DE112021000268T5 - Temperatursensor und Verfahren zur Herstellung eines Temperatursensors - Google Patents

Temperatursensor und Verfahren zur Herstellung eines Temperatursensors Download PDF

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Publication number
DE112021000268T5
DE112021000268T5 DE112021000268.6T DE112021000268T DE112021000268T5 DE 112021000268 T5 DE112021000268 T5 DE 112021000268T5 DE 112021000268 T DE112021000268 T DE 112021000268T DE 112021000268 T5 DE112021000268 T5 DE 112021000268T5
Authority
DE
Germany
Prior art keywords
cover body
thermosensitive element
temperature sensor
covering
thermosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021000268.6T
Other languages
German (de)
English (en)
Inventor
Michiru TAKEMURA
Takamasa Yoshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Electronics Co Ltd
Original Assignee
Shibaura Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Electronics Co Ltd filed Critical Shibaura Electronics Co Ltd
Publication of DE112021000268T5 publication Critical patent/DE112021000268T5/de
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G01K1/18—Special arrangements for conducting heat from the object to the sensitive element for reducing thermal inertia
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G01K1/10—Protective devices, e.g. casings for preventing chemical attack
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Thermistors And Varistors (AREA)
DE112021000268.6T 2021-10-14 2021-10-14 Temperatursensor und Verfahren zur Herstellung eines Temperatursensors Pending DE112021000268T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/038098 WO2023062787A1 (ja) 2021-10-14 2021-10-14 温度センサおよび温度センサの製造方法

Publications (1)

Publication Number Publication Date
DE112021000268T5 true DE112021000268T5 (de) 2023-08-03

Family

ID=81291814

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021000268.6T Pending DE112021000268T5 (de) 2021-10-14 2021-10-14 Temperatursensor und Verfahren zur Herstellung eines Temperatursensors

Country Status (4)

Country Link
JP (1) JP7058377B1 (https=)
CN (1) CN116264841A (https=)
DE (1) DE112021000268T5 (https=)
WO (1) WO2023062787A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025040722A1 (de) * 2023-08-22 2025-02-27 Yageo Nexensos Gmbh Sensorbaugruppe und verfahren zur herstellung einer sensorbaugruppe
WO2025237621A1 (de) * 2024-05-17 2025-11-20 Tdk Electronics Ag Gehäuse für ein messelement eines sensors zur temperaturerfassung
DE102024113901A1 (de) * 2024-05-17 2025-11-20 Tdk Electronics Ag Sensoranordnung und Verfahren zur Herstellung eines Sensoranordnung
WO2025247609A1 (de) * 2024-05-28 2025-12-04 Tdk Electronics Ag Sensor und verfahren zur herstellung eines sensors

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7809165B2 (ja) * 2024-06-10 2026-01-30 株式会社芝浦電子 温度センサおよび温度センサの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5830636B1 (ja) 2014-03-07 2015-12-09 株式会社芝浦電子 温度センサ、及び、温度センサの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4934831A (en) * 1989-03-20 1990-06-19 Claud S. Gordon Company Temperature sensing device
DE10111657A1 (de) * 2001-03-09 2003-01-02 Heraeus Electro Nite Int Verfahren zur Herstellung eines Gehäuses für Sensorelemente, sowie Sensor, insbesondere Temperatur-Sensor
JP4253642B2 (ja) * 2005-02-25 2009-04-15 日本特殊陶業株式会社 温度センサ
JP5574117B2 (ja) * 2011-03-30 2014-08-20 三菱マテリアル株式会社 温度センサ
WO2013170685A1 (zh) * 2012-05-14 2013-11-21 深圳市敏杰电子科技有限公司 表面测温温度传感器
US10935434B2 (en) * 2017-03-16 2021-03-02 Shibaura Electronics Co., Ltd. Temperature sensor
JP7099884B2 (ja) * 2018-06-18 2022-07-12 矢崎総業株式会社 油温センサ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5830636B1 (ja) 2014-03-07 2015-12-09 株式会社芝浦電子 温度センサ、及び、温度センサの製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025040722A1 (de) * 2023-08-22 2025-02-27 Yageo Nexensos Gmbh Sensorbaugruppe und verfahren zur herstellung einer sensorbaugruppe
WO2025237621A1 (de) * 2024-05-17 2025-11-20 Tdk Electronics Ag Gehäuse für ein messelement eines sensors zur temperaturerfassung
DE102024113901A1 (de) * 2024-05-17 2025-11-20 Tdk Electronics Ag Sensoranordnung und Verfahren zur Herstellung eines Sensoranordnung
WO2025247609A1 (de) * 2024-05-28 2025-12-04 Tdk Electronics Ag Sensor und verfahren zur herstellung eines sensors

Also Published As

Publication number Publication date
US20240219244A1 (en) 2024-07-04
CN116264841A (zh) 2023-06-16
JP7058377B1 (ja) 2022-04-21
WO2023062787A1 (ja) 2023-04-20
JPWO2023062787A1 (https=) 2023-04-20

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