WO2023062787A1 - 温度センサおよび温度センサの製造方法 - Google Patents

温度センサおよび温度センサの製造方法 Download PDF

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Publication number
WO2023062787A1
WO2023062787A1 PCT/JP2021/038098 JP2021038098W WO2023062787A1 WO 2023062787 A1 WO2023062787 A1 WO 2023062787A1 JP 2021038098 W JP2021038098 W JP 2021038098W WO 2023062787 A1 WO2023062787 A1 WO 2023062787A1
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WO
WIPO (PCT)
Prior art keywords
sensing element
covering
temperature sensing
lead wire
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/038098
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English (en)
French (fr)
Japanese (ja)
Inventor
孝正 吉原
満 竹村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Electronics Co Ltd
Original Assignee
Shibaura Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Electronics Co Ltd filed Critical Shibaura Electronics Co Ltd
Priority to US17/758,561 priority Critical patent/US12618720B2/en
Priority to PCT/JP2021/038098 priority patent/WO2023062787A1/ja
Priority to DE112021000268.6T priority patent/DE112021000268T5/de
Priority to CN202180007329.9A priority patent/CN116264841A/zh
Priority to JP2021576540A priority patent/JP7058377B1/ja
Publication of WO2023062787A1 publication Critical patent/WO2023062787A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G01K1/18—Special arrangements for conducting heat from the object to the sensitive element for reducing thermal inertia
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G01K1/10—Protective devices, e.g. casings for preventing chemical attack
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements

Definitions

  • the present invention relates to a temperature sensor and its manufacturing method.
  • thermosensitive element such as a thermistor
  • Patent Document 1 A temperature sensor equipped with a thermosensitive element such as a thermistor is widely used (for example, Patent Document 1).
  • the temperature sensing element and the lead wires connected to the temperature sensing element are provided with a covering made of a resin material in a predetermined range.
  • the temperature sensor of Patent Literature 1 includes a covering formed into a rectangular parallelepiped shape from two layers, an inner layer and an outer layer having a higher melting point than the inner layer and heat shrinkability.
  • a covering is formed from an inner tube that houses the temperature sensing element and an outer tube that is inserted onto the inner tube, for example, through heat treatment and press working, and has a certain thickness that allows the lead wires to be accommodated in the covering. It is molded to fit.
  • the covering that covers the temperature sensing element and the predetermined range of lead wires affects the responsiveness of the temperature sensor. Especially in a small temperature sensor, the cover has a great influence on the responsiveness.
  • SUMMARY OF THE INVENTION Accordingly, it is a first object of the present invention to provide a temperature sensor capable of further improving responsiveness and a method of manufacturing the same. Moreover, since the thickness of the temperature sensor is determined based on the diameter of the lead wire, it is difficult to install the temperature sensor depending on the shape and size of the object on which the temperature sensor is installed. Accordingly, it is a second object of the present invention to provide a temperature sensor capable of improving the degree of freedom of installation and a method of manufacturing the same, in addition to the first object or instead of the first object. do.
  • a temperature sensor of the present invention includes a temperature sensor, a lead wire having one end electrically connected to the temperature sensor, and a sealing body made of an insulating material covering a part of the lead wire and the temperature sensor.
  • the dimension of the cover in the lateral direction the dimension of the region covering the thermosensitive element is set smaller than the dimension of the region covering the lead wire.
  • the lead wire has a core wire connected to the lead wire and a coating that covers the core wire. It is preferably set smaller than the outer diameter of the coating.
  • the lateral direction is preferably at least one of the first direction in the rectangular cross section and the second direction orthogonal to the first direction.
  • either one of the area covering the temperature sensing element and the area covering the lead wire is formed in a rectangular parallelepiped shape.
  • the first direction in the rectangular cross section is such that the dimension of the region covering the temperature sensing element is set smaller than the dimension of the region covering the lead wire, and in the rectangular cross section In the second direction orthogonal to the first direction, it is preferable that the dimension of the region covering the thermosensitive element is set smaller than the dimension of the region covering the lead wires.
  • the temperature sensing element is configured by a pair of lead wires drawn out from the temperature sensing element to one side, and a sealing body is disposed in a region covering the temperature sensing element to cover the lead wires. It is preferable that the joint portion between the lead wire and the lead wire is arranged in the region.
  • both the area covering the temperature sensing element and the area covering the lead wires have a rectangular cross section, and the centers of the respective cross sections are aligned.
  • the lateral dimension of the area covering the thermosensitive element decreases toward the end of the cover.
  • a temperature sensing element including a temperature sensing body, a lead wire connected to the temperature sensing element, and a resin-made elongated cover covering a part of the lead wire and the temperature sensing element and a method of manufacturing a temperature sensor.
  • This manufacturing method includes a housing step of housing a portion of the lead wire and the temperature sensing element inside a resin material, a heating step of heating the material, and a shape exhibiting a rectangular cross section by pressurizing the material. and a pressure forming step to form into.
  • the temperature sensing element side of the material is deformed with a larger deformation amount than the lead wire side by pressurization, so that the width of the covering body is defined as the area covering the temperature sensing element. is smaller than the dimension of the area covering the lead wires.
  • the dimension of the cover in the lateral direction is set smaller than the dimension of the region covering the temperature sensing element, the shape and size of the installation location such as a narrow groove, etc. Accordingly, the thickness of the cover on the thermosensitive element side can be appropriately set regardless of the outer diameter of the lead wire. Therefore, it is possible to improve the degree of freedom in installing the temperature sensor.
  • the heat capacity of the cover is greater than the case where the cover has a certain size based on the outer diameter of the lead wire, or the case where the size of the cover on the temperature sensing element side is larger than the size of the cover on the lead wire side. is small, and the thickness of the covering between the object of temperature measurement on which the covering is arranged and the temperature sensing element is thin. Therefore, since the temperature change of the object can be detected with high sensitivity by the temperature sensing element, the responsiveness as a temperature sensor can be improved.
  • FIG. 2 illustrates a temperature sensor according to an embodiment of the invention
  • (a) is a plan view
  • (b) is a side view
  • (c) is a view from the Ic direction of (a).
  • (a) is IIa-IIa sectional drawing of FIG.1(b).
  • (b) is IIb-IIb sectional drawing of Fig.1 (a).
  • (a) to (c) are diagrams for explaining the steps of manufacturing the temperature sensor.
  • (a) is a cross-sectional view of a mold used to manufacture the temperature sensor.
  • (b) and (c) are cross-sectional views showing changes in the shape of the tube during the manufacturing process.
  • FIG. 1 is a plan view
  • (b) is a side view
  • (c) is a view from the Ic direction of (a).
  • (a) is IIa-IIa sectional drawing of FIG.1(b).
  • (b) is IIb-IIb sectional drawing of Fig.1 (
  • FIG. 10 is a diagram showing a tube with a two-layer structure consisting of an inner layer and an outer layer as an example of improved material for the covering.
  • (a) and (b) are diagrams showing a temperature sensor according to a modification of the present invention.
  • (a) is a plan view, and (b) is a side view.
  • (a) to (c) are side views of coverings according to other modifications of the present invention.
  • (a) and (b) are front views of a covering according to another modification of the present invention.
  • (a) and (b) are diagrams showing a temperature sensor according to another modification of the present invention.
  • (a) is a plan view
  • (b) is a side view.
  • 4(a) and 4(b) are diagrams showing pressure treatment different from the pressure treatment shown in FIG. 4(c).
  • the temperature sensor 1 includes a temperature sensing element 10 including a temperature sensing element 11, a lead wire 15 connected to the temperature sensing element 10, and an elongated covering provided on part of the lead wire 15 and the temperature sensing element 10. 20.
  • the cover 20 is a molded body made of resin and has a rectangular cross section.
  • the temperature sensors 1 are arranged on various objects 3 and used for temperature measurement. This embodiment provides a temperature sensor 1 that is small in size and has improved responsiveness.
  • the direction in which the lead wire 15 is pulled out from the temperature sensing element 10 is defined as the x direction (leading direction).
  • the temperature sensing element side of the temperature sensor 1 of this embodiment is defined as the "front side”
  • the lead wire 15 side of the temperature sensor 1 is defined as the "rear side”.
  • the x direction (pull-out direction) corresponds to the front-rear direction.
  • F indicates the front side
  • R indicates the rear side.
  • the longitudinal direction of the covering 20 corresponds to the x direction.
  • the lateral direction of the cover 20 corresponds to at least one of the y-direction and the z-direction perpendicular to the x-direction.
  • Two lead wires 15 are arranged in a plan view of the temperature sensor 1 of the present embodiment (FIG. 1(a)).
  • a side view of the temperature sensor 1 (FIG. 1(b))
  • one lead wire 15 is arranged in a side view of the temperature sensor 1 (FIG. 1(b)
  • the direction in which the two lead wires 15 are arranged in a plan view of the temperature sensor 1 is defined as the y direction (width direction), and the direction orthogonal to both the x direction and the y direction is defined as the z direction (thickness direction).
  • the first direction in the rectangular cross section of the cover 20 corresponds to the z direction (thickness direction)
  • the second direction orthogonal to the first direction corresponds to the y direction (width direction). do.
  • the dimension in the y direction is defined as "width”, and the dimension in the z direction is defined as "thickness”.
  • the dimension of the temperature sensing element covering region 21 covering the temperature sensing element 10 is smaller than the dimension of the wire covering region 22 covering the lead wire 15. (see FIGS. 1(a) and 1(b)).
  • the temperature sensing element 10 includes a temperature sensing element 11, a lead wire 121 electrically connected to the temperature sensing element 11 at one end, a portion of the lead wire 121 and the temperature sensing element. and a sealing body 122 made of an insulating material that covers 11 .
  • the temperature sensing element 11 has temperature characteristics in electrical resistance, and is, for example, a thermistor.
  • a pair of lead wires 121 are connected to electrodes (not shown) of the temperature sensing element 11 , and both lead out from the temperature sensing element 11 to the rear.
  • the lead wire 121 is, for example, a dumet wire.
  • the pair of lead wires 121 are led out to the outside of a sealing body 122 made of an insulating material such as glass that seals the temperature sensing element 11 .
  • the temperature sensing element 11 is connected to a temperature measurement circuit (not shown) by a lead wire 121 and a lead wire 15 .
  • the temperature of the object 3 on which the temperature sensing element 11 is arranged can be measured by the temperature sensing element 10 and the temperature measurement circuit.
  • Each of the pair of lead wires 15 includes a core wire 15A such as a twisted wire and an insulating coating 15B covering the core wire 15A.
  • the core wire 15A is joined to the lead wire 121 by welding or the like.
  • the insulating coating 15B is made of, for example, fluororesin such as PTFE (polytetrafluoroethylene).
  • the lead wire 15 is connected to a temperature measurement circuit (not shown) through another wire as required.
  • the joint portion 13 shown in FIGS. 1 and 2 is schematically shown as a portion where the core wire 15A of the lead wire 15 and the lead wire 121 are joined.
  • the core wire 15A of the lead wire 15 and the lead wire 121 are joined, for example, by welding such as laser welding or resistance welding, or by soldering.
  • the core wire 15A of the lead wire 15 and the lead wire 121 can also be connected using a crimp terminal.
  • the covering 20 covers a part of the lead wire 15 and the temperature sensing element 10, and protects the temperature sensing element 10 and the lead wire 15 from the ambient environment, external forces, and the like. Since the temperature sensing element 10 is enclosed in the cover 20 , it is arranged on the object 3 through the cover 20 .
  • the covering range 14 of the temperature sensing element 10 covered by the cover 20 includes the entire temperature sensing element 10 and at least the portions where the core wires 15A of the pair of lead wires 15 are exposed from the insulating coating 15B.
  • the front end 20F of the cover 20 is located forward of the front end 10F of the temperature sensing element 10. As shown in FIG. A rear end 20R of the covering 20 is located rearward of the front end of the insulating covering 15B.
  • the x-direction dimension (length) of the covering 20 of the present embodiment is longer than both the y-direction dimension (width) and the z-direction dimension (thickness). Without being limited thereto, the covering 20 may, for example, be wider than it is long.
  • the cover 20 includes a rectangular parallelepiped temperature sensing element covering region 21 covering the temperature sensing element 10 and a rectangular parallelepiped wire covering region 22 covering the lead wire 15 .
  • the temperature sensing element covering area 21 and the wire covering area 22 are integrally formed.
  • the covering 20 is made of fluororesin such as PTFE or PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer), and has heat shrinkability.
  • the temperature sensing element covering region 21 is set to have a thickness t1 that is sufficient to cover the entire temperature sensing element 11 with the outer dimension d1 of the temperature sensing element 11 as a reference.
  • the wire covering region 22 is set to a thickness t2 sufficient to cover the entire circumference of the insulating covering 15B, based on the maximum outer diameter of the single lead wire 15, that is, the outer diameter d2 of the single insulating covering 15B. there is The inner diameter of the covering 20 is set close to the outer diameter of the insulating covering 15B.
  • the thickness t1 of the thermosensor covered area 21 is set thinner than the thickness t2 of the wire covered area 22 . This is based on the difference in the dimensions of the objects on which the temperature sensing element covering region 21 and the wire covering region 22 are based. That is, the outer dimension d1 of the temperature sensing element 11 is smaller than the outer diameter d2 of the insulating coating 15B, so the thickness t1 is thinner than the thickness t2. In addition, since the outer dimension d1 of the temperature sensing element 11 of this embodiment is sufficiently smaller than the outer diameter d2 of the insulating coating 15B, the thickness of the resin portion is added to the outer dimension d1 of the temperature sensing element 11. The thickness t1 of the entire temperature-sensitive element covering region 21 is thinner than the outer diameter d2 of the insulating covering 15B.
  • the diameter of the lead wire 121 of this embodiment is set smaller than the external dimension d1 of the temperature sensing element 11 .
  • a boundary B between the temperature sensing element covered area 21 and the wire covered area 22 can be set, for example, in a section where the lead wire 121 extends from the temperature sensing element 11 to the joint portion 13 .
  • the temperature sensing element covered area 21 includes at least the temperature sensing element 11 and the sealing body 122 .
  • the wire covering region 22 includes at least the joint portion 13 and the end portion of the insulating covering 15B. Since the joint portion 13 is included in the wire covering region 22 which is thicker than the temperature sensing element covering region 21, the welded portion, solder, crimp terminal, etc. can be encapsulated in the resin regardless of the joining means. .
  • the temperature sensing element covered area 21 and the wire covered area 22 have different thicknesses t1 and t2, and also different widths.
  • the width of the temperature sensing element 11 is smaller than the sum of the widths of the pair of lead wires 15 arranged in the y direction. Therefore, the width w1 of the temperature sensing element covering region 21 based on the width of the temperature sensitive element 11 is set narrower than the width w2 of the wire covering region 22 based on the overall width of the pair of lead wires 15. .
  • each of the pair of lead wires 15 is drawn out linearly rearward from the temperature sensing element 10, and in a plan view of the temperature sensor 1 ( 1(a)), they are arranged symmetrically with respect to the center line extending in the x-direction through the temperature sensing element 11.
  • FIG. 1 Manufacturing method of temperature sensor
  • FIG. 1 of this embodiment although the outer dimensions of the temperature sensing element covering area 21 and the wire covering area 22 are different, they are arranged continuously over the temperature sensing element 10 side and the lead wire 15 side. It can be manufactured using a single tube 4 of constant diameter.
  • the core wire 15A of the lead wire 15 is previously joined to the lead wire 121 drawn out from the sealing body 122 of the temperature sensing element 11 (lead wire joining step S00).
  • a manufacturing process performed by preparing the temperature sensing element 10 and the cylindrical tube 4 will be described below.
  • thermosensitive element housing step S01 a covering range 14 is arranged from the front end 10F of the temperature sensing element 10 to the front end of the insulating covering 15B.
  • the tube 4 is heated to a predetermined temperature by applying heat H from the outside (heating step S02).
  • heat H heat H from the outside
  • a method of heating the tube 4 for example, hot air may be blown onto the tube 4 with a heat gun, or the tube 4 and the covering area 14 may be placed in an electric furnace.
  • the tube 4 is heated to a temperature required for thermal contraction and below the melting point and thermally contracted.
  • the tube 4 is made of PTFE
  • the tube 4 is heated to a temperature close to 327°C, which is the melting point of PTFE, eg, 380°C.
  • the diameter of the tube 4 is reduced by being softened by heating and being thermally shrunk.
  • a constant diameter tube 4 shrinks over its entire length at a predetermined rate depending on the material. At this time, the inside of the tube 4 does not necessarily come into close contact with the temperature sensing element 10 even if the inside of the tube 4 comes in close contact with the lead wire 15 due to the difference in outer dimensions between the temperature sensing element 10 and the lead wire 15 .
  • the tube 4 is formed into the shape of the cover 20 by applying pressure P from the outside to the tube 4 in a softened state (pressurization).
  • molding step S03 For example, by press working as pressure treatment using the mold 5 shown in FIGS. 4A to 4C, the cross section of the tube 4 and the covering range 14 is changed from a substantially circular state to a rectangular state. Change. Then, the covering body 20 is formed by hardening the resin due to heat radiation to the mold 5 or the like.
  • FIG. 4A to 4C schematically show an example of the mold 5.
  • FIG. 5 In the lower die 51 and the upper die 52, there are steps 502 and 503 in the z direction corresponding to the difference in thickness between the thermosensor covering region 21 and the wire covering region 22, and the thermosensor covering region 21 and the wire covering region 22.
  • a step (not shown) is formed in the y direction corresponding to the difference in width between the two.
  • a cavity 50 having a shape corresponding to the outer shape of the covering 20 is formed, as an example of the cross section is shown in FIG. 4(c).
  • the tube 4 on the side of the temperature sensing element 10 is compressed and deformed by being pressed more strongly in the z direction and the y direction than on the side of the lead wire 15 .
  • a relatively thin temperature sensing element covering region 21 and a relatively thick wire covering region 22 are formed by varying the amount of deformation in the z direction on the temperature sensing element 10 side and the lead wire 15 side respectively. .
  • the width since the amount of deformation in the y direction differs between the temperature sensing element 10 side and the lead wire 15 side, a relatively narrow temperature sensing element covering area 21 and a relatively wide wire covering area 22 are formed. is molded.
  • the thickness of the resin covering the temperature sensing element 10 and the lead wire 15 can be adjusted by adjusting the amount of deformation of the tube 4 corresponding to the temperature sensing element covering area 21 and the wire covering area 22 respectively.
  • the z-direction thickness tt1 (FIG. 1B) of the thermosensor covering region 21 at the position of the maximum dimension of the sealing body 122 and the z-direction thickness of the wire covering region 22 at the position of the insulation covering 15B tt2 (FIG. 1(b)) can be set equivalently.
  • the inside of the tube 4 can be sensed by applying stronger pressure on the side of the temperature sensing element 10 due to the pressure treatment. It can be brought into close contact with the temperature element 10 .
  • the resin of the tube 4 can be filled between the pair of lead wires 121 and between the pair of core wires 15A by pressurization, it is possible to contribute to ensuring insulation and mechanical retention. Therefore, it is not necessary to pass the lead wire 121 through a sheath made of an insulating material or apply an insulating coating to the joint portion 13 .
  • the resin that has moved to the front end 4F and the rear end 4B of the tube 4 due to the pressure treatment is molded by the inner wall 501 of the mold 5 and the walls of the mold (not shown) to form end faces 201 and 202 in the x direction. Therefore, even if the openings at the front end 4F and the rear end 4B of the tube 4 are not sufficiently closed only by the thermal contraction of the tube 4 by heat treatment, both openings of the tube 4 can be sealed.
  • the covering area 14 of the temperature sensor 1 can be sealed inside the tube 4 in a gas-tight and water-tight manner. In particular, the opening at the front end of the tube 4 can be reliably sealed by the resin moving forward from the side of the temperature sensing element 10 that is more strongly pressurized.
  • the temperature sensing element 10 would move violently inside the high-temperature, high-pressure mold.
  • the temperature sensing element 10 in which the temperature sensing element 10 is arranged inside the tube 4 and the tube 4 is heated and then pressurized, the temperature sensing element 10 does not move unlike the injection molding.
  • a temperature sensor can be manufactured with a high yield while avoiding damage to the temperature sensing element 10 .
  • the temperature sensor 1 with the cover 20 is removed from the mold 5 (product removal step).
  • the temperature sensor 1 manufactured through the above steps is attached to an appropriate support member so that the flat surface 21S of the temperature sensing element covered region 21 is in contact with the flat surface of the object 3 whose temperature is to be measured. can be done. It is possible to bring the surface 21S of the thermosensor covering region 21 into surface contact with the surface of the object 3 by following it.
  • the z-direction stiffness of the thermosensor covering region 21 is smaller than that of the wire covering region 22 in the z direction. Therefore, when the temperature sensor 1 is installed on the object 3 , the temperature sensing element covering region 21 can be deformed in the z-direction so as to be brought into sufficient surface contact with the object 3 .
  • the rigidity in the y direction is greater than the rigidity in the z direction of the temperature sensing element covering area 21.
  • thermosensor covered region 21 is sandwiched between the object 3 and a member (not shown) facing the object 3 in the z direction, or is pushed against the object 3 in the z direction by a pressing means such as a spring (not shown). If it is pressed to , it is difficult to deform in the z direction.
  • a specific object 3 is, for example, a stator coil of a motor installed in a vehicle. In that case, the thermosensitive element covering region 21 inserted between the intersecting coil wires is pressed between the coil wires to be positioned in the z direction.
  • the object 3 may be an electric wire of an on-vehicle battery, a bus bar of on-vehicle equipment, or the like.
  • the thickness t1 of the thermosensor covered area 21 is thinner than the thickness t2 of the wire covered area 22 . Therefore, compared to a cover having a constant thickness based on the outer diameter of the lead wire 15 from the temperature sensing element 10 side to the lead wire 15 side, the heat capacity of the cover 20 is small and The thickness of the cover 20 between the warm body 11 and the object 3 is reduced. Then, since heat is rapidly conducted from the object 3 to the temperature sensing element 11, the temperature change of the object 3 can be detected by the temperature sensing element 11 with high sensitivity. That is, the responsiveness of the temperature sensor 1 can be improved. In addition, in the covering 20 of the present embodiment, since the width of the temperature sensing element covering region 21 is narrower than the width of the wire covering region 22, the heat capacity is smaller than that of a covering having a constant width. can contribute to
  • the temperature sensor 1 is manufactured by subjecting the tube 4 to heat treatment and pressure treatment. Therefore, due to the thermal contraction of the tube 4 and the compressive deformation of the tube 4, even if the tube 4 with a constant diameter is used, the thickness of the cover 20 differs between the temperature sensing element 10 side and the lead wire 15 side. It can be easily molded. Although it is possible to form the cover 20 from two tubes with different diameters, in that case, the temperature sensing element 10 needs to be passed through a thin tube and the lead wires 15 must be passed through a thick tube, which complicates the manufacturing process. In addition, sealing between a thin tube and a thick tube and filling resin between electric wires arranged inside the thin tube may not always be performed sufficiently.
  • the tube 4 as a single member that is continuously arranged over the temperature sensing element 10 side and the lead wire 15 side, the coverage range of the temperature sensing element 10 and the lead wire 15 is reduced. 14 can be reliably enclosed in the covering 20 . According to the manufacturing method of this embodiment using the tube 4, it is possible to provide the temperature sensor 1 of stable quality with resistance while suppressing the manufacturing cost by reducing the number of parts and simplifying the manufacturing process.
  • the temperature sensing element 10 can be arranged even in a narrow space. 1 can be installed more freely.
  • the surface 21S of the thermosensor covered area 21 is formed flat, unlike the case where the arc-shaped surface of the thermosensor covered area is in line contact with the flat surface of the object 3, the surface 21S of the thermosensor covered area is flat. It is possible to stably bring the temperature sensing element covered region 21 into surface contact with the flat surface. Therefore, the temperature sensor 1 can be easily arranged on the object 3 without variations in the temperature measurement characteristics of the temperature sensor 1 .
  • heat can be received from the object 3 and conducted to the temperature sensing element 11 over the area where the temperature sensing element covering region 21 and the object 3 are in surface contact. Therefore, the amount of heat received increases when the surface of the temperature sensing element covered area 21 is in line contact with the surface of the object 3 , which contributes to the improvement of the measurement accuracy of the temperature sensor 1 .
  • the temperature sensor 1 can be installed even in a place where the width is narrow.
  • the width of the thermosensor covering region 21 is narrow, the heat capacity of the covering 20 can be reduced, which contributes to the improvement of responsiveness.
  • Measurement example 1 An example in which the temperature sensor 1 of the present embodiment is manufactured from the temperature sensing element 10 and the tube 4 by the manufacturing method described above and the thermal time constant is measured is shown.
  • Measurement example 1 The thermal time constant (63.2% response) of the temperature sensor 1 according to Measurement Example 1 was approximately 3.2 seconds as the average value of multiple measurements.
  • the temperature sensor of Comparative Example 1 manufactured by Shibaura Electronics Co., Ltd. which includes the same temperature sensing element and lead wire as the temperature sensing element 10 and lead wire 15 of Measurement Example 1, respectively, and a covering covering them.
  • the thermal time constant is approximately 4 seconds.
  • the cover of Comparative Example 1 has a constant thickness and width from the temperature sensing element side to the lead wire side. In both Measurement Example 1 and Comparative Example 1, the measurement conditions were that the temperature sensor placed at room temperature was placed in water heated to 80°C and stirred, and the temperature measurement values were continuously obtained. ,
  • Measurement example 2 The temperature sensor 1 according to Measurement Example 2 includes a smaller temperature sensing element 10 than the temperature sensing element 10 of the temperature sensor 1 according to Measurement Example 1.
  • FIG. The thermal time constant (63.2% response) of the temperature sensor 1 of Measurement Example 2 was approximately 1.8 seconds as the average value of multiple measurements.
  • the temperature sensor of Comparative Example 2 manufactured by Shibaura Electronics Co., Ltd. which includes the same temperature sensing element and lead wire as the temperature sensing element 10 and lead wire 15 of Measurement Example 2, respectively, and a covering covering them.
  • the thermal time constant is approximately 2 seconds.
  • the cover of Comparative Example 2 has a constant thickness and width from the temperature sensing element side to the lead wire side. Measurement conditions for both Measurement Example 2 and Comparative Example 2 are the same as those described above.
  • the tube 4 as a material for forming the cover 20 has a two-layer structure of an inner layer and an outer layer having a higher melting point than the inner layer and heat shrinkability. good too.
  • FIG. 5 shows a two-layer tube 6 having an inner layer tube 61 as an inner layer and an outer layer tube 62 as an outer layer.
  • the inner layer tube 61 is made of PFA, for example.
  • the outer tube 62 having an inner diameter corresponding to the outer diameter of the inner tube 61 is made of PTFE, for example.
  • the inner tube 61 As heat treatment in the manufacturing process, when the outer tube 62 and the inner tube 61 are heated to a temperature between the melting point of PFA (302 to 310° C.) and the melting point of PTFE (327° C.), for example, 315° C., the inner tube 61 is Although it heat-shrinks, it reaches a molten state, and the outer layer tube 62 heat-shrinks without melting.
  • the inner and outer diameters of the inner layer tube 61 are set so that the covering range 14 of the temperature sensing element 10 and the lead wire 15 is enclosed after the inner layer tube 61 is melted and solidified.
  • the inner and outer diameters of the outer tube 62 are set so that the pressure due to thermal contraction reaches the molten inner tube 61 .
  • the resin of the inner layer tube 61 melted by the heat treatment is pressed by the thermal contraction of the outer layer tube 62 and the press work, and sufficiently enters between the lead wires 121 and the gaps between the joint portions 13 .
  • the melted resin of the inner layer tube 61 solidifies in a state in which it enters between the lead wires 121 and the joint portion 13 without gaps due to heat dissipation in the pressurizing process. Therefore, the inner layer tube 61 more sufficiently seals the temperature sensing element 10 from the front end 10F of the temperature sensing element 10 to the joint portion 13, and ensures more sufficient insulation between the wires.
  • the outer layer tube 62 is joined to the inner layer tube 61 without gaps, and the inner layer tube 61 makes the outer layer tube 61 inside. is constrained from to maintain a rectangular shape. Therefore, the space between the tubes 61 and 62 is sealed, and the surface of the molded cover 20 can be kept flat even after pressing.
  • the width of the cover 20-1 may be set to be constant between the temperature sensing element 10 side and the lead wire 15 side.
  • the width w1-1 of the thermosensor covering region 21-1 is the same as the width w2 of the wire covering region 22.
  • FIG. 7 is configured in the same manner as the temperature sensor 1 of the above embodiment.
  • the temperature sensor 7 can be manufactured through heating treatment and press working using a mold corresponding to the shape of the covering 20-1, as in the procedure of the above embodiment.
  • the width w1 of the temperature sensing element covered region 21 is narrower than the width w2 of the wire covered region 22 as in the above embodiment.
  • the contact area of the covering 20-1 with respect to the surface can be enlarged. By doing so, the measurement accuracy can be further improved by enlarging the heat receiving area from the object 3 to the covering 20-1.
  • the thickness t1 of the thermosensor covering region 21-1 is thinner than the thickness t2 of the wire covering region 22, thereby improving the responsiveness.
  • the covering 20 of the above-described embodiment has a thickness gradually increasing toward the end (front end 20F) of the covering 20 at least in the temperature sensing element covering region 21.
  • the cover 20 having the tapered portion 23 can be molded by using a mold having a shape corresponding to the tapered portion 23 and the tube 4, and following the same procedure as in the above embodiment. Since the cover 20 has the tapered portion 23, the front end side of the cover 20 is particularly thin.
  • the temperature sensor can be easily installed on the object 3 by inserting the front end side into a narrow groove or the like. can.
  • the reduction in the thickness of the tapered portion 23 reduces the heat capacity with respect to the cover 20 having a constant thickness, which contributes to an improvement in responsiveness.
  • the tapered portion 23 can also be employed in the cover 20-1 (FIG. 6) of the modified example.
  • the cover 20 of the above-described embodiment or the cover 20-1 of the modified example includes at least the temperature sensing element covering region 21 with a portion whose width gradually decreases toward the front end 20F. good too.
  • the portion may be a region of gradual reduction in thickness in addition to reduction in width.
  • the thickness of the cover on the temperature sensing element 10 side can be adjusted according to the shape of the installation location such as a narrow groove or a wide gap, regardless of the outer diameter of the lead wire 15. , can be set as appropriate. Therefore, it is possible to improve the degree of freedom in installing the temperature sensor.
  • the shape of the cover can be modified appropriately according to the shape of the installation location.
  • the temperature sensing element covering area 21 thinner than the wire covering area 22 may be shifted in the z direction with respect to the wire covering area 22 .
  • the position of the thermosensor covering area 21 may be shifted in the direction opposite to the direction shown in FIG. 8A with respect to the wire covering area 22 .
  • the temperature sensing element covering area 21 and the wire covering area 22 are arranged to be shifted, the temperature sensing element covering area 21 and the wire covering area 22 can be arranged flush with each other.
  • the position of the temperature sensing element 11 and the position of the lead wire 15 shift in the z-direction as the temperature sensing element covering area 21 and the wire covering area 22 shift.
  • the lead wire 121 is displaced following the relative position between the temperature sensing element 11 and the lead wire 15 . Therefore, the lead line 121 extends obliquely in the z direction with respect to a line perpendicular to the plane of FIG. 8(a).
  • the temperature sensing element covering area 21 may be shifted in the y direction with respect to the wire covering area 22.
  • the temperature sensing element covering area 21 may be shifted in the z direction and shifted in the y direction with respect to the wire covering area 22 .
  • the cover 20-3 shown in FIGS. 9(a) and 9(b) includes a temperature sensing element 10-2 including a pair of lead wires 121 led out from the temperature sensing element 11 in opposite directions on both sides, and a lead wire A pair of lead wires 15 connected to 121 are provided.
  • the cover 20-3 includes a rectangular parallelepiped temperature sensing element covering region 21-3 for covering the temperature sensing element 10 and a pair of rectangular parallelepiped wire covering regions 22-3 for covering the lead wires 15.
  • the wire covering area 22-3 is continuous with both ends of the thermosensitive element covering area 21-3 in the x direction.
  • the thickness t1 of the temperature sensing element covering region 21-3 is thinner than the thickness t2 of the wire covering region 22-3.
  • the width w1 of the thermosensor covering region 21-3 is narrower than the width w2 of the wire covering region 22-3.
  • the thickness of the resin layer on the side of the temperature sensing element 10 is thin, and the distance from the object 3 to the temperature sensing element 11 is short. can.
  • the mold used for press working does not necessarily press the tube 4 from four directions, ie, the vertical direction (z direction) and the horizontal direction (y direction), unlike the mold 5 of the above embodiment.
  • the tube 4 may be pressurized between a substantially plate-like lower die 51-1 and an upper die 52-1. Both the lower mold 51-1 and the upper mold 52-1 are formed with a step (not shown) corresponding to the difference in thickness of the cover 20 between the temperature sensing element 10 side and the lead wire 15 side.
  • the cover 20 having different thicknesses on the side of the temperature sensing element 10 and on the side of the lead wire 15 can be obtained not only by pressing, but also by using a roll forming device 80 as shown in FIG. 10(b). be able to.
  • the material of the cover 20 accommodating the temperature sensing element 10 and part of the lead wire 15 is passed between a pair of rolls 81 arranged at an interval corresponding to the thickness t2, and heated by the pair of rolls 81.
  • an intermediate material 4M that is compressed and deformed to a thickness t2 is obtained.
  • the temperature sensing element 10 side of the intermediate material 4M is passed between a pair of rolls 82 arranged at an interval corresponding to the thickness t1 from the y direction and pressed, the temperature sensing element covering region 21 having the thickness t1 and the thickness A covering with a wire covering area 22 of t2 can be obtained.
  • the axial dimension of the roll 82 corresponds to the x-direction length of the thermosensor covered region 21 .
  • the above-described embodiment can press the tube 4, which is the material of the cover 20, from four directions, up, down, left, and right, using the mold 5 (FIG. 4). Therefore, it is excellent in filling the resin between the lead wires 121 and the joint portion 13 .
  • the tube 4 (FIG. 3) used as a material for the covering 20 and the like does not necessarily have heat shrinkability.
  • the covering 20 and the like can be formed by pressurizing a tube that has been softened and expanded by heating by press working or the like.
  • the covering 20 can also be formed by pressing a laminate composed of a plurality of (for example, three or more) PTFE sheets.
  • the material of the covering 20 and the like is not necessarily limited to the cylindrical tube 4 .
  • the temperature sensing element 10 and a part of the lead wire 15 are housed between a pair of halves obtained by dividing the tube 4 along the axial direction, and the covering body 20 and the like are removed by heat treatment and pressure treatment. Molding is possible.
  • the thickness t1 of the thermosensor covering region 21 may be the same as the thickness t2 of the wire covering region 22, and the width w1 of the thermosensor covering region 21 may be narrower than the width w2 of the wire covering region 22. .
  • the temperature sensing element 11 can be positioned on the object 3 as compared with the case where the widths w1 and w2 are the same. Since they can be brought closer, responsiveness can be improved.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Thermistors And Varistors (AREA)
PCT/JP2021/038098 2021-10-14 2021-10-14 温度センサおよび温度センサの製造方法 Ceased WO2023062787A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US17/758,561 US12618720B2 (en) 2021-10-14 Temperature sensor and method of manufacturing temperature sensor
PCT/JP2021/038098 WO2023062787A1 (ja) 2021-10-14 2021-10-14 温度センサおよび温度センサの製造方法
DE112021000268.6T DE112021000268T5 (de) 2021-10-14 2021-10-14 Temperatursensor und Verfahren zur Herstellung eines Temperatursensors
CN202180007329.9A CN116264841A (zh) 2021-10-14 2021-10-14 温度传感器及温度传感器的制造方法
JP2021576540A JP7058377B1 (ja) 2021-10-14 2021-10-14 温度センサおよび温度センサの製造方法

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DE202023104768U1 (de) * 2023-08-22 2024-11-26 Yageo Nexensos Gmbh Sensorbaugruppe
DE102024113905A1 (de) * 2024-05-17 2025-11-20 Tdk Electronics Ag Gehäuse, Sensor und Anordnung
DE102024113901A1 (de) * 2024-05-17 2025-11-20 Tdk Electronics Ag Sensoranordnung und Verfahren zur Herstellung eines Sensoranordnung
DE102024114918A1 (de) * 2024-05-28 2025-12-04 Tdk Electronics Ag Sensor und Verfahren zur Herstellung eines Sensors
JP7809165B2 (ja) * 2024-06-10 2026-01-30 株式会社芝浦電子 温度センサおよび温度センサの製造方法

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US4934831A (en) * 1989-03-20 1990-06-19 Claud S. Gordon Company Temperature sensing device
JP2006234632A (ja) * 2005-02-25 2006-09-07 Ngk Spark Plug Co Ltd 温度センサ
JP2012211792A (ja) * 2011-03-30 2012-11-01 Mitsubishi Materials Corp 温度センサ
JP2016536565A (ja) * 2012-05-14 2016-11-24 深▲セン▼市敏▲傑▼▲電▼子科技有限公司 表面温度計測の温度センサー
WO2015132832A1 (ja) * 2014-03-07 2015-09-11 株式会社芝浦電子 温度センサ、及び、温度センサの製造方法

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DE112021000268T5 (de) 2023-08-03

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