GB990841A - Improvements in or relating to electrical components - Google Patents
Improvements in or relating to electrical componentsInfo
- Publication number
- GB990841A GB990841A GB2972263A GB2972263A GB990841A GB 990841 A GB990841 A GB 990841A GB 2972263 A GB2972263 A GB 2972263A GB 2972263 A GB2972263 A GB 2972263A GB 990841 A GB990841 A GB 990841A
- Authority
- GB
- United Kingdom
- Prior art keywords
- magnesium oxide
- suspension
- casing
- electrical components
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000395 magnesium oxide Substances 0.000 abstract 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 abstract 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 abstract 4
- 239000000725 suspension Substances 0.000 abstract 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 abstract 2
- RGCKGOZRHPZPFP-UHFFFAOYSA-N alizarin Chemical compound C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 abstract 2
- 239000011575 calcium Substances 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000005662 Paraffin oil Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- WNHUAWNEKMITEW-UHFFFAOYSA-N anthrapurpurin Chemical compound C1=C(O)C(O)=C2C(=O)C3=CC(O)=CC=C3C(=O)C2=C1 WNHUAWNEKMITEW-UHFFFAOYSA-N 0.000 abstract 1
- 229910052810 boron oxide Inorganic materials 0.000 abstract 1
- 229910052791 calcium Inorganic materials 0.000 abstract 1
- 235000012215 calcium aluminium silicate Nutrition 0.000 abstract 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 239000003921 oil Substances 0.000 abstract 1
- 235000011837 pasties Nutrition 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 238000001953 recrystallisation Methods 0.000 abstract 1
- 239000000741 silica gel Substances 0.000 abstract 1
- 229910002027 silica gel Inorganic materials 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 235000012217 sodium aluminium silicate Nutrition 0.000 abstract 1
- 230000000087 stabilizing effect Effects 0.000 abstract 1
- 238000000859 sublimation Methods 0.000 abstract 1
- 230000008022 sublimation Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/20—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances liquids, e.g. oils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Insulating Materials (AREA)
- Silicates, Zeolites, And Molecular Sieves (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
990,841. Cooling electrical components. SIEMENS & HALSKE A.G. July 26, 1963 [July 31, 1962], No. 29722/63. Heading F4U. [Also in Division H1] Unwanted heat arising during the operation of electrical components such as capacitors, resistances and semi-conductor components, e.g. transistors and diodes, housed within an outer protective casing is conveyed to the casing by an electrically-insulating, heat conducting medium which fills the interspace or interspaces between the component and the inner wall of the casing, the medium comprising a suspension of powdered, high density magnesium oxide in an electrically insulating liquid. The magnesium oxide which is prepared from voluminous magnesium oxide powder by sintering, by melting and recrystallization or by sublimation, is in a compact, mostly coarsely crystalline form of grain size preferably in the range 20 to 100 Ám. The liquid is preferably silicon oil and/or paraffin oil, the suspension preferably being of pasty consistency, although a suspension of 20% magnesium oxide is effective. To enhance the stability of the components siccatives such as calcium or boron oxide, calcium or sodium aluminium silicates or silica gel may be added whilst, when the component consists of or includes a semiconductor material, small amounts of substances having a stabilizing action on the material surface such as quinonoid or ketonoid ring compounds having an -OH group in the 2-position to the CO group, e.g. alizarin or 1,2,7- trihydroxyanthraquinone, may also be added.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1962S0092514 DE1277972B (en) | 1962-07-31 | 1962-07-31 | Electrical component or component group, preferably semiconductor component |
| DE1962S0080667 DE1253850B (en) | 1962-07-31 | 1962-07-31 | Increasing the thermal conductivity of electrically insulating fluids by adding solids |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB990841A true GB990841A (en) | 1965-05-05 |
Family
ID=25996940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2972263A Expired GB990841A (en) | 1962-07-31 | 1963-07-26 | Improvements in or relating to electrical components |
Country Status (4)
| Country | Link |
|---|---|
| CH (1) | CH423996A (en) |
| DE (2) | DE1253850B (en) |
| GB (1) | GB990841A (en) |
| NL (2) | NL143731B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2475568A1 (en) * | 1980-02-13 | 1981-08-14 | Rhone Poulenc Ind | Compsns. for thermal energy storage - comprising specified combinations of rocks and heat-transfer fluids |
| EP0237741A2 (en) * | 1986-03-20 | 1987-09-23 | Hitachi, Ltd. | Thermal conduction device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007043886A1 (en) * | 2007-09-14 | 2009-04-09 | Continental Automotive Gmbh | Electrical device for use in high-vibration environments and attenuator |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1000891B (en) * | 1952-09-13 | 1957-01-17 | Patra Patent Treuhand | High-temperature-resistant synthetic resin molding compound |
-
0
- NL NL295718D patent/NL295718A/xx unknown
-
1962
- 1962-07-31 DE DE1962S0080667 patent/DE1253850B/en active Pending
- 1962-07-31 DE DE1962S0092514 patent/DE1277972B/en active Pending
-
1963
- 1963-06-21 CH CH772263A patent/CH423996A/en unknown
- 1963-07-24 NL NL295718A patent/NL143731B/en unknown
- 1963-07-26 GB GB2972263A patent/GB990841A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2475568A1 (en) * | 1980-02-13 | 1981-08-14 | Rhone Poulenc Ind | Compsns. for thermal energy storage - comprising specified combinations of rocks and heat-transfer fluids |
| EP0237741A2 (en) * | 1986-03-20 | 1987-09-23 | Hitachi, Ltd. | Thermal conduction device |
| EP0237741A3 (en) * | 1986-03-20 | 1987-12-02 | Hitachi, Ltd. | Thermal conduction device |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1253850B (en) | 1967-11-09 |
| CH423996A (en) | 1966-11-15 |
| NL143731B (en) | 1974-10-15 |
| NL295718A (en) | |
| DE1277972B (en) | 1968-09-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3364203D1 (en) | Ceramic substrate | |
| JPS57181356A (en) | Sintered aluminum nitride body with high heat conductivity | |
| US2902633A (en) | Housing containing electrical crystal surrounded by siloxane resin-calcium chloride composition | |
| US3508968A (en) | Thermoelectric device | |
| GB990841A (en) | Improvements in or relating to electrical components | |
| GB862453A (en) | Improvements in or relating to semi-conductor devices | |
| US3590327A (en) | System for maintaining uniform temperature conditions throughout a body | |
| GB1011170A (en) | Improved temperature responsive resistance device | |
| GB957316A (en) | Semiconductor devices | |
| US2903629A (en) | Encapsulated semiconductor assembly | |
| US3158471A (en) | Gold alloy solder for semiconductor devices | |
| JPS6135542A (en) | Regin sealed semiconductor device | |
| JPS5440569A (en) | Semiconductor device and its manufacture | |
| US3284678A (en) | Semiconductor encapsulating and reinforcing materials utilizing boron nitride | |
| GB1516709A (en) | Fusible transcalent electrical device | |
| JPS59116357A (en) | Metal having low melting point | |
| GB1200372A (en) | Thermo-electric generator | |
| US3241217A (en) | Desiccation of electronic enclosures using boron nitride hot sealing method | |
| GB1278366A (en) | Ceramic-to-metal conductive glass sealing compositions | |
| GB873916A (en) | Improvements relating to hermetically sealed semi-conductor devices | |
| SU454269A1 (en) | Copper based alloy | |
| JPS5438771A (en) | Cooling fin | |
| SU181815A1 (en) | ||
| JPS5640609A (en) | Cataplasm containing phellodendri cortex | |
| GB936516A (en) | Semi-conductor devices |