JP7058377B1 - 温度センサおよび温度センサの製造方法 - Google Patents

温度センサおよび温度センサの製造方法 Download PDF

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Publication number
JP7058377B1
JP7058377B1 JP2021576540A JP2021576540A JP7058377B1 JP 7058377 B1 JP7058377 B1 JP 7058377B1 JP 2021576540 A JP2021576540 A JP 2021576540A JP 2021576540 A JP2021576540 A JP 2021576540A JP 7058377 B1 JP7058377 B1 JP 7058377B1
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Prior art keywords
temperature
covering
sensitive element
lead wire
dimension
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JP2021576540A
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Japanese (ja)
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JPWO2023062787A5 (https=
JPWO2023062787A1 (https=
Inventor
孝正 吉原
満 竹村
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Shibaura Electronics Co Ltd
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Shibaura Electronics Co Ltd
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Publication of JPWO2023062787A1 publication Critical patent/JPWO2023062787A1/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G01K1/18—Special arrangements for conducting heat from the object to the sensitive element for reducing thermal inertia
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G01K1/10—Protective devices, e.g. casings for preventing chemical attack
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Thermistors And Varistors (AREA)
JP2021576540A 2021-10-14 2021-10-14 温度センサおよび温度センサの製造方法 Active JP7058377B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/038098 WO2023062787A1 (ja) 2021-10-14 2021-10-14 温度センサおよび温度センサの製造方法

Publications (3)

Publication Number Publication Date
JP7058377B1 true JP7058377B1 (ja) 2022-04-21
JPWO2023062787A1 JPWO2023062787A1 (https=) 2023-04-20
JPWO2023062787A5 JPWO2023062787A5 (https=) 2023-09-20

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JP2021576540A Active JP7058377B1 (ja) 2021-10-14 2021-10-14 温度センサおよび温度センサの製造方法

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JP (1) JP7058377B1 (https=)
CN (1) CN116264841A (https=)
DE (1) DE112021000268T5 (https=)
WO (1) WO2023062787A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025237621A1 (de) 2024-05-17 2025-11-20 Tdk Electronics Ag Gehäuse für ein messelement eines sensors zur temperaturerfassung
WO2025247609A1 (de) 2024-05-28 2025-12-04 Tdk Electronics Ag Sensor und verfahren zur herstellung eines sensors
JP2025185296A (ja) * 2024-06-10 2025-12-22 株式会社芝浦電子 温度センサおよび温度センサの製造方法
US12618720B2 (en) * 2021-10-14 2026-05-05 Shibaura Electronics Co., Ltd. Temperature sensor and method of manufacturing temperature sensor

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202023104768U1 (de) * 2023-08-22 2024-11-26 Yageo Nexensos Gmbh Sensorbaugruppe
DE102024113901A1 (de) * 2024-05-17 2025-11-20 Tdk Electronics Ag Sensoranordnung und Verfahren zur Herstellung eines Sensoranordnung

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4934831A (en) * 1989-03-20 1990-06-19 Claud S. Gordon Company Temperature sensing device
JP2006234632A (ja) * 2005-02-25 2006-09-07 Ngk Spark Plug Co Ltd 温度センサ
JP2012211792A (ja) * 2011-03-30 2012-11-01 Mitsubishi Materials Corp 温度センサ
WO2015132832A1 (ja) * 2014-03-07 2015-09-11 株式会社芝浦電子 温度センサ、及び、温度センサの製造方法
JP2016536565A (ja) * 2012-05-14 2016-11-24 深▲セン▼市敏▲傑▼▲電▼子科技有限公司 表面温度計測の温度センサー
WO2018167903A1 (ja) * 2017-03-16 2018-09-20 株式会社芝浦電子 温度センサ
JP2019219200A (ja) * 2018-06-18 2019-12-26 矢崎総業株式会社 油温センサ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10111657A1 (de) * 2001-03-09 2003-01-02 Heraeus Electro Nite Int Verfahren zur Herstellung eines Gehäuses für Sensorelemente, sowie Sensor, insbesondere Temperatur-Sensor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4934831A (en) * 1989-03-20 1990-06-19 Claud S. Gordon Company Temperature sensing device
JP2006234632A (ja) * 2005-02-25 2006-09-07 Ngk Spark Plug Co Ltd 温度センサ
JP2012211792A (ja) * 2011-03-30 2012-11-01 Mitsubishi Materials Corp 温度センサ
JP2016536565A (ja) * 2012-05-14 2016-11-24 深▲セン▼市敏▲傑▼▲電▼子科技有限公司 表面温度計測の温度センサー
WO2015132832A1 (ja) * 2014-03-07 2015-09-11 株式会社芝浦電子 温度センサ、及び、温度センサの製造方法
WO2018167903A1 (ja) * 2017-03-16 2018-09-20 株式会社芝浦電子 温度センサ
JP2019219200A (ja) * 2018-06-18 2019-12-26 矢崎総業株式会社 油温センサ

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12618720B2 (en) * 2021-10-14 2026-05-05 Shibaura Electronics Co., Ltd. Temperature sensor and method of manufacturing temperature sensor
WO2025237621A1 (de) 2024-05-17 2025-11-20 Tdk Electronics Ag Gehäuse für ein messelement eines sensors zur temperaturerfassung
WO2025247609A1 (de) 2024-05-28 2025-12-04 Tdk Electronics Ag Sensor und verfahren zur herstellung eines sensors
JP2025185296A (ja) * 2024-06-10 2025-12-22 株式会社芝浦電子 温度センサおよび温度センサの製造方法
JP7809165B2 (ja) 2024-06-10 2026-01-30 株式会社芝浦電子 温度センサおよび温度センサの製造方法

Also Published As

Publication number Publication date
US20240219244A1 (en) 2024-07-04
CN116264841A (zh) 2023-06-16
WO2023062787A1 (ja) 2023-04-20
JPWO2023062787A1 (https=) 2023-04-20
DE112021000268T5 (de) 2023-08-03

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