GB873916A - Improvements relating to hermetically sealed semi-conductor devices - Google Patents

Improvements relating to hermetically sealed semi-conductor devices

Info

Publication number
GB873916A
GB873916A GB2372458A GB2372458A GB873916A GB 873916 A GB873916 A GB 873916A GB 2372458 A GB2372458 A GB 2372458A GB 2372458 A GB2372458 A GB 2372458A GB 873916 A GB873916 A GB 873916A
Authority
GB
United Kingdom
Prior art keywords
composition
envelope
july
conductor devices
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2372458A
Inventor
Norman Joseph Crocker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Associated Electrical Industries Ltd
Original Assignee
Associated Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR1205359D priority Critical patent/FR1205359A/en
Application filed by Associated Electrical Industries Ltd filed Critical Associated Electrical Industries Ltd
Priority to GB2372458A priority patent/GB873916A/en
Priority to FR800787A priority patent/FR76057E/en
Publication of GB873916A publication Critical patent/GB873916A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

873,916. Semi-conductor devices. ASSOCIATED ELECTRICAL INDUSTRIES Ltd. July 3, 1959 [July 23, 1958], No. 23724/58. Class 37. The envelope of a semiconductor device, e.g. a junction diode or transistor, is filled with a pasty composition comprising a powdered electrically insulating hygroscopic solid of good thermal conductivity and an insulating fluid, e.g. a silicone grease. Calcium aluminium silicate and sodium aluminium silicates are suitable hygroscopic materials. The composition may also include powdered silicon, alumina or magnesia to improve its heat conductivity. The components of the composition are dried separately before mixing to form a filling paste which is introduced into the envelope by a grease gun. In one embodiment (Fig. 2) a cap-shaped cover member 12 is filled with the paste and a base member 8, through which the leads to transistor 9 pass, is subsequently resistance welded to an annular ridge on the flange of the cover member.
GB2372458A 1958-07-23 1958-07-23 Improvements relating to hermetically sealed semi-conductor devices Expired GB873916A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR1205359D FR1205359A (en) 1958-07-23 1958-04-08 Hermetically sealed semiconductor devices
GB2372458A GB873916A (en) 1958-07-23 1958-07-23 Improvements relating to hermetically sealed semi-conductor devices
FR800787A FR76057E (en) 1958-07-23 1959-07-22 Hermetically sealed semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2372458A GB873916A (en) 1958-07-23 1958-07-23 Improvements relating to hermetically sealed semi-conductor devices

Publications (1)

Publication Number Publication Date
GB873916A true GB873916A (en) 1961-08-02

Family

ID=10200259

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2372458A Expired GB873916A (en) 1958-07-23 1958-07-23 Improvements relating to hermetically sealed semi-conductor devices

Country Status (2)

Country Link
FR (1) FR1205359A (en)
GB (1) GB873916A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3576474A (en) * 1968-02-23 1971-04-27 Gen Motors Corp Passivated power rectifier
WO1986003056A1 (en) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm Gmbh Process for encapsulating microelectronic circuits with organic components

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1275690B (en) * 1960-10-01 1968-08-22 Telefunken Patent Housing for semiconductor components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3576474A (en) * 1968-02-23 1971-04-27 Gen Motors Corp Passivated power rectifier
WO1986003056A1 (en) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm Gmbh Process for encapsulating microelectronic circuits with organic components
US4768081A (en) * 1984-11-17 1988-08-30 Messerschmitt-Boelkow-Blohm Gmbh Process for encapsulating microelectronic circuits with organic components

Also Published As

Publication number Publication date
FR1205359A (en) 1960-02-02

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