GB1316167A - Encapsulation of semiconductor devices - Google Patents

Encapsulation of semiconductor devices

Info

Publication number
GB1316167A
GB1316167A GB1316167DA GB1316167A GB 1316167 A GB1316167 A GB 1316167A GB 1316167D A GB1316167D A GB 1316167DA GB 1316167 A GB1316167 A GB 1316167A
Authority
GB
United Kingdom
Prior art keywords
substrate
devices
cover
plate
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti PLC filed Critical Ferranti PLC
Publication of GB1316167A publication Critical patent/GB1316167A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Abstract

1316167 Semi-conductor devices FERRANTI Ltd 13 Dec 1971 [17 Dec 1970] 60332/70 Heading H1K One or more semi-conductor devices 12 core mounted on a substrate 33, e.g. using the beam-lead technique or in the flip-chip configuration shown, with the device electrodes contacting conductors 14 on the substrate surface, the leads 171 of a lead frame are bonded to the conductors 14 and to the substrate 33, and a cover-plate 44 is secured to the substrate 33 using an adhesive 43 such as silicone rubber, optionally filled with alumina or silica, thereby hermetically sealing the devices 12. A metered quantity of the adhesive 43 is supplied, sufficient to completely fill the space between the substrate 33 and cover-plate 44. For use with Si devices 12 both the substrate 33 and cover-plate 44 may be made of a glass or ceramic material having a similar thermal coefficient of expansion to that of Si. The leads 17<SP>1</SP> may be cranked as shown or may extend straight outwardly from the upper surface of the substrate 33. A plurality of such assemblies may be stacked together with corresponding leads interconnected by wires extending parallel to the axis of the stack.
GB1316167D 1970-12-17 1970-12-17 Encapsulation of semiconductor devices Expired GB1316167A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB6033270 1970-12-17

Publications (1)

Publication Number Publication Date
GB1316167A true GB1316167A (en) 1973-05-09

Family

ID=10485444

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1316167D Expired GB1316167A (en) 1970-12-17 1970-12-17 Encapsulation of semiconductor devices

Country Status (1)

Country Link
GB (1) GB1316167A (en)

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee