DE112022006639T5 - Modul für elektrische Komponenten - Google Patents

Modul für elektrische Komponenten Download PDF

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Publication number
DE112022006639T5
DE112022006639T5 DE112022006639.3T DE112022006639T DE112022006639T5 DE 112022006639 T5 DE112022006639 T5 DE 112022006639T5 DE 112022006639 T DE112022006639 T DE 112022006639T DE 112022006639 T5 DE112022006639 T5 DE 112022006639T5
Authority
DE
Germany
Prior art keywords
substrate
heat transfer
heat
metal
coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022006639.3T
Other languages
German (de)
English (en)
Inventor
Ryosuke Kado
Keiichiro SHIZU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112022006639T5 publication Critical patent/DE112022006639T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE112022006639.3T 2022-02-16 2022-02-16 Modul für elektrische Komponenten Pending DE112022006639T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/006196 WO2023157130A1 (ja) 2022-02-16 2022-02-16 電装品モジュール

Publications (1)

Publication Number Publication Date
DE112022006639T5 true DE112022006639T5 (de) 2024-12-05

Family

ID=87577839

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022006639.3T Pending DE112022006639T5 (de) 2022-02-16 2022-02-16 Modul für elektrische Komponenten

Country Status (5)

Country Link
US (1) US20250056766A1 (https=)
JP (1) JPWO2023157130A1 (https=)
CN (1) CN118633357A (https=)
DE (1) DE112022006639T5 (https=)
WO (1) WO2023157130A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020088127A (ja) 2018-11-22 2020-06-04 ヤマハ株式会社 電気部品および電気機器

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51124844U (https=) * 1975-04-08 1976-10-08
JP2658329B2 (ja) * 1988-12-23 1997-09-30 日本電気株式会社 集積回路の冷却構造
JP3535653B2 (ja) * 1996-02-22 2004-06-07 株式会社フジクラ 電子素子の冷却構造
JPH09283664A (ja) * 1996-04-16 1997-10-31 Toshiba Corp 回路モジュールの冷却装置
JPH11330747A (ja) * 1998-05-08 1999-11-30 Fujikura Ltd 電子素子の冷却構造
JP2008160962A (ja) * 2006-12-22 2008-07-10 Nippon Keiki Works Ltd 高温動作モータ
WO2010084717A1 (ja) * 2009-01-23 2010-07-29 日本電気株式会社 冷却装置
FR2984074B1 (fr) * 2011-12-13 2014-11-28 Hispano Suiza Sa Dispositif electronique avec refroidissement par spreader a metal liquide
JP6452482B2 (ja) * 2015-02-16 2019-01-16 古河電気工業株式会社 電子モジュール
JP2019080471A (ja) * 2017-10-27 2019-05-23 オムロンオートモーティブエレクトロニクス株式会社 負荷駆動装置
US10375855B2 (en) * 2017-11-08 2019-08-06 Honeywell International Inc. Systems and methods for zero power automatic thermal regulation
EP3522690B2 (en) * 2018-02-02 2023-12-06 Kabushiki Kaisha Toyota Jidoshokki Inverter

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020088127A (ja) 2018-11-22 2020-06-04 ヤマハ株式会社 電気部品および電気機器

Also Published As

Publication number Publication date
US20250056766A1 (en) 2025-02-13
WO2023157130A1 (ja) 2023-08-24
JPWO2023157130A1 (https=) 2023-08-24
CN118633357A (zh) 2024-09-10

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Legal Events

Date Code Title Description
R012 Request for examination validly filed