DE1571114A1 - Verfahren zum Umhuellen eines elektrischen Bauelementes - Google Patents
Verfahren zum Umhuellen eines elektrischen BauelementesInfo
- Publication number
- DE1571114A1 DE1571114A1 DE19651571114 DE1571114A DE1571114A1 DE 1571114 A1 DE1571114 A1 DE 1571114A1 DE 19651571114 DE19651571114 DE 19651571114 DE 1571114 A DE1571114 A DE 1571114A DE 1571114 A1 DE1571114 A1 DE 1571114A1
- Authority
- DE
- Germany
- Prior art keywords
- component
- substance
- current
- temperature
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 35
- 239000004065 semiconductor Substances 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 238000007598 dipping method Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000006193 liquid solution Substances 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims 2
- 239000000463 material Substances 0.000 description 6
- 239000000155 melt Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 239000007891 compressed tablet Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004848 polyfunctional curative Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000003826 tablet Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/28—Counterweights, i.e. additional weights counterbalancing inertia forces induced by the reciprocating movement of masses in the system, e.g. of pistons attached to an engine crankshaft; Attaching or mounting same
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H51/00—Levers of gearing mechanisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP0036106 | 1965-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1571114A1 true DE1571114A1 (de) | 1970-11-26 |
Family
ID=7374567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19651571114 Pending DE1571114A1 (de) | 1965-02-19 | 1965-02-19 | Verfahren zum Umhuellen eines elektrischen Bauelementes |
Country Status (5)
| Country | Link |
|---|---|
| BE (1) | BE676665A (enrdf_load_stackoverflow) |
| CH (1) | CH444317A (enrdf_load_stackoverflow) |
| DE (1) | DE1571114A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1082331A (enrdf_load_stackoverflow) |
| NL (1) | NL6601892A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113517083A (zh) * | 2015-02-25 | 2021-10-19 | 泰连公司 | 具有导电颗粒的电线 |
-
1965
- 1965-02-19 DE DE19651571114 patent/DE1571114A1/de active Pending
-
1966
- 1966-02-15 NL NL6601892A patent/NL6601892A/xx unknown
- 1966-02-16 CH CH223166A patent/CH444317A/de unknown
- 1966-02-16 GB GB678166A patent/GB1082331A/en not_active Expired
- 1966-02-17 BE BE676665D patent/BE676665A/xx unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113517083A (zh) * | 2015-02-25 | 2021-10-19 | 泰连公司 | 具有导电颗粒的电线 |
| CN113517083B (zh) * | 2015-02-25 | 2023-05-02 | 泰连公司 | 具有导电颗粒的电线 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1082331A (en) | 1967-09-06 |
| NL6601892A (enrdf_load_stackoverflow) | 1966-08-22 |
| CH444317A (de) | 1967-09-30 |
| BE676665A (enrdf_load_stackoverflow) | 1966-08-17 |
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