SU454269A1 - Copper based alloy - Google Patents

Copper based alloy

Info

Publication number
SU454269A1
SU454269A1 SU1825543A SU1825543A SU454269A1 SU 454269 A1 SU454269 A1 SU 454269A1 SU 1825543 A SU1825543 A SU 1825543A SU 1825543 A SU1825543 A SU 1825543A SU 454269 A1 SU454269 A1 SU 454269A1
Authority
SU
USSR - Soviet Union
Prior art keywords
based alloy
copper based
alloy
copper
silicon
Prior art date
Application number
SU1825543A
Other languages
Russian (ru)
Inventor
Герман Александрович Гусаков
Тамара Александровна Лаврут
Светлана Игоревна Субботина
Борис Владимирович Фармаковский
Татьяна Александровна Феофанова
Евгений Васильевич Шувалов
Original Assignee
Предприятие П/Я Г-4762
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я Г-4762 filed Critical Предприятие П/Я Г-4762
Priority to SU1825543A priority Critical patent/SU454269A1/en
Application granted granted Critical
Publication of SU454269A1 publication Critical patent/SU454269A1/en

Links

Description

1one

Изобретение касаетс  разработки электротехнических прецизионных сплавов дл  лить  микропроводов стекл нной изол ции непосредственно из жидкой фазы.The invention relates to the development of electrical precision alloys for casting microwire glass insulation directly from the liquid phase.

Известен сплав на основе меди, содержащий , %:Known alloy based on copper, containing,%:

Никель38-42Nickel38-42

Кремний0,5-1,0Silicon0.5-1.0

Бор0,005-1,0Bor0.005-1.0

Кальций0,004--0,5Calcium0,004--0,5

Цинк0,003-2,0Zinc 0.003-2.0

МедьОстальноеCopperE rest

Предложенный сплав отличаетс  от известного повышенным содержанием кремни  и бора, пониженным содержанием никел  и дополнительным содержанием германи , что способствует расширению интервала температурной стабильности в области отрицательных температур до -196°С.The proposed alloy differs from the known high content of silicon and boron, low content of nickel and additional content of germanium, which contributes to the expansion of the range of temperature stability in the region of negative temperatures to -196 ° C.

Предлагае.мый сплав имеет следующий химический состав, %:Offered. My alloy has the following chemical composition,%:

Германий5--11Germanium5--11

Никель27-37Nickel27-37

Кремний4-6Silicon 4-6

Бор2-3Bor2-3

Цинк0,003-2,0Zinc 0.003-2.0

МедьОстальноеCopperE rest

Электрофизические свойства сплава следующие: интервал температурной стабильности в области отрицательных температур расшир етс  до -196°С, при этом температурный коэффициент сопротивлени  не превышает ±2-10-5 K-.The electrophysical properties of the alloy are as follows: the temperature stability range in the region of negative temperatures expands to -196 ° C, while the temperature coefficient of resistance does not exceed ± 2-10-5 K-.

ПредметThing

изобретени the invention

Сплав на основе Alloy based

меди, включающий ницинк , о т л и ч а ю ш и и с   кель, кремний, бор. тем, что, с целью расширени  интервала температурной стабильности в области отрицательных температур до -196°С, он дополнительно содержит германий при следующем соотношении компонентов, %:copper, including nitsink, about tl and h and y sh and and with kel, silicon, boron. the fact that, in order to extend the range of temperature stability in the region of negative temperatures to -196 ° C, it additionally contains germanium in the following ratio of components,%:

Германий5-11Germanium5-11

Никель27-37Nickel27-37

Кремний4-6Silicon 4-6

Бор2-3Bor2-3

Цинк0,003-2,0Zinc 0.003-2.0

ОстальноеRest

МедьCopper

SU1825543A 1972-08-31 1972-08-31 Copper based alloy SU454269A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU1825543A SU454269A1 (en) 1972-08-31 1972-08-31 Copper based alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU1825543A SU454269A1 (en) 1972-08-31 1972-08-31 Copper based alloy

Publications (1)

Publication Number Publication Date
SU454269A1 true SU454269A1 (en) 1974-12-25

Family

ID=20526181

Family Applications (1)

Application Number Title Priority Date Filing Date
SU1825543A SU454269A1 (en) 1972-08-31 1972-08-31 Copper based alloy

Country Status (1)

Country Link
SU (1) SU454269A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5004581A (en) * 1989-07-31 1991-04-02 Toyota Jidosha Kabushiki Kaisha Dispersion strengthened copper-base alloy for overlay
FR2666149A1 (en) * 1990-08-23 1992-02-28 Takata Corp ACCELERATION DETECTOR.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5004581A (en) * 1989-07-31 1991-04-02 Toyota Jidosha Kabushiki Kaisha Dispersion strengthened copper-base alloy for overlay
FR2666149A1 (en) * 1990-08-23 1992-02-28 Takata Corp ACCELERATION DETECTOR.
US5212358A (en) * 1990-08-23 1993-05-18 Takata Corporation Acceleration sensor

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