DE1253850B - Increasing the thermal conductivity of electrically insulating fluids by adding solids - Google Patents

Increasing the thermal conductivity of electrically insulating fluids by adding solids

Info

Publication number
DE1253850B
DE1253850B DE1962S0080667 DES0080667A DE1253850B DE 1253850 B DE1253850 B DE 1253850B DE 1962S0080667 DE1962S0080667 DE 1962S0080667 DE S0080667 A DES0080667 A DE S0080667A DE 1253850 B DE1253850 B DE 1253850B
Authority
DE
Germany
Prior art keywords
magnesium oxide
electrically insulating
thermal conductivity
increasing
insulating fluids
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE1962S0080667
Other languages
German (de)
Inventor
Dipl-Chem Georg Rosenberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL295718D priority Critical patent/NL295718A/xx
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE1962S0092514 priority patent/DE1277972B/en
Priority to DE1962S0080667 priority patent/DE1253850B/en
Priority to CH772263A priority patent/CH423996A/en
Priority to FR941122A priority patent/FR1362938A/en
Priority to NL295718A priority patent/NL143731B/en
Priority to GB2972263A priority patent/GB990841A/en
Publication of DE1253850B publication Critical patent/DE1253850B/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/20—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances liquids, e.g. oils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Insulating Materials (AREA)
  • Organic Insulating Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)

Description

Erhöhung der Wärmeleitfähigkeit von elektrisch isolierenden Flüssigkeiten durch Zugabe von Festkörpern Da die Belastbarkeit elektrischer Bauelemente und Schaltanordnungen, vorzugsweise von Halbleiterbauelementen, wegen der während des Betriebes auftretenden unerwünschten Erwärmung durch die Wärmeableitungsmöglichkeit bestimmt wird, geht das Bestreben in der elektrotechnischen Industrie dahin, ein möglichst gut wärmeleitendes, elektrisch isolierendes Mittel zu finden, das die im Bauelement entstehende Wärme weitgehend der Gehäusewand zuführt. Es ist bereits bekannt, zu diesem Zweck Suspensionen von Festkörpern in elektrisch isolierenden Flüssigkeiten zu verwenden. Vor allem wird eine Suspension von Aluminiumoxid in Silikonöl gebraucht, doch werden hierbei keine befriedigenden Ergebnisse erzielt.Increasing the thermal conductivity of electrically insulating liquids by adding solids Since the resilience of electrical components and switching arrangements, preferably of semiconductor components, because of the occurring during operation unwanted heating is determined by the heat dissipation possibility, goes the endeavor in the electrotechnical industry to create a thermally conductive, to find an electrically insulating agent that absorbs the heat generated in the component largely feeds the housing wall. It is already known to use suspensions for this purpose of solids in electrically insulating liquids. Above all a suspension of aluminum oxide in silicone oil is needed, but here did not achieve satisfactory results.

Es wurde nun gefunden, daß die Wärmeleitfähigkeit von elektrisch isolierenden Flüssigkeiten, vorzugsweise Silikonöl und/oder Paraffinöl, beträchtlich erhöht wird, wenn man Festkörper in den Flüssigkeiten, die gegebenenfalls noch weitere Zusätze enthalten, suspendiert, wobei erfindungsgemäß als Festkörper Magnesiumoxid hoher Dichte verwendet wird. It has now been found that the thermal conductivity of electrical insulating liquids, preferably silicone oil and / or paraffin oil, considerably is increased if one solids in the liquids, which possibly still further Containing additives, suspended, according to the invention being magnesium oxide as the solid high density is used.

Zweckmäßig ist es, die Öle vorher zu reinigen, beispielsweise müssen solche Verunreinigungen, die auf die Halbleiteroberfläche störend wirken, entfernt werden, insbesondere Feuchtigkeit. It is useful to clean the oils beforehand, for example must such impurities, which have a disruptive effect on the semiconductor surface, are removed especially moisture.

Das Magnesiumoxid wird vorzugsweise in gesinterter Form verwendet, hauptsächlich in einer Korngröße zwischen 20 und 100tun; aber auch kristallines Magnesiumoxid dieser Korngrößen oder auch ein Gemisch dieser Formen des Magnesiumoxids kann verwendet werden. The magnesium oxide is preferably used in sintered form, mainly in a grain size between 20 and 100 tun; but also crystalline Magnesium oxide of these grain sizes or a mixture of these forms of magnesium oxide can be used.

Die Suspension soll eine pastenartige Konsistenz bei entsprechend hohem Magnesiumoxidgehalt aufweisen, da der Wärmewiderstand der Suspension weitgehend durch die Viskosität der Suspension bestimmt wird. Zugleich zeigt die Suspension in diesem Fall eine sehr hoheDämpfungswirkung für mechanische Schwingungen. Die Konzentration des Magnesiumoxids in der Suspension soll größer als 20°lo sein, die Korngröße soll zwischen 1 und 100 Fm liegen. The suspension should have a paste-like consistency when appropriately have a high magnesium oxide content, since the thermal resistance of the suspension is largely is determined by the viscosity of the suspension. At the same time shows the suspension in this case a very high damping effect for mechanical vibrations. the Concentration of magnesium oxide in the suspension should be greater than 20 ° lo, the The grain size should be between 1 and 100 μm.

Zum Vergleich seien die Wärmewiderstandswerte von elektrischen Bauelementen angegeben, die bei Verwendung einer Suspension von Aluminiumoxid in Silikonöl bzw. der erfindungsgemäßen Suspension von gesintertem Magnesiumoxid in Silikonöl bei gleichen geometrischen Eigenschaften der elektrischen Bauelemente gemessen wurden: Rth ("C/W) Aluminiumoxid in Silikonöl .......... 160 gesintertes Magnesiumoxid in Silikonöl 40 Auch andere übliche Stoffe zur Verbesserung der elektrischen Eigenschaften der Bauelemente, z. B. For comparison, let the thermal resistance values of electrical components be used indicated that when using a suspension of aluminum oxide in silicone oil or the suspension of sintered magnesium oxide in silicone oil according to the invention same geometric properties of the electrical components were measured: Rth ("C / W) Alumina in silicone oil .......... 160 sintered magnesia in silicone oil 40 Other common substances used to improve the electrical properties of the Components, e.g. B.

Stabilitätserhöher oder Trockenmittel oder Stoffe mit erwünschter Wasserdampftension, können beigemischt werden.Stability enhancers or desiccants or substances with desired Water vapor tension can be added.

Claims (4)

Patentansprüche: 1. Verfahren zur Erhöhung der Wärmeleitfähigkeit von elektrisch isolierenden Flüssigkeiten, vorzugsweise Silikonöl und/oder Paraffinöl, durch Suspendieren von Festkörpern in den Flüssigkeiten, denen gegebenenfalls weitere Zusätze beigegeben werden, dadurch gekennzeichnet, daß als Festkörper Magnesiumoxid hoher Dichte verwendet wird. Claims: 1. Method for increasing the thermal conductivity of electrically insulating liquids, preferably silicone oil and / or paraffin oil, by suspending solids in the liquids, which may be further Additives are added, characterized in that magnesium oxide is the solid high density is used. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß gesintertes Magnesiumoxid verwendet wird. 2. The method according to claim 1, characterized in that sintered Magnesium oxide is used. 3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß ein durch Sublimation kristallisiertes Magnesiumoxid verwendet wird. 3. The method according to claim 1, characterized in that a through Sublimation crystallized magnesium oxide is used. 4. Verfahren nach wenigstens einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß Magnesiumoxid in einer Korngröße zwischen 1 und 100 um, vorzugsweise zwischen 20 und 100 um, verwendet wird. 4. The method according to at least one of claims 1 to 3, characterized characterized in that magnesium oxide in a grain size between 1 and 100 µm, preferably between 20 and 100 µm.
DE1962S0080667 1962-07-31 1962-07-31 Increasing the thermal conductivity of electrically insulating fluids by adding solids Pending DE1253850B (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL295718D NL295718A (en) 1962-07-31
DE1962S0092514 DE1277972B (en) 1962-07-31 1962-07-31 Electrical component or component group, preferably semiconductor component
DE1962S0080667 DE1253850B (en) 1962-07-31 1962-07-31 Increasing the thermal conductivity of electrically insulating fluids by adding solids
CH772263A CH423996A (en) 1962-07-31 1963-06-21 Process for the production of electrical components and application of this process for the production of semiconductor components
FR941122A FR1362938A (en) 1962-07-31 1963-07-11 Method of manufacturing electrical components, in particular semiconductor components
NL295718A NL143731B (en) 1962-07-31 1963-07-24 PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR ELEMENTS, AS WELL AS THE SEMICONDUCTOR LEMENTS OBTAINED HEREIN.
GB2972263A GB990841A (en) 1962-07-31 1963-07-26 Improvements in or relating to electrical components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1962S0092514 DE1277972B (en) 1962-07-31 1962-07-31 Electrical component or component group, preferably semiconductor component
DE1962S0080667 DE1253850B (en) 1962-07-31 1962-07-31 Increasing the thermal conductivity of electrically insulating fluids by adding solids

Publications (1)

Publication Number Publication Date
DE1253850B true DE1253850B (en) 1967-11-09

Family

ID=25996940

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1962S0092514 Pending DE1277972B (en) 1962-07-31 1962-07-31 Electrical component or component group, preferably semiconductor component
DE1962S0080667 Pending DE1253850B (en) 1962-07-31 1962-07-31 Increasing the thermal conductivity of electrically insulating fluids by adding solids

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE1962S0092514 Pending DE1277972B (en) 1962-07-31 1962-07-31 Electrical component or component group, preferably semiconductor component

Country Status (4)

Country Link
CH (1) CH423996A (en)
DE (2) DE1277972B (en)
GB (1) GB990841A (en)
NL (2) NL143731B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2475568A1 (en) * 1980-02-13 1981-08-14 Rhone Poulenc Ind Compsns. for thermal energy storage - comprising specified combinations of rocks and heat-transfer fluids
JP2569003B2 (en) * 1986-03-20 1997-01-08 株式会社日立製作所 Heat conduction device
DE102007043886A1 (en) * 2007-09-14 2009-04-09 Continental Automotive Gmbh Electrical device for use in high-vibration environments and attenuator

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1000891B (en) * 1952-09-13 1957-01-17 Patra Patent Treuhand High-temperature-resistant synthetic resin molding compound

Also Published As

Publication number Publication date
NL295718A (en)
CH423996A (en) 1966-11-15
NL143731B (en) 1974-10-15
DE1277972B (en) 1968-09-19
GB990841A (en) 1965-05-05

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