NL6704097A - - Google Patents

Info

Publication number
NL6704097A
NL6704097A NL6704097A NL6704097A NL6704097A NL 6704097 A NL6704097 A NL 6704097A NL 6704097 A NL6704097 A NL 6704097A NL 6704097 A NL6704097 A NL 6704097A NL 6704097 A NL6704097 A NL 6704097A
Authority
NL
Netherlands
Application number
NL6704097A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL6604964A priority Critical patent/NL6604964A/xx
Priority to NL6604965A priority patent/NL6604965A/xx
Application filed filed Critical
Priority to NL6704097A priority patent/NL6704097A/xx
Priority to GB1656667A priority patent/GB1175122A/en
Priority to CH509067A priority patent/CH476396A/de
Priority to DEN19951U priority patent/DE1964794U/de
Priority to DK199267A priority patent/DK117909B/da
Priority to DE1967N0030311 priority patent/DE1614236B2/de
Priority to AT341867A priority patent/AT275607B/de
Priority to ES339180A priority patent/ES339180A0/es
Priority to US3476990D priority patent/US3476990A/en
Priority to SE508267A priority patent/SE342359B/xx
Priority to BR18857967A priority patent/BR6788579D0/pt
Priority to FR102840A priority patent/FR1524436A/fr
Priority to BE697075D priority patent/BE697075A/xx
Publication of NL6704097A publication Critical patent/NL6704097A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/43—Gaseous fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
NL6704097A 1966-04-14 1967-03-18 NL6704097A (enExample)

Priority Applications (15)

Application Number Priority Date Filing Date Title
NL6604964A NL6604964A (enExample) 1966-04-14 1966-04-14
NL6604965A NL6604965A (enExample) 1966-04-14 1966-04-14
NL6704097A NL6704097A (enExample) 1966-04-14 1967-03-18
DE1967N0030311 DE1614236B2 (de) 1966-04-14 1967-04-11 Halbleiteranordnung
CH509067A CH476396A (de) 1966-04-14 1967-04-11 Halbleitervorrichtung und Verfahren zum Betrieb der Halbleitervorrichtung
DEN19951U DE1964794U (de) 1966-04-14 1967-04-11 Halbleitervorrichtung.
DK199267A DK117909B (da) 1966-04-14 1967-04-11 Halvlederapparat.
GB1656667A GB1175122A (en) 1966-04-14 1967-04-11 Improvements in and relating to Semiconductor Devices
AT341867A AT275607B (de) 1966-04-14 1967-04-11 Halbleitervorrichtung und Schaltung mit einer Halbleitervorrichtung
ES339180A ES339180A0 (es) 1966-04-14 1967-04-12 Un dispositivo semiconductor.
US3476990D US3476990A (en) 1966-04-14 1967-04-12 Housing and lead structure for high frequency semiconductor device operation
SE508267A SE342359B (enExample) 1966-04-14 1967-04-12
BR18857967A BR6788579D0 (pt) 1966-04-14 1967-04-13 Um dispositivo semi-condutor
FR102840A FR1524436A (fr) 1966-04-14 1967-04-14 Dispositif semi-conducteur et circuit équipé d'un tel dispositif
BE697075D BE697075A (enExample) 1966-04-14 1967-04-14

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL6604965A NL6604965A (enExample) 1966-04-14 1966-04-14
NL6604964A NL6604964A (enExample) 1966-04-14 1966-04-14
NL6704097A NL6704097A (enExample) 1966-04-14 1967-03-18

Publications (1)

Publication Number Publication Date
NL6704097A true NL6704097A (enExample) 1968-09-19

Family

ID=27351363

Family Applications (3)

Application Number Title Priority Date Filing Date
NL6604965A NL6604965A (enExample) 1966-04-14 1966-04-14
NL6604964A NL6604964A (enExample) 1966-04-14 1966-04-14
NL6704097A NL6704097A (enExample) 1966-04-14 1967-03-18

Family Applications Before (2)

Application Number Title Priority Date Filing Date
NL6604965A NL6604965A (enExample) 1966-04-14 1966-04-14
NL6604964A NL6604964A (enExample) 1966-04-14 1966-04-14

Country Status (11)

Country Link
US (1) US3476990A (enExample)
AT (1) AT275607B (enExample)
BE (1) BE697075A (enExample)
BR (1) BR6788579D0 (enExample)
CH (1) CH476396A (enExample)
DE (1) DE1614236B2 (enExample)
DK (1) DK117909B (enExample)
ES (1) ES339180A0 (enExample)
GB (1) GB1175122A (enExample)
NL (3) NL6604965A (enExample)
SE (1) SE342359B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2250918C2 (de) * 1971-10-27 1982-02-04 Westinghouse Electric Corp., 15222 Pittsburgh, Pa. Chipträger für Mikrowellen-Leistungstransistoren und Verfahren zu seiner Herstellung
DE3106376A1 (de) * 1981-02-20 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern
GB2150747B (en) * 1983-12-02 1987-04-23 Philips Electronic Associated Pyroelectric infra-red radiation detector
EP0439653A1 (de) * 1990-01-31 1991-08-07 Siemens Aktiengesellschaft Hochfrequenz-SMD-Transistor mit zwei Emitteranschlüssen
EP0439652A1 (de) * 1990-01-31 1991-08-07 Siemens Aktiengesellschaft Hochfrequenz-SMD-Transistor mit zwei Emitteranschlüssen
EP0439656B1 (de) * 1990-01-31 2001-05-16 Infineon Technologies AG Chipträger für ein Mikrowellen-Halbleiterbauelement
JP3913574B2 (ja) * 2002-02-27 2007-05-09 三洋電機株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2903630A (en) * 1956-09-21 1959-09-08 Rca Corp Semiconductor devices
US2985806A (en) * 1958-12-24 1961-05-23 Philco Corp Semiconductor fabrication
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
US3264712A (en) * 1962-06-04 1966-08-09 Nippon Electric Co Semiconductor devices

Also Published As

Publication number Publication date
GB1175122A (en) 1969-12-23
NL6604965A (enExample) 1967-10-16
BE697075A (enExample) 1967-10-16
SE342359B (enExample) 1972-01-31
ES339180A0 (es) 1968-04-16
CH476396A (de) 1969-07-31
US3476990A (en) 1969-11-04
NL6604964A (enExample) 1967-10-16
BR6788579D0 (pt) 1973-12-27
DE1614236A1 (de) 1970-08-20
DE1614236B2 (de) 1977-06-08
DK117909B (da) 1970-06-15
AT275607B (de) 1969-10-27

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