DK117909B - Halvlederapparat. - Google Patents

Halvlederapparat.

Info

Publication number
DK117909B
DK117909B DK199267A DK199267A DK117909B DK 117909 B DK117909 B DK 117909B DK 199267 A DK199267 A DK 199267A DK 199267 A DK199267 A DK 199267A DK 117909 B DK117909 B DK 117909B
Authority
DK
Denmark
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
DK199267A
Other languages
Danish (da)
English (en)
Inventor
J Eigeman
A Tuinhof
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of DK117909B publication Critical patent/DK117909B/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/43—Gaseous fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
DK199267A 1966-04-14 1967-04-11 Halvlederapparat. DK117909B (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL6604965A NL6604965A (enExample) 1966-04-14 1966-04-14
NL6604964A NL6604964A (enExample) 1966-04-14 1966-04-14
NL6704097A NL6704097A (enExample) 1966-04-14 1967-03-18

Publications (1)

Publication Number Publication Date
DK117909B true DK117909B (da) 1970-06-15

Family

ID=27351363

Family Applications (1)

Application Number Title Priority Date Filing Date
DK199267A DK117909B (da) 1966-04-14 1967-04-11 Halvlederapparat.

Country Status (11)

Country Link
US (1) US3476990A (enExample)
AT (1) AT275607B (enExample)
BE (1) BE697075A (enExample)
BR (1) BR6788579D0 (enExample)
CH (1) CH476396A (enExample)
DE (1) DE1614236B2 (enExample)
DK (1) DK117909B (enExample)
ES (1) ES339180A0 (enExample)
GB (1) GB1175122A (enExample)
NL (3) NL6604965A (enExample)
SE (1) SE342359B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2250918C2 (de) * 1971-10-27 1982-02-04 Westinghouse Electric Corp., 15222 Pittsburgh, Pa. Chipträger für Mikrowellen-Leistungstransistoren und Verfahren zu seiner Herstellung
DE3106376A1 (de) * 1981-02-20 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern
GB2150747B (en) * 1983-12-02 1987-04-23 Philips Electronic Associated Pyroelectric infra-red radiation detector
EP0439653A1 (de) * 1990-01-31 1991-08-07 Siemens Aktiengesellschaft Hochfrequenz-SMD-Transistor mit zwei Emitteranschlüssen
EP0439652A1 (de) * 1990-01-31 1991-08-07 Siemens Aktiengesellschaft Hochfrequenz-SMD-Transistor mit zwei Emitteranschlüssen
EP0439656B1 (de) * 1990-01-31 2001-05-16 Infineon Technologies AG Chipträger für ein Mikrowellen-Halbleiterbauelement
JP3913574B2 (ja) * 2002-02-27 2007-05-09 三洋電機株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2903630A (en) * 1956-09-21 1959-09-08 Rca Corp Semiconductor devices
US2985806A (en) * 1958-12-24 1961-05-23 Philco Corp Semiconductor fabrication
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
US3264712A (en) * 1962-06-04 1966-08-09 Nippon Electric Co Semiconductor devices

Also Published As

Publication number Publication date
GB1175122A (en) 1969-12-23
NL6604965A (enExample) 1967-10-16
BE697075A (enExample) 1967-10-16
SE342359B (enExample) 1972-01-31
ES339180A0 (es) 1968-04-16
CH476396A (de) 1969-07-31
US3476990A (en) 1969-11-04
NL6604964A (enExample) 1967-10-16
BR6788579D0 (pt) 1973-12-27
DE1614236A1 (de) 1970-08-20
DE1614236B2 (de) 1977-06-08
AT275607B (de) 1969-10-27
NL6704097A (enExample) 1968-09-19

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Legal Events

Date Code Title Description
PBP Patent lapsed