JPWO2023157130A1 - - Google Patents

Info

Publication number
JPWO2023157130A1
JPWO2023157130A1 JP2024500772A JP2024500772A JPWO2023157130A1 JP WO2023157130 A1 JPWO2023157130 A1 JP WO2023157130A1 JP 2024500772 A JP2024500772 A JP 2024500772A JP 2024500772 A JP2024500772 A JP 2024500772A JP WO2023157130 A1 JPWO2023157130 A1 JP WO2023157130A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024500772A
Other languages
Japanese (ja)
Other versions
JPWO2023157130A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023157130A1 publication Critical patent/JPWO2023157130A1/ja
Publication of JPWO2023157130A5 publication Critical patent/JPWO2023157130A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2024500772A 2022-02-16 2022-02-16 Pending JPWO2023157130A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/006196 WO2023157130A1 (ja) 2022-02-16 2022-02-16 電装品モジュール

Publications (2)

Publication Number Publication Date
JPWO2023157130A1 true JPWO2023157130A1 (https=) 2023-08-24
JPWO2023157130A5 JPWO2023157130A5 (https=) 2024-05-23

Family

ID=87577839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024500772A Pending JPWO2023157130A1 (https=) 2022-02-16 2022-02-16

Country Status (5)

Country Link
US (1) US20250056766A1 (https=)
JP (1) JPWO2023157130A1 (https=)
CN (1) CN118633357A (https=)
DE (1) DE112022006639T5 (https=)
WO (1) WO2023157130A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02172263A (ja) * 1988-12-23 1990-07-03 Nec Corp 集積回路の冷却構造
JPH09283664A (ja) * 1996-04-16 1997-10-31 Toshiba Corp 回路モジュールの冷却装置
JPH11330747A (ja) * 1998-05-08 1999-11-30 Fujikura Ltd 電子素子の冷却構造
JP2008160962A (ja) * 2006-12-22 2008-07-10 Nippon Keiki Works Ltd 高温動作モータ
WO2010084717A1 (ja) * 2009-01-23 2010-07-29 日本電気株式会社 冷却装置
JP2015502054A (ja) * 2011-12-13 2015-01-19 イスパノ・シユイザ 液体金属スプレッダーによる冷却作用を備えた電子デバイス
JP2016152234A (ja) * 2015-02-16 2016-08-22 古河電気工業株式会社 電子モジュール
JP2019080471A (ja) * 2017-10-27 2019-05-23 オムロンオートモーティブエレクトロニクス株式会社 負荷駆動装置
JP2019087728A (ja) * 2017-11-08 2019-06-06 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． ゼロ電力自動熱調節のためのシステムおよび方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51124844U (https=) * 1975-04-08 1976-10-08
JP3535653B2 (ja) * 1996-02-22 2004-06-07 株式会社フジクラ 電子素子の冷却構造
EP3522690B2 (en) * 2018-02-02 2023-12-06 Kabushiki Kaisha Toyota Jidoshokki Inverter
JP2020088127A (ja) 2018-11-22 2020-06-04 ヤマハ株式会社 電気部品および電気機器

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02172263A (ja) * 1988-12-23 1990-07-03 Nec Corp 集積回路の冷却構造
JPH09283664A (ja) * 1996-04-16 1997-10-31 Toshiba Corp 回路モジュールの冷却装置
JPH11330747A (ja) * 1998-05-08 1999-11-30 Fujikura Ltd 電子素子の冷却構造
JP2008160962A (ja) * 2006-12-22 2008-07-10 Nippon Keiki Works Ltd 高温動作モータ
WO2010084717A1 (ja) * 2009-01-23 2010-07-29 日本電気株式会社 冷却装置
JP2015502054A (ja) * 2011-12-13 2015-01-19 イスパノ・シユイザ 液体金属スプレッダーによる冷却作用を備えた電子デバイス
JP2016152234A (ja) * 2015-02-16 2016-08-22 古河電気工業株式会社 電子モジュール
JP2019080471A (ja) * 2017-10-27 2019-05-23 オムロンオートモーティブエレクトロニクス株式会社 負荷駆動装置
JP2019087728A (ja) * 2017-11-08 2019-06-06 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． ゼロ電力自動熱調節のためのシステムおよび方法

Also Published As

Publication number Publication date
US20250056766A1 (en) 2025-02-13
WO2023157130A1 (ja) 2023-08-24
CN118633357A (zh) 2024-09-10
DE112022006639T5 (de) 2024-12-05

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