CH485322A - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
CH485322A
CH485322A CH1899468A CH1899468A CH485322A CH 485322 A CH485322 A CH 485322A CH 1899468 A CH1899468 A CH 1899468A CH 1899468 A CH1899468 A CH 1899468A CH 485322 A CH485322 A CH 485322A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
CH1899468A
Other languages
German (de)
English (en)
Inventor
Hubertus Hilbers Antonius
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH485322A publication Critical patent/CH485322A/de

Links

Classifications

    • H10W99/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H10W44/20—
    • H10W70/481—
    • H10W72/20—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H10W72/5522—
    • H10W72/5524—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Bipolar Transistors (AREA)
  • Amplifiers (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Junction Field-Effect Transistors (AREA)
CH1899468A 1967-12-22 1968-12-19 Halbleitervorrichtung CH485322A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6717634A NL6717634A (enExample) 1967-12-22 1967-12-22

Publications (1)

Publication Number Publication Date
CH485322A true CH485322A (de) 1970-01-31

Family

ID=19802087

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1899468A CH485322A (de) 1967-12-22 1968-12-19 Halbleitervorrichtung

Country Status (8)

Country Link
US (1) US3555375A (enExample)
AT (1) AT302418B (enExample)
BE (1) BE725859A (enExample)
CH (1) CH485322A (enExample)
DE (1) DE1812942C3 (enExample)
FR (1) FR1595201A (enExample)
GB (1) GB1245610A (enExample)
NL (1) NL6717634A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3671793A (en) * 1969-09-16 1972-06-20 Itt High frequency transistor structure having an impedance transforming network incorporated on the semiconductor chip
US3649872A (en) * 1970-07-15 1972-03-14 Trw Inc Packaging structure for high-frequency semiconductor devices
DE2203892C3 (de) * 1971-02-08 1982-05-27 TRW Inc., Los Angeles, Calif. Transistoranordnung mit mehreren zur Leistungserhöhung bei hohen Frequenzen parallel geschalteten Transistorelementen
JPS52120768A (en) * 1976-04-05 1977-10-11 Nec Corp Semiconductor device
US4107728A (en) * 1977-01-07 1978-08-15 Varian Associates, Inc. Package for push-pull semiconductor devices
US4193083A (en) * 1977-01-07 1980-03-11 Varian Associates, Inc. Package for push-pull semiconductor devices
EP1237189A1 (en) 2001-02-28 2002-09-04 Motorola, Inc. Arrangement and method for impedance matching
US8410601B2 (en) * 2009-11-15 2013-04-02 Microsemi Corporation RF package
US8034666B2 (en) * 2009-11-15 2011-10-11 Microsemi Corporation Multi-layer thick-film RF package
US10137789B2 (en) * 2016-07-20 2018-11-27 Ford Global Technologies, Llc Signal pin arrangement for multi-device power module
JP6541859B1 (ja) * 2018-11-01 2019-07-10 三菱電機株式会社 電力変換装置

Also Published As

Publication number Publication date
AT302418B (de) 1972-10-10
DE1812942B2 (de) 1980-04-24
GB1245610A (en) 1971-09-08
US3555375A (en) 1971-01-12
FR1595201A (enExample) 1970-06-08
DE1812942A1 (de) 1969-07-03
DE1812942C3 (de) 1981-01-08
BE725859A (enExample) 1969-06-20
NL6717634A (enExample) 1969-06-24

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Legal Events

Date Code Title Description
PL Patent ceased