JPWO2023062787A5 - - Google Patents
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- Publication number
- JPWO2023062787A5 JPWO2023062787A5 JP2021576540A JP2021576540A JPWO2023062787A5 JP WO2023062787 A5 JPWO2023062787 A5 JP WO2023062787A5 JP 2021576540 A JP2021576540 A JP 2021576540A JP 2021576540 A JP2021576540 A JP 2021576540A JP WO2023062787 A5 JPWO2023062787 A5 JP WO2023062787A5
- Authority
- JP
- Japan
- Prior art keywords
- sensing element
- temperature sensing
- covering
- dimension
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 24
- 239000000463 material Substances 0.000 claims 8
- 239000011347 resin Substances 0.000 claims 7
- 229920005989 resin Polymers 0.000 claims 7
- 238000000465 moulding Methods 0.000 claims 5
- 238000010438 heat treatment Methods 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 4
- 239000011810 insulating material Substances 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000003825 pressing Methods 0.000 claims 2
- 230000007423 decrease Effects 0.000 claims 1
- 230000001747 exhibiting effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/038098 WO2023062787A1 (ja) | 2021-10-14 | 2021-10-14 | 温度センサおよび温度センサの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7058377B1 JP7058377B1 (ja) | 2022-04-21 |
| JPWO2023062787A1 JPWO2023062787A1 (https=) | 2023-04-20 |
| JPWO2023062787A5 true JPWO2023062787A5 (https=) | 2023-09-20 |
Family
ID=81291814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021576540A Active JP7058377B1 (ja) | 2021-10-14 | 2021-10-14 | 温度センサおよび温度センサの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7058377B1 (https=) |
| CN (1) | CN116264841A (https=) |
| DE (1) | DE112021000268T5 (https=) |
| WO (1) | WO2023062787A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202023104768U1 (de) * | 2023-08-22 | 2024-11-26 | Yageo Nexensos Gmbh | Sensorbaugruppe |
| DE102024113905A1 (de) * | 2024-05-17 | 2025-11-20 | Tdk Electronics Ag | Gehäuse, Sensor und Anordnung |
| DE102024113901A1 (de) * | 2024-05-17 | 2025-11-20 | Tdk Electronics Ag | Sensoranordnung und Verfahren zur Herstellung eines Sensoranordnung |
| DE102024114918A1 (de) * | 2024-05-28 | 2025-12-04 | Tdk Electronics Ag | Sensor und Verfahren zur Herstellung eines Sensors |
| JP7809165B2 (ja) * | 2024-06-10 | 2026-01-30 | 株式会社芝浦電子 | 温度センサおよび温度センサの製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4934831A (en) * | 1989-03-20 | 1990-06-19 | Claud S. Gordon Company | Temperature sensing device |
| DE10111657A1 (de) * | 2001-03-09 | 2003-01-02 | Heraeus Electro Nite Int | Verfahren zur Herstellung eines Gehäuses für Sensorelemente, sowie Sensor, insbesondere Temperatur-Sensor |
| JP4253642B2 (ja) * | 2005-02-25 | 2009-04-15 | 日本特殊陶業株式会社 | 温度センサ |
| JP5574117B2 (ja) * | 2011-03-30 | 2014-08-20 | 三菱マテリアル株式会社 | 温度センサ |
| WO2013170685A1 (zh) * | 2012-05-14 | 2013-11-21 | 深圳市敏杰电子科技有限公司 | 表面测温温度传感器 |
| US10156483B2 (en) * | 2014-03-07 | 2018-12-18 | Shibaura Electronics Co., Ltd. | Temperature sensor and temperature sensor manufacturing method |
| US10935434B2 (en) * | 2017-03-16 | 2021-03-02 | Shibaura Electronics Co., Ltd. | Temperature sensor |
| JP7099884B2 (ja) * | 2018-06-18 | 2022-07-12 | 矢崎総業株式会社 | 油温センサ |
-
2021
- 2021-10-14 DE DE112021000268.6T patent/DE112021000268T5/de active Pending
- 2021-10-14 JP JP2021576540A patent/JP7058377B1/ja active Active
- 2021-10-14 CN CN202180007329.9A patent/CN116264841A/zh active Pending
- 2021-10-14 WO PCT/JP2021/038098 patent/WO2023062787A1/ja not_active Ceased
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