NL143731B - PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR ELEMENTS, AS WELL AS THE SEMICONDUCTOR LEMENTS OBTAINED HEREIN. - Google Patents

PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR ELEMENTS, AS WELL AS THE SEMICONDUCTOR LEMENTS OBTAINED HEREIN.

Info

Publication number
NL143731B
NL143731B NL295718A NL295718A NL143731B NL 143731 B NL143731 B NL 143731B NL 295718 A NL295718 A NL 295718A NL 295718 A NL295718 A NL 295718A NL 143731 B NL143731 B NL 143731B
Authority
NL
Netherlands
Prior art keywords
semiconductor
lements
manufacture
well
semiconductor elements
Prior art date
Application number
NL295718A
Other languages
Dutch (nl)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of NL143731B publication Critical patent/NL143731B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/20—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances liquids, e.g. oils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Organic Insulating Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
NL295718A 1962-07-31 1963-07-24 PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR ELEMENTS, AS WELL AS THE SEMICONDUCTOR LEMENTS OBTAINED HEREIN. NL143731B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1962S0080667 DE1253850B (en) 1962-07-31 1962-07-31 Increasing the thermal conductivity of electrically insulating fluids by adding solids
DE1962S0092514 DE1277972B (en) 1962-07-31 1962-07-31 Electrical component or component group, preferably semiconductor component

Publications (1)

Publication Number Publication Date
NL143731B true NL143731B (en) 1974-10-15

Family

ID=25996940

Family Applications (2)

Application Number Title Priority Date Filing Date
NL295718D NL295718A (en) 1962-07-31
NL295718A NL143731B (en) 1962-07-31 1963-07-24 PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR ELEMENTS, AS WELL AS THE SEMICONDUCTOR LEMENTS OBTAINED HEREIN.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL295718D NL295718A (en) 1962-07-31

Country Status (4)

Country Link
CH (1) CH423996A (en)
DE (2) DE1277972B (en)
GB (1) GB990841A (en)
NL (2) NL143731B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2475568A1 (en) * 1980-02-13 1981-08-14 Rhone Poulenc Ind Compsns. for thermal energy storage - comprising specified combinations of rocks and heat-transfer fluids
JP2569003B2 (en) * 1986-03-20 1997-01-08 株式会社日立製作所 Heat conduction device
DE102007043886A1 (en) * 2007-09-14 2009-04-09 Continental Automotive Gmbh Electrical device for use in high-vibration environments and attenuator

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1000891B (en) * 1952-09-13 1957-01-17 Patra Patent Treuhand High-temperature-resistant synthetic resin molding compound

Also Published As

Publication number Publication date
DE1277972B (en) 1968-09-19
NL295718A (en)
CH423996A (en) 1966-11-15
GB990841A (en) 1965-05-05
DE1253850B (en) 1967-11-09

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