DE546515C - Process for the production of rectifier elements for dry-plate rectifiers with a rectifying layer produced by heating - Google Patents
Process for the production of rectifier elements for dry-plate rectifiers with a rectifying layer produced by heatingInfo
- Publication number
- DE546515C DE546515C DEL76944D DEL0076944D DE546515C DE 546515 C DE546515 C DE 546515C DE L76944 D DEL76944 D DE L76944D DE L0076944 D DEL0076944 D DE L0076944D DE 546515 C DE546515 C DE 546515C
- Authority
- DE
- Germany
- Prior art keywords
- metal
- coolant
- plates
- heated
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 238000010438 heat treatment Methods 0.000 title claims 2
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 238000001816 cooling Methods 0.000 claims description 14
- 239000002826 coolant Substances 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000003638 chemical reducing agent Substances 0.000 claims description 6
- 230000001603 reducing effect Effects 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 150000002736 metal compounds Chemical class 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052753 mercury Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 2
- 229910052573 porcelain Inorganic materials 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000000084 colloidal system Substances 0.000 claims 2
- GUWKQWHKSFBVAC-UHFFFAOYSA-N [C].[Au] Chemical compound [C].[Au] GUWKQWHKSFBVAC-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 150000002902 organometallic compounds Chemical class 0.000 claims 1
- 239000011343 solid material Substances 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Chemical compound OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 241000530268 Lycaena heteronea Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/16—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide
- H01L21/161—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment
- H01L21/165—Reduction of the copper oxide, treatment of the oxide layer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Bei der Herstellung von Gleichrichterelementen für Trockenplattengleichrichter nach einem Verfahren, bei welchem die gleichrichtende Schicht unter Erhitzung und nachfolgender plötzlicher oder stufenweiser Abkühlung erzeugt wird, ist es für die Wirksamkeit der Gleichrichterelemente von großer Bedeutung, in welcher Weise die Ableitung von der Außenfläche des Gleichrichterele-In the manufacture of rectifier elements for dry plate rectifiers according to a method in which the rectifying layer is heated and then sudden or gradual cooling is generated, it is for effectiveness of the rectifier elements is of great importance, in which way the derivation from the outer surface of the rectifier element
to mentes bewerkstelligt wird. Beim Glühen von Kupferplatten z. B. entsteht bekanntlich auf der wirksamen Schicht von Kupferoxydul eine dünne Außenhaut von nicht leitendem Kupferoxyd, die entfernt werden muß. Danach besteht die Aufgabe, auf der freigelegten Oberfläche der Gleichrichterschicht eine möglichst gut Kontakt gebende Ableitung anzubringen, wobei auch durch Wahl des geeigneten leitfähigen Materials die Gleichrichterwirkung" der Anordnung noch gesteigert werden kann. Zur Entfernung der nicht leitfähigen Haut sind chemische und mechanische Mittel vorgeschlagen worden. Ferner ist es bekannt geworden, die nicht leitfähige Haut durch ein während des dem Glühprozeß folgenden Kühlvorganges angewendetes Reduktionsmittel in das Ausgangsmetall, z. B. Kupfer, zurückzuverwandeln. Andere Metalle als Kupfer konnten nach den bisher bekannt gewordenen Verfahren nur in. einem gesonderten Arbeitsgang aufgebracht werden, wobei mechanische, chemische oder physikalische Mittel in Anwendung kamen. Demgegenüber gelingt es nach der vorliegenden Erfindung leicht, ein passendes Fremdmetall auf der gleichrichtenden Schicht niederzuschlagen, wenn man nach beendetem Glühen dafür sorgt, daß bei dem Kühlprozeß ein Reduktionsmittel und gleichzeitig ein passendes Metall oder eine Metallverbindung zugegen ist. Durch geeignete Arbeitsweise läßt sich der Vorgang so leiten, daß die äußere, nicht leitende Haut reduziert wird, während gleichzeitig ein passendes Fremdmetall auf der Oberfläche abgeschieden wird.to mentes is accomplished. When annealing copper plates z. B. is known to arise the effective layer of copper oxide is a thin outer skin of non-conductive copper oxide which must be removed. Thereafter there is the task of creating an as possible on the exposed surface of the rectifier layer to attach good contact-making discharge, whereby the rectifier effect also by choosing the suitable conductive material " the arrangement can be increased. To remove the non-conductive skin are chemical and mechanical Funds have been proposed. The non-conductive skin has also become known by a reducing agent used during the cooling process following the annealing process into the starting metal, e.g. B. copper. Metals other than copper could after those previously known Process can only be applied in a separate operation, whereby mechanical, chemical or physical means were used. In contrast According to the present invention, it is easy to find a suitable foreign metal to precipitate the rectifying layer if one for it after the glow has ended ensures that a reducing agent and a suitable metal at the same time during the cooling process or a metal compound is present. With a suitable working method, the Manage the process so that the outer, non-conductive skin is reduced while at the same time a suitable foreign metal is deposited on the surface.
Bringt man nämlich die glühenden Platten mit einem Kühlmittel in Berührung, welches gleichzeitig reduzierende Eigenschaften besitzt oder ein Reduktionsmittel enthält und außerdem mit einer Metallverbindung versehen ist, welche bei Berührung mit den glühenden Gleichrichterplatten unter Metallabscheidung zersetzt wird, so überzieht sich die Gleichrichterplatte oberflächlich mit einer Schicht des Fremdmetalls, mit dem das Kühlmittel versehen war. Bringt man z. B. die glühenden Platten in eine wäßrige Lösung von Traubenzucker, die außerdem Ammoniak und ein Silbersalz enthält, so überzieht sich die Platte mit einer dünnen Silberschicht. Man kann auch so arbeiten, daß man eine Metallsuspension oder eine kolloidale Metalllösung verwendet, z. B. eine Lösung von kolloidalem Silber. Ferner kann man als Kühlmittel Öle, Fette oder Wachse benutzen, denen man beispielsweise Quecksilber emul-If you bring the glowing plates into contact with a coolant, which at the same time has reducing properties or contains a reducing agent and is also provided with a metal connection which, when in contact with the glowing rectifier plates, deposits metal is decomposed, the rectifier plate is covered on the surface with a Layer of foreign metal with which the coolant was coated. If you bring z. B. the red-hot plates in an aqueous solution of grape sugar, which also contains ammonia and contains a silver salt, the plate is covered with a thin layer of silver. One can also work in such a way that one has a metal suspension or a colloidal metal solution used, e.g. B. a solution of colloidal silver. You can also use oils, fats or waxes as coolants, where mercury, for example, is emulsified
giert hat. Man kann auch Gase als Kühlmittel verwenden, denen man gasförmige oder dampfförmige Metallverbindungen beigemengt hat, z. B. Dämpfe von Zinkäthyi 5 oder Quecksilberdiäthyl. Besonders einfach gestaltet sich das Verfahren, wenn mail keine flüssigen oder gasförmigen Kühl: mittel verwendet, sondern feste Kühlkörper. Belegt man nämlich die Kühlfläche dergreed. You can also use gases as coolants to which gaseous or vaporous metal compounds have been added, e.g. B. Vapors from Zinkäthyi 5 or mercury diethyl. Particularly simple process designed if no liquid or gaseous cooling mail: used moderate but solid heat sink. If you occupy the cooling surface of the
ίο Druckplatten mit einem reduzierenden Material, beispielsweise Papier, das durch die Wärme -der glühenden Metallplatten zersetzt wird und dabei die Außenhaut derselben reduziert, und imprägniert dieses reduzie-ίο printing plates with a reducing material, For example paper, which decomposes due to the heat of the glowing metal plates is and thereby the outer skin of the same is reduced, and impregnates this reduced-
»5 rende Material mit einem Metall, sei es als Metallpulver, kolloidale Metallösung oder in Form einer zersetzbaren Metallverbindung, so wird beim Pressen und Abkühlen der glühenden Metallplatten zwischen den so präparierten Kühlplatten die Außenhaut von dem nicht leitenden Oxydüberzug befreit und mit einer außerordentlich fest anliegenden und gut leitfähigen Schicht dieses Fremdmetalls versehen. Zur Imprägnierung der Bedeckung der Kühlflächen kann man beispielsweise Zinkstaub, pulverisiertes Zinn, Magnesiumpulver u. dgl. verwenden oder kolloidale Lösungen von Silber, Gold, Platin und ähnlichen, auch Lösungen, wie sie zum Vergolden und Platinieren von Glas oder Porzellan verwendet werden, nach Art der bekannten Westhaverschen Glanz-Platin-Lösung, schließlich präparierte Pasten, wie sie als Lötmittel verwendet werden. Man erhält auf diese "Weise eine fest haftende und gut leitfähige Außenschicht, die in innigstem Kontakt mit dem Kristallgefüge der gleichrichtenden Schicht ist.“5 rende material with a metal, be it as metal powder, colloidal metal solution or in the form of a decomposable metal compound, Thus, when the glowing metal plates are pressed and cooled, the outer skin between the cooling plates prepared in this way is removed the non-conductive oxide coating freed and with an extremely tight fitting and a highly conductive layer of this foreign metal. To impregnate the cover of the cooling surfaces, for example Use zinc dust, powdered tin, magnesium powder, and the like, or colloidal solutions of silver, gold, platinum and similar, including solutions, such as those used for gold-plating and platinum-plating of glass or Porcelain can be used in the manner of the well-known Westhaversian gloss platinum solution, finally, prepared pastes such as those used as solder. You get in this way a firmly adhering and highly conductive outer layer, which in the most intimate Is in contact with the crystal structure of the rectifying layer.
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEL76944D DE546515C (en) | 1929-12-06 | 1929-12-07 | Process for the production of rectifier elements for dry-plate rectifiers with a rectifying layer produced by heating |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEL0076944 | 1929-12-06 | ||
DEL76944D DE546515C (en) | 1929-12-06 | 1929-12-07 | Process for the production of rectifier elements for dry-plate rectifiers with a rectifying layer produced by heating |
Publications (1)
Publication Number | Publication Date |
---|---|
DE546515C true DE546515C (en) | 1932-04-04 |
Family
ID=25986311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DEL76944D Expired DE546515C (en) | 1929-12-06 | 1929-12-07 | Process for the production of rectifier elements for dry-plate rectifiers with a rectifying layer produced by heating |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE546515C (en) |
-
1929
- 1929-12-07 DE DEL76944D patent/DE546515C/en not_active Expired
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