GB874801A - Improvements in or relating to semi-conductive devices - Google Patents

Improvements in or relating to semi-conductive devices

Info

Publication number
GB874801A
GB874801A GB6548/58A GB654858A GB874801A GB 874801 A GB874801 A GB 874801A GB 6548/58 A GB6548/58 A GB 6548/58A GB 654858 A GB654858 A GB 654858A GB 874801 A GB874801 A GB 874801A
Authority
GB
United Kingdom
Prior art keywords
semi
mixture
silicon carbide
transistor
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6548/58A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB874801A publication Critical patent/GB874801A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermistors And Varistors (AREA)

Abstract

874,801. Semi-conductor devices. PHILIPS ELECTRICAL INDUSTRIES Ltd. Feb. 28, 1958 [March 4, 1957], No. 6548/58. Class 37. A semi-conductor device comprises a semi-conductor body containing a rectifying junction and provided with at least two contacts which is embedded in a good heatconducting mixture of an insulating binder and crystalline silicon carbide. In the embodiment a transistor 1 attached to conductors 2 sealed through a glass lid 3 is placed in a viscous mixture, consisting of 40 c.c. of a polymerized methyl siloxane and 60 grams of crystalline silicon carbide, contained in glass tube 4. The lid is then sealed to the tube and the viscous mixture compacted by centrifuging. Since silicon carbide is not an insulator the transistor and associated conductors are coated with a thin layer of insulating lacquer prior to their insertion in the mixture. Conduction of heat to the transistor via the conductors 2 is prevented by the glass bead 6 which serves as a heat sink. A crystal diode may be incorporated in the above assembly instead of a transistor. In an alternative form of the invention the semi-conductor body is merely coated with a mixture of a hardenable insulating binder and crystalline silicon carbide.
GB6548/58A 1957-03-04 1958-02-28 Improvements in or relating to semi-conductive devices Expired GB874801A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL874801X 1957-03-04

Publications (1)

Publication Number Publication Date
GB874801A true GB874801A (en) 1961-08-10

Family

ID=19851343

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6548/58A Expired GB874801A (en) 1957-03-04 1958-02-28 Improvements in or relating to semi-conductive devices

Country Status (5)

Country Link
BE (1) BE565347A (en)
DE (1) DE1046194B (en)
FR (1) FR1192626A (en)
GB (1) GB874801A (en)
NL (1) NL215079A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0114000A1 (en) * 1983-01-11 1984-07-25 Ferranti plc Thermally conducting filler for enclosing electrical components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0114000A1 (en) * 1983-01-11 1984-07-25 Ferranti plc Thermally conducting filler for enclosing electrical components

Also Published As

Publication number Publication date
BE565347A (en)
FR1192626A (en) 1959-10-27
DE1046194B (en) 1958-12-11
NL215079A (en)

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