2 (en) * 2009-11-15 2011-10-11 Microsemi Corporation Multi-layer thick-film RF package
US8410601B2 (en) * 2009-11-15 2013-04-02 Microsemi Corporation RF package
US10137789B2 (en) * 2016-07-20 2018-11-27 Ford Global Technologies, Llc Signal pin arrangement for multi-device power module

Also Published As

Publication number Publication date
AT302418B (de) 1972-10-10
US3555375A (en) 1971-01-12
DE1812942B2 (de) 1980-04-24
GB1245610A (en) 1971-09-08
CH485322A (de) 1970-01-31
BE725859A (xx) 1969-06-20
DE1812942A1 (de) 1969-07-03
FR1595201A (xx) 1970-06-08
DE1812942C3 (de) 1981-01-08

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