DE112022000948T5 - Piezoelektrisches element, piezoelektrische vorrichtung und verfahren zum herstellen eines piezoelektrischen elements - Google Patents

Piezoelektrisches element, piezoelektrische vorrichtung und verfahren zum herstellen eines piezoelektrischen elements Download PDF

Info

Publication number
DE112022000948T5
DE112022000948T5 DE112022000948.9T DE112022000948T DE112022000948T5 DE 112022000948 T5 DE112022000948 T5 DE 112022000948T5 DE 112022000948 T DE112022000948 T DE 112022000948T DE 112022000948 T5 DE112022000948 T5 DE 112022000948T5
Authority
DE
Germany
Prior art keywords
region
piezoelectric element
piezoelectric
film
vibration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022000948.9T
Other languages
German (de)
English (en)
Inventor
Minekazu Sakai
Kazuaki Mawatari
Yuji Koyama
Masaaki Tanaka
Tomoya Jomori
Yuhei Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of DE112022000948T5 publication Critical patent/DE112022000948T5/de
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/308—Membrane type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/02—Microphones
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/082—Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
DE112022000948.9T 2021-02-03 2022-02-01 Piezoelektrisches element, piezoelektrische vorrichtung und verfahren zum herstellen eines piezoelektrischen elements Pending DE112022000948T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021016148A JP7528804B2 (ja) 2021-02-03 2021-02-03 圧電素子、圧電装置、および圧電素子の製造方法
JP2021-016148 2021-02-03
PCT/JP2022/003806 WO2022168826A1 (ja) 2021-02-03 2022-02-01 圧電素子、圧電装置、および圧電素子の製造方法

Publications (1)

Publication Number Publication Date
DE112022000948T5 true DE112022000948T5 (de) 2023-11-30

Family

ID=82741457

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022000948.9T Pending DE112022000948T5 (de) 2021-02-03 2022-02-01 Piezoelektrisches element, piezoelektrische vorrichtung und verfahren zum herstellen eines piezoelektrischen elements

Country Status (5)

Country Link
US (1) US20230363280A1 (https=)
JP (2) JP7528804B2 (https=)
CN (1) CN116784020A (https=)
DE (1) DE112022000948T5 (https=)
WO (1) WO2022168826A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12513467B2 (en) * 2021-12-09 2025-12-30 Skyworks Solutions, Inc. Acoustic resistance improvement in piezoelectric microelectromechanical system microphone using compliant joint
US12549906B2 (en) * 2022-03-31 2026-02-10 Skyworks Solutions, Inc. MEMS sensor with two compliances
CN119183056B (zh) * 2024-11-25 2025-07-22 成都纤声科技有限公司 一种压电mems麦克风及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5936154B2 (ja) 2011-03-31 2016-06-15 ベスパー テクノロジーズ インコーポレイテッドＶｅｓｐｅｒ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｉｎｃ． ギャップ制御構造を有する音響トランスデューサおよび音響トランスデューサの製造方法
JP2021016148A (ja) 2019-07-15 2021-02-12 シャープ株式会社 走査アンテナおよび走査アンテナの製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58100000U (ja) * 1981-12-26 1983-07-07 クラウン株式会社 音響変換装置
JP3844784B2 (ja) * 1997-09-08 2006-11-15 日本碍子株式会社 圧電／電歪デバイス
JP2003207729A (ja) 2002-01-16 2003-07-25 Ricoh Co Ltd 形状可変鏡の製造方法及び光ディスク情報入出力装置
WO2005050836A1 (ja) * 2003-11-19 2005-06-02 Murata Manufacturing Co., Ltd. 端面反射型弾性表面波装置及びその製造方法
JP4691395B2 (ja) * 2005-05-30 2011-06-01 株式会社日立メディアエレクトロニクス バルク弾性波共振器、バルク弾性波共振器を用いたフィルタ、それを用いた高周波モジュール、並びにバルク弾性波共振器を用いた発振器
JP5250899B2 (ja) * 2007-10-16 2013-07-31 船井電機株式会社 携帯電話およびマイクロホンユニット
JP5491080B2 (ja) * 2009-06-18 2014-05-14 国立大学法人 東京大学 マイクロフォン
JP6908322B2 (ja) * 2016-09-06 2021-07-21 新日本無線株式会社 圧電素子
JP6894719B2 (ja) * 2017-02-21 2021-06-30 新日本無線株式会社 圧電素子
JP2019114958A (ja) * 2017-12-25 2019-07-11 第一精工株式会社 電気音響変換器
JP2019161030A (ja) 2018-03-14 2019-09-19 新日本無線株式会社 圧電素子
DE112019006130B4 (de) * 2018-12-10 2022-03-24 Murata Manufacturing Co., Ltd. Piezoelektrischer Wandler
JP7176678B2 (ja) 2019-02-15 2022-11-22 日清紡マイクロデバイス株式会社 圧電素子
JP2020178109A (ja) * 2019-04-23 2020-10-29 新日本無線株式会社 圧電素子
DE112020002000T5 (de) * 2019-05-16 2022-01-20 Murata Manufacturing Co., Ltd. Piezoelektrisches bauelement und ultraschallwandler
WO2021095311A1 (ja) * 2019-11-13 2021-05-20 株式会社村田製作所 トランスデューサ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5936154B2 (ja) 2011-03-31 2016-06-15 ベスパー テクノロジーズ インコーポレイテッドＶｅｓｐｅｒ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｉｎｃ． ギャップ制御構造を有する音響トランスデューサおよび音響トランスデューサの製造方法
JP2021016148A (ja) 2019-07-15 2021-02-12 シャープ株式会社 走査アンテナおよび走査アンテナの製造方法

Also Published As

Publication number Publication date
JP2024133375A (ja) 2024-10-01
CN116784020A (zh) 2023-09-19
WO2022168826A1 (ja) 2022-08-11
JP7772148B2 (ja) 2025-11-18
US20230363280A1 (en) 2023-11-09
JP7528804B2 (ja) 2024-08-06
JP2022119126A (ja) 2022-08-16

Similar Documents

Publication Publication Date Title
EP1550349B1 (de) Membran und verfahren zu deren herstellung
DE112022000948T5 (de) Piezoelektrisches element, piezoelektrische vorrichtung und verfahren zum herstellen eines piezoelektrischen elements
DE10151376B4 (de) Dynamischer Halbleitergrößensensor zum Erfassen einer dynamischen Größe in zwei Achsen mit einem x-förmigen Massenabschnitt
DE69624882T2 (de) Variabler Kondensator
DE69401607T2 (de) Winkelgeschwindigkeitsmessaufnehmer
EP0721587B1 (de) Mikromechanische vorrichtung und verfahren zu deren herstellung
DE69126501T2 (de) Kraftdetektor und Beschleunigungsdetektor
DE102004011144B4 (de) Drucksensor und Verfahren zum Betreiben eines Drucksensors
DE69032583T2 (de) Miniaturdruckwandler hoher Empfindlichkeit mit gespannter Membran
DE102018220508B4 (de) Verfahren zum Bilden von Vorrichtungen mit lokalisierter Einstellung von Verformung und mechanischer Spannung
DE69306687T2 (de) Seitwärts empfindlicher Beschleunigungsmesser sowie Verfahren zu seiner Herstellung
DE3335772C2 (de) Meßwandler und Verfahren zum Herstellen eines Meßwandlers, der auf Piezo-Widerstandsbasis arbeitet
DE102008017967B4 (de) Resonanzfilter mit geringem Verlust
DE4133009A1 (de) Kapazitiver drucksensor und herstellungsverfahren hierzu
DE69522165T2 (de) Mikrokreisel
WO1995003534A1 (de) Kapazitive drucksensoren mit hoher linearität
DE3889440T2 (de) Geradlinig und linear biegbares Element, hergestellt aus einer einzigen Platte.
DE102016208925A1 (de) Mikromechanischer Sensor und Verfahren zum Herstellen eines mikromechanischen Sensors
WO2006105898A1 (de) Mikromechanisches bauelement, verfahren zur herstellung und verwendung
DE102005043645B4 (de) Halbleitersensor für eine physikalische Grösse und Verfahren zur Herstellung eines solchen
DE69605680T2 (de) Monolithischer beschleunigungsmessaufnehmer
DE102016212693A1 (de) Drucksensorvorrichtung und Herstellungsverfahren
DE102020120232A1 (de) Mems-sensor
DE102018222758A1 (de) MEMS-Sensor mit einer Membran sowie Verfahren zur Herstellung eines MEMS-Sensors
DE3824695C2 (https=)

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R084 Declaration of willingness to licence