DE1000891B - High-temperature-resistant synthetic resin molding compound - Google Patents

High-temperature-resistant synthetic resin molding compound

Info

Publication number
DE1000891B
DE1000891B DE1952P0008348 DEP0008348A DE1000891B DE 1000891 B DE1000891 B DE 1000891B DE 1952P0008348 DE1952P0008348 DE 1952P0008348 DE P0008348 A DEP0008348 A DE P0008348A DE 1000891 B DE1000891 B DE 1000891B
Authority
DE
Germany
Prior art keywords
synthetic resin
molding compound
resin molding
temperature
resistant synthetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE1952P0008348
Other languages
German (de)
Inventor
Dr Ottokar Sorge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH filed Critical Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH
Priority to DE1952P0008348 priority Critical patent/DE1000891B/en
Publication of DE1000891B publication Critical patent/DE1000891B/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/10Silicon-containing compounds
    • C08K7/12Asbestos
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002Inhomogeneous material in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Description

Hochtemperaturbeständige Kunstharzpreßmasse Die bekannten, durch Druck und Hitze härtbaren Kunstharzpreßmassen besitzen im günstigsten Falle eine Temperaturbeständigkeit von 150 bis 2000, je nach den verwendeten Ausgangskunstharzen und den Füllstoffen. Häufig sollen Kunstharzpreßmassen aber höheren Temperaturen ausgesetzt werden, so für elektrische Isolierteile, insbesondere aber bei den mit elektrischen Lampen in Verbindung stehenden Sockeln und Fassungen.High-temperature-resistant synthetic resin molding compound The known, by pressure and heat-curable synthetic resin molding compounds have, in the most favorable case, temperature resistance from 150 to 2000, depending on the starting resins and fillers used. However, synthetic resin molding compounds are often to be exposed to higher temperatures, see above for electrical insulating parts, but especially for those with electrical lamps related bases and sockets.

Es ist bekannt, daß die Temperaturbeständigkeit in hohem Maße von dem Anteil des Kunstharzes im Gesamtgewicht abhängt. Während die normalen Preßmassen einen Kunstharzanteil von etwa 40 bis 50°/o enthalten, ist bereits eine Preßmasse bekanntgeworden, die aus Asbestmehl, Gleitmittel und weniger als 25 0/c Phenolformaldehydkondensationsprodukte besteht. It is known that the temperature resistance to a large extent of depends on the proportion of synthetic resin in the total weight. While the normal molding compounds contain a synthetic resin content of about 40 to 50%, is already a molding compound has become known that consists of asbestos flour, lubricants and less than 25 0 / c phenol-formaldehyde condensation products consists.

Es wurde nun erkannt, daß Kunstharzpreßmassen, bestehend aus höchstens 250/0 des Gesamtgewichts an Phenolformaldehydkondensationsprodukten sowie einem Härtungsmittel, einem Gleitmittel und 60 bis 80°/o ausschließlich anorganischen Füllstoffen, neben hoher Temperaturbeständigkeit noch besonders gW1-stige Verarbeitungseigenschaften aufweisen, wenn erfindungsgemäß die Füllstoffe aus 20 bis 40 r!!o Braunstein, 5 bis 15°/o Kaolin, 10 bis 40Q/o Magnesiumoxyd und 5 bis 20°/o Asbest bestehen. Der technische Vorteil durch den Zusatz von mehreren anorganischen Füllstoffen liegt darin, daß durch die Variation ihrer Anteile die Wärmeleitfähigkeit and der Ausdehnungskoeffizient in gewissen Grenzen beeinflußt werden, da die physikalischen Eigenschaften der einzelnen Füllstoffe voneinander verschieden sind. It has now been recognized that synthetic resin molding compounds consisting of at most 250/0 of the total weight of phenol-formaldehyde condensation products and one Hardening agent, a lubricant and 60 to 80% exclusively inorganic Fillers, in addition to high temperature resistance, particularly good processing properties if, according to the invention, the fillers consist of 20 to 40% manganese dioxide, 5 up to 15% kaolin, 10 to 40% magnesium oxide and 5 to 20% asbestos. Of the technical advantage lies in the addition of several inorganic fillers in that by varying their proportions, the thermal conductivity and the coefficient of expansion can be influenced within certain limits, as the physical properties of the individual Fillers are different from each other.

Es gelingt so, die temperaturbeständigen Preßmassen dem jeweiligen Verwendungszweck anzupassen.It is thus possible to apply the temperature-resistant molding compounds to the respective To adapt the intended use.

Als Kondensationsmittel in dieser Preßmasse kann das üblich verwandte Hexamethylentetramin dienen und als Gleitmittel in bekannter Weise ein Fett oder eine Fettsäure, beispielsweise Stearinsäure oder Palmitinsäure. The commonly used condensation agent in this molding compound can be used Hexamethylenetetramine serve and as a lubricant in a known manner a fat or a fatty acid such as stearic acid or palmitic acid.

Von den Füllstoffen haben der Braunstein und das Magnesiumoxyd die Eigenschaft, chemisch auf das Kunstharz einzuwirken, und üben einen wesentlichen Einfluß auf die Abbindezeit und Temperaturbeständigkeit aus. Der Zusatz von geringen Mengen von Metalloxyden in der Größenordnung von 1 0/o ist übrigens bekannt. Of the fillers, the manganese dioxide and magnesium oxide have the Property of chemically acting on the synthetic resin and exercise an essential Influence on the setting time and temperature resistance. The addition of minor Incidentally, quantities of metal oxides of the order of magnitude of 10 / o are known.

Der Braunstein dient zusätzlich noch als Färbemittel, so daß es nicht erforderlich ist, organische Färbstoffe zur Anwendung zu bringen, die, wie festgestellt wurde, die Temperaturbeständigkeit schädlich beeinflussen. Die übrigen Füllstoffe dienen lediglich in bekannter Weise als Harzträger. The brownstone also serves as a coloring agent, so it doesn't is required to bring organic dyes to the application, as stated have a detrimental effect on the temperature resistance. The remaining fillers only serve as a resin carrier in a known manner.

Zweckmäßige Preßmassen nach der Erfindung setzen sich wie folgt zusammen: 20 bis 250/o, vorzugsweise 20°/o Novolak oder ein entsprechendes Kunstharz, 2 bis 40/c, vorzugsweise 3 0/o Hexamethylentetramin, 2 bis 50/o, vorzugsweise 40/o Stearinsäure, 20 bis 400/o, vorzugsweise 29°/o Braunstein, 5 bis 150/0, vorzugsweise 74/o Kaolin, 20 bis 40Q/o, vorzugsweise 21 0/o Magnesiumoxyd, 5 bis 200/o, vorzugsweise 16°/o Asbest. Appropriate molding compounds according to the invention are composed as follows: 20 to 250 / o, preferably 20% novolak or a corresponding synthetic resin, 2 to 40 / c, preferably 3 0 / o hexamethylenetetramine, 2 to 50 / o, preferably 40 / o stearic acid, 20 to 400 / o, preferably 29% brownstone, 5 to 150/0, preferably 74 / o kaolin, 20 to 40%, preferably 21%, magnesium oxide, 5 to 200%, preferably 16% Asbestos.

Zur Herstellung einer Kunstharzpreßmasse nach der Erfindung werden die pulverisierten Bestandteile während ihrer zweckmäßig auf etwa 2 bis 4 Stunden ausgedehnten Mischung z. B. in einer rotierenden Trommel auf eine Temperatur von 90 bis 1200 erhitzt. Die Preßmasse ist nicht schwieriger zu verarbeiten als andere bekannte Massen geringerer Temperaturbeständigkeit. Die zweckmäßige Verarbeitungstemperatur beträgt 2000, wobei der Druck etwa 70 kg/cm2 und die Preßzeit etwa 60 bis 80 Sekunden beträgt. Sockel oder Sockelteile elektrischer Glüh- und Entladungslampen aus dieser Kunstharzpreßmasse vertragen ohne Schaden Temperaturen von 250 bis 3000, so daß beim Erhitzen der Sockel bis auf diese Temperaturen eine Verformung oder ein Blasigwerden der Preßteile nicht auftritt. Die verhältnismäßig gute Wärmeleitfähigkeit der Preßmasse infolge geeignet ausgewählter Füllstoffe macht sich bei dieser Anwendung besonders vorteilhaft bemerkbar, wenn die Sockel an die Lampengefäße angekittet werden sollen. Es können daher Sockel aus der neuen Kunstharzpreßmasse ohne jegliche Metalleinlagen verwendet werden, da die Wärmeübertragung bei der Kitthärtung allein durch die Preßmasse erfolgt. For the production of a synthetic resin molding compound according to the invention the powdered ingredients during their expedient to about 2 to 4 hours extensive mixture z. B. in a rotating drum to a temperature of 90 to 1200 heated. The molding compound is no more difficult to process than others known masses of lower temperature resistance. The appropriate processing temperature is 2000, the pressure about 70 kg / cm2 and the pressing time about 60 to 80 seconds amounts to. Base or base parts of electric incandescent and discharge lamps made from this Synthetic resin molding compound can withstand temperatures of 250 to 3000 without damage, so that deformation or blistering when the base is heated to these temperatures the pressed parts does not occur. The relatively good thermal conductivity of the molding compound due to suitably selected fillers, it makes this application special advantageously noticeable when the base is to be cemented to the lamp vessels. It can therefore base from the new synthetic resin molding compound without any metal inserts can be used because the heat transfer during cement hardening is solely through the molding compound he follows.

Claims (1)

PATENTANSPRUCH: Hochtemperaturbeständige Kunstharzpreßmasse für elektrische Isolierteile, wie Sockel oder Sockelteile elektrischer Glüh- oder Entladungslampen, bestehend aus höchstens 25 0/o des Gesamtgewichts an Phenolformaldehydkondensationsprodukten sowie einem Härtungsmittel, einem Gleitmittel und zu 60 bis 80 0/o ausschließlich anorganischen Füllstoffen, dadurch gekennzeichnet, daß diese anorganischen Füllstoffe aus 20 bis 40ovo Braunstein, 5 bis lS0/o Kaolin, 10 bis 4O0/o Magnesiumoxyd und 5 bis 20% Asbest bestehen. PATENT CLAIM: High temperature-resistant synthetic resin molding compound for electrical Insulating parts, such as bases or base parts of electric incandescent or discharge lamps, consisting of a maximum of 25% of the total weight of phenol-formaldehyde condensation products as well as a hardening agent, a lubricant and 60 to 80% exclusively inorganic fillers, characterized in that these inorganic fillers from 20 to 40ovo manganese dioxide, 5 to 15% kaolin, 10 to 40% magnesium oxide and 5 up to 20% asbestos. In Betracht gezogene Druckschriften: USA.-Patentschrift Nr. 1 645 693; deutsche Patentschriften Nr. 703 641, 813 771; Auszüge deutscher Patentanmeldungen Bd. III, Chemie, Vol. 8, unter 39 b K 147592 IV c und L 111256 IVc. References considered: U.S. Patent No. 1,645 693; German Patent Nos. 703 641, 813 771; Excerpts from German patent applications Vol. III, Chemie, Vol. 8, under 39 b K 147592 IV c and L 111256 IVc.
DE1952P0008348 1952-09-13 1952-09-13 High-temperature-resistant synthetic resin molding compound Pending DE1000891B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1952P0008348 DE1000891B (en) 1952-09-13 1952-09-13 High-temperature-resistant synthetic resin molding compound

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1952P0008348 DE1000891B (en) 1952-09-13 1952-09-13 High-temperature-resistant synthetic resin molding compound

Publications (1)

Publication Number Publication Date
DE1000891B true DE1000891B (en) 1957-01-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
DE (1) DE1000891B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1213500B (en) * 1961-09-28 1966-03-31 Philips Patentverwaltung Heat well conductive insulating film with filler
DE1239750B (en) * 1960-07-16 1967-05-03 Sueddeutsche Isolatorenwerke G Molding compound for the production of electrical insulation bodies that are resistant to tracking
DE1277972B (en) * 1962-07-31 1968-09-19 Siemens Ag Electrical component or component group, preferably semiconductor component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1645693A (en) * 1923-04-19 1927-10-18 Ellis Carleton Cold molding composition containing orthocresol-aldehyde resin binder and process of making same
DE703641C (en) * 1937-06-17 1941-03-13 I G Farbenindustrie Akt Ges Process for the production of molding compounds from hardenable phenolic resins and fillers
DE813771C (en) * 1948-10-02 1951-09-17 Basf Ag Process for the production of molded bodies, in particular building boards

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1645693A (en) * 1923-04-19 1927-10-18 Ellis Carleton Cold molding composition containing orthocresol-aldehyde resin binder and process of making same
DE703641C (en) * 1937-06-17 1941-03-13 I G Farbenindustrie Akt Ges Process for the production of molding compounds from hardenable phenolic resins and fillers
DE813771C (en) * 1948-10-02 1951-09-17 Basf Ag Process for the production of molded bodies, in particular building boards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1239750B (en) * 1960-07-16 1967-05-03 Sueddeutsche Isolatorenwerke G Molding compound for the production of electrical insulation bodies that are resistant to tracking
DE1213500B (en) * 1961-09-28 1966-03-31 Philips Patentverwaltung Heat well conductive insulating film with filler
DE1277972B (en) * 1962-07-31 1968-09-19 Siemens Ag Electrical component or component group, preferably semiconductor component

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