DE1279241B - Verwendung einer ganz oder teilweise durch Blei oder Zinn ersetzten Kupferschicht ineiner Kryotronanordnung - Google Patents

Verwendung einer ganz oder teilweise durch Blei oder Zinn ersetzten Kupferschicht ineiner Kryotronanordnung

Info

Publication number
DE1279241B
DE1279241B DEN24166A DEN0024166A DE1279241B DE 1279241 B DE1279241 B DE 1279241B DE N24166 A DEN24166 A DE N24166A DE N0024166 A DEN0024166 A DE N0024166A DE 1279241 B DE1279241 B DE 1279241B
Authority
DE
Germany
Prior art keywords
layer
mol
pattern
copper
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DEN24166A
Other languages
German (de)
English (en)
Inventor
Jean Francois Marchand
Cornelis Van De Stolpe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE1279241B publication Critical patent/DE1279241B/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00Superconducting devices
    • H10N60/01Manufacture or treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54Contact plating, i.e. electroless electrochemical plating
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03CPHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00Photographic processes or agents therefor; Regeneration of such processing agents
    • G03C5/58Processes for obtaining metallic images by vapour deposition or physical development
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/44Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using super-conductive elements, e.g. cryotron
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00Superconducting devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00Superconductor technology: apparatus, material, process
    • Y10S505/80Material per se process of making same
    • Y10S505/815Process of making per se
    • Y10S505/818Coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
DEN24166A 1962-12-21 1963-12-17 Verwendung einer ganz oder teilweise durch Blei oder Zinn ersetzten Kupferschicht ineiner Kryotronanordnung Pending DE1279241B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL287163 1962-12-21

Publications (1)

Publication Number Publication Date
DE1279241B true DE1279241B (de) 1968-10-03

Family

ID=19754306

Family Applications (1)

Application Number Title Priority Date Filing Date
DEN24166A Pending DE1279241B (de) 1962-12-21 1963-12-17 Verwendung einer ganz oder teilweise durch Blei oder Zinn ersetzten Kupferschicht ineiner Kryotronanordnung

Country Status (7)

Country Link
US (1) US3342631A (en:Method)
BE (1) BE641643A (en:Method)
CH (1) CH446850A (en:Method)
DE (1) DE1279241B (en:Method)
DK (1) DK107759C (en:Method)
GB (1) GB994740A (en:Method)
NL (1) NL287163A (en:Method)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2159510A (en) * 1937-04-05 1939-05-23 Battelle Memorial Institute Method of coating copper or its alloys with tin
US2230602A (en) * 1938-03-31 1941-02-04 Battelle Memorial Institute Method of coating metals with lead

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3072499A (en) * 1960-12-29 1963-01-08 Texaco Inc Method of coating tin on copper surfaces

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2159510A (en) * 1937-04-05 1939-05-23 Battelle Memorial Institute Method of coating copper or its alloys with tin
US2230602A (en) * 1938-03-31 1941-02-04 Battelle Memorial Institute Method of coating metals with lead

Also Published As

Publication number Publication date
BE641643A (en:Method) 1964-06-22
GB994740A (en) 1965-06-10
US3342631A (en) 1967-09-19
CH446850A (de) 1967-11-15
NL287163A (en:Method)
DK107759C (da) 1967-07-03

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