DE1614236B2 - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
DE1614236B2
DE1614236B2 DE1967N0030311 DEN0030311A DE1614236B2 DE 1614236 B2 DE1614236 B2 DE 1614236B2 DE 1967N0030311 DE1967N0030311 DE 1967N0030311 DE N0030311 A DEN0030311 A DE N0030311A DE 1614236 B2 DE1614236 B2 DE 1614236B2
Authority
DE
Germany
Prior art keywords
pin
envelope
pins
semiconductor
semiconductor body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE1967N0030311
Other languages
German (de)
English (en)
Other versions
DE1614236A1 (de
Inventor
Jacobus; Tuinhof Anton Dirk Nijmegen Eigeman (Niederlande)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE1614236A1 publication Critical patent/DE1614236A1/de
Publication of DE1614236B2 publication Critical patent/DE1614236B2/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/43—Gaseous fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Junction Field-Effect Transistors (AREA)
DE1967N0030311 1966-04-14 1967-04-11 Halbleiteranordnung Ceased DE1614236B2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL6604965A NL6604965A (enExample) 1966-04-14 1966-04-14
NL6604964A NL6604964A (enExample) 1966-04-14 1966-04-14
NL6704097A NL6704097A (enExample) 1966-04-14 1967-03-18

Publications (2)

Publication Number Publication Date
DE1614236A1 DE1614236A1 (de) 1970-08-20
DE1614236B2 true DE1614236B2 (de) 1977-06-08

Family

ID=27351363

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1967N0030311 Ceased DE1614236B2 (de) 1966-04-14 1967-04-11 Halbleiteranordnung

Country Status (11)

Country Link
US (1) US3476990A (enExample)
AT (1) AT275607B (enExample)
BE (1) BE697075A (enExample)
BR (1) BR6788579D0 (enExample)
CH (1) CH476396A (enExample)
DE (1) DE1614236B2 (enExample)
DK (1) DK117909B (enExample)
ES (1) ES339180A0 (enExample)
GB (1) GB1175122A (enExample)
NL (3) NL6604965A (enExample)
SE (1) SE342359B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2250918C2 (de) * 1971-10-27 1982-02-04 Westinghouse Electric Corp., 15222 Pittsburgh, Pa. Chipträger für Mikrowellen-Leistungstransistoren und Verfahren zu seiner Herstellung
DE3106376A1 (de) * 1981-02-20 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern
GB2150747B (en) * 1983-12-02 1987-04-23 Philips Electronic Associated Pyroelectric infra-red radiation detector
EP0439653A1 (de) * 1990-01-31 1991-08-07 Siemens Aktiengesellschaft Hochfrequenz-SMD-Transistor mit zwei Emitteranschlüssen
EP0439652A1 (de) * 1990-01-31 1991-08-07 Siemens Aktiengesellschaft Hochfrequenz-SMD-Transistor mit zwei Emitteranschlüssen
EP0439656B1 (de) * 1990-01-31 2001-05-16 Infineon Technologies AG Chipträger für ein Mikrowellen-Halbleiterbauelement
JP3913574B2 (ja) * 2002-02-27 2007-05-09 三洋電機株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2903630A (en) * 1956-09-21 1959-09-08 Rca Corp Semiconductor devices
US2985806A (en) * 1958-12-24 1961-05-23 Philco Corp Semiconductor fabrication
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
US3264712A (en) * 1962-06-04 1966-08-09 Nippon Electric Co Semiconductor devices

Also Published As

Publication number Publication date
GB1175122A (en) 1969-12-23
NL6604965A (enExample) 1967-10-16
BE697075A (enExample) 1967-10-16
SE342359B (enExample) 1972-01-31
ES339180A0 (es) 1968-04-16
CH476396A (de) 1969-07-31
US3476990A (en) 1969-11-04
NL6604964A (enExample) 1967-10-16
BR6788579D0 (pt) 1973-12-27
DE1614236A1 (de) 1970-08-20
DK117909B (da) 1970-06-15
AT275607B (de) 1969-10-27
NL6704097A (enExample) 1968-09-19

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Legal Events

Date Code Title Description
SH Request for examination between 03.10.1968 and 22.04.1971
8239 Disposal/non-payment of the annual fee
8235 Patent refused