GB1175122A - Improvements in and relating to Semiconductor Devices - Google Patents

Improvements in and relating to Semiconductor Devices

Info

Publication number
GB1175122A
GB1175122A GB1656667A GB1656667A GB1175122A GB 1175122 A GB1175122 A GB 1175122A GB 1656667 A GB1656667 A GB 1656667A GB 1656667 A GB1656667 A GB 1656667A GB 1175122 A GB1175122 A GB 1175122A
Authority
GB
United Kingdom
Prior art keywords
pin
pins
electrode
envelope
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1656667A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1175122A publication Critical patent/GB1175122A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/43—Gaseous fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Junction Field-Effect Transistors (AREA)
GB1656667A 1966-04-14 1967-04-11 Improvements in and relating to Semiconductor Devices Expired GB1175122A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL6604965A NL6604965A (enExample) 1966-04-14 1966-04-14
NL6604964A NL6604964A (enExample) 1966-04-14 1966-04-14
NL6704097A NL6704097A (enExample) 1966-04-14 1967-03-18

Publications (1)

Publication Number Publication Date
GB1175122A true GB1175122A (en) 1969-12-23

Family

ID=27351363

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1656667A Expired GB1175122A (en) 1966-04-14 1967-04-11 Improvements in and relating to Semiconductor Devices

Country Status (11)

Country Link
US (1) US3476990A (enExample)
AT (1) AT275607B (enExample)
BE (1) BE697075A (enExample)
BR (1) BR6788579D0 (enExample)
CH (1) CH476396A (enExample)
DE (1) DE1614236B2 (enExample)
DK (1) DK117909B (enExample)
ES (1) ES339180A0 (enExample)
GB (1) GB1175122A (enExample)
NL (3) NL6604965A (enExample)
SE (1) SE342359B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2150747A (en) * 1983-12-02 1985-07-03 Philips Electronic Associated Pyroelectric infra-red radiation detector
EP0439653A1 (de) * 1990-01-31 1991-08-07 Siemens Aktiengesellschaft Hochfrequenz-SMD-Transistor mit zwei Emitteranschlüssen
EP0439652A1 (de) * 1990-01-31 1991-08-07 Siemens Aktiengesellschaft Hochfrequenz-SMD-Transistor mit zwei Emitteranschlüssen
EP0439656B1 (de) * 1990-01-31 2001-05-16 Infineon Technologies AG Chipträger für ein Mikrowellen-Halbleiterbauelement

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2250918C2 (de) * 1971-10-27 1982-02-04 Westinghouse Electric Corp., 15222 Pittsburgh, Pa. Chipträger für Mikrowellen-Leistungstransistoren und Verfahren zu seiner Herstellung
DE3106376A1 (de) * 1981-02-20 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern
JP3913574B2 (ja) * 2002-02-27 2007-05-09 三洋電機株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2903630A (en) * 1956-09-21 1959-09-08 Rca Corp Semiconductor devices
US2985806A (en) * 1958-12-24 1961-05-23 Philco Corp Semiconductor fabrication
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
US3264712A (en) * 1962-06-04 1966-08-09 Nippon Electric Co Semiconductor devices

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2150747A (en) * 1983-12-02 1985-07-03 Philips Electronic Associated Pyroelectric infra-red radiation detector
EP0145071A3 (en) * 1983-12-02 1988-08-03 Philips Electronic And Associated Industries Limited Infra-red radiation detector
EP0439653A1 (de) * 1990-01-31 1991-08-07 Siemens Aktiengesellschaft Hochfrequenz-SMD-Transistor mit zwei Emitteranschlüssen
EP0439652A1 (de) * 1990-01-31 1991-08-07 Siemens Aktiengesellschaft Hochfrequenz-SMD-Transistor mit zwei Emitteranschlüssen
US5107326A (en) * 1990-01-31 1992-04-21 Siemens Aktiengesellschaft High-frequency smd transistor having two emitter terminals
EP0439656B1 (de) * 1990-01-31 2001-05-16 Infineon Technologies AG Chipträger für ein Mikrowellen-Halbleiterbauelement

Also Published As

Publication number Publication date
NL6604965A (enExample) 1967-10-16
BE697075A (enExample) 1967-10-16
SE342359B (enExample) 1972-01-31
ES339180A0 (es) 1968-04-16
CH476396A (de) 1969-07-31
US3476990A (en) 1969-11-04
NL6604964A (enExample) 1967-10-16
BR6788579D0 (pt) 1973-12-27
DE1614236A1 (de) 1970-08-20
DE1614236B2 (de) 1977-06-08
DK117909B (da) 1970-06-15
AT275607B (de) 1969-10-27
NL6704097A (enExample) 1968-09-19

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE Patent expired