DE2728487C2 - - Google Patents

Info

Publication number
DE2728487C2
DE2728487C2 DE2728487A DE2728487A DE2728487C2 DE 2728487 C2 DE2728487 C2 DE 2728487C2 DE 2728487 A DE2728487 A DE 2728487A DE 2728487 A DE2728487 A DE 2728487A DE 2728487 C2 DE2728487 C2 DE 2728487C2
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2728487A
Other versions
DE2728487A1 (de
Inventor
Peter 7530 Pforzheim De Hofsaess
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19772728487 priority Critical patent/DE2728487A1/de
Publication of DE2728487A1 publication Critical patent/DE2728487A1/de
Application granted granted Critical
Publication of DE2728487C2 publication Critical patent/DE2728487C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/62—Insulating-layers or insulating-films on metal bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE19772728487 1977-06-24 1977-06-24 Verfahren zum ummanteln von bauelementen mit isolierstoff und nach diesem verfahren ummantelte bauelemente Granted DE2728487A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19772728487 DE2728487A1 (de) 1977-06-24 1977-06-24 Verfahren zum ummanteln von bauelementen mit isolierstoff und nach diesem verfahren ummantelte bauelemente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772728487 DE2728487A1 (de) 1977-06-24 1977-06-24 Verfahren zum ummanteln von bauelementen mit isolierstoff und nach diesem verfahren ummantelte bauelemente

Publications (2)

Publication Number Publication Date
DE2728487A1 DE2728487A1 (de) 1979-01-04
DE2728487C2 true DE2728487C2 (de) 1987-04-23

Family

ID=6012268

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772728487 Granted DE2728487A1 (de) 1977-06-24 1977-06-24 Verfahren zum ummanteln von bauelementen mit isolierstoff und nach diesem verfahren ummantelte bauelemente

Country Status (1)

Country Link
DE (1) DE2728487A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4236320C2 (de) * 1992-10-28 1998-07-16 Hella Kg Hueck & Co Gehäuse für ein elektrisches Gerät

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7333932U (de) * 1973-09-19 1974-03-07 Thermik Geraetebau Gmbh Bimetallschalter mit Kunststoff-Isolierung
US4001655A (en) * 1974-01-10 1977-01-04 P. R. Mallory & Co., Inc. Compressible intermediate layer for encapsulated electrical devices

Also Published As

Publication number Publication date
DE2728487A1 (de) 1979-01-04

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8125 Change of the main classification

Ipc: H01B 19/04

D2 Grant after examination
8364 No opposition during term of opposition