DE112020000762A5 - Optoelektronisches bauelement, optoelektronische anordnung und verfahren - Google Patents

Optoelektronisches bauelement, optoelektronische anordnung und verfahren Download PDF

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Publication number
DE112020000762A5
DE112020000762A5 DE112020000762.6T DE112020000762T DE112020000762A5 DE 112020000762 A5 DE112020000762 A5 DE 112020000762A5 DE 112020000762 T DE112020000762 T DE 112020000762T DE 112020000762 A5 DE112020000762 A5 DE 112020000762A5
Authority
DE
Germany
Prior art keywords
optoelectronic
arrangement
component
optoelectronic component
optoelectronic arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112020000762.6T
Other languages
English (en)
Inventor
Erwin Lang
Julia STOLZ
Hubert Halbritter
Andreas Rausch
Simon Schwalenberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/EP2020/052191 external-priority patent/WO2020157149A1/de
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112020000762A5 publication Critical patent/DE112020000762A5/de
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
DE112020000762.6T 2019-02-11 2020-02-11 Optoelektronisches bauelement, optoelektronische anordnung und verfahren Pending DE112020000762A5 (de)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
DE102019103365.9 2019-02-11
DE102019103365 2019-02-11
DE102019110499.8 2019-04-23
DE102019110499 2019-04-23
DE102019111767.4 2019-05-07
DE102019111767 2019-05-07
PCT/EP2020/052191 WO2020157149A1 (de) 2019-01-29 2020-01-29 µ-LED, µ-LED ANORDNUNG, DISPLAY UND VERFAHREN ZU SELBEN
EPPCT/EP2020/052191 2020-01-29
PCT/EP2020/053498 WO2020165185A1 (de) 2019-02-11 2020-02-11 Optoelektronisches bauelement, optoelektronische anordnung und verfahren

Publications (1)

Publication Number Publication Date
DE112020000762A5 true DE112020000762A5 (de) 2021-10-28

Family

ID=72043924

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112020000762.6T Pending DE112020000762A5 (de) 2019-02-11 2020-02-11 Optoelektronisches bauelement, optoelektronische anordnung und verfahren

Country Status (6)

Country Link
US (1) US20220140210A1 (de)
JP (1) JP2022520561A (de)
KR (1) KR20210120106A (de)
CN (1) CN113646910A (de)
DE (1) DE112020000762A5 (de)
WO (1) WO2020165185A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021106332A1 (de) 2021-03-16 2022-09-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische baugruppe, displayanordnung und verfahren
TWI826130B (zh) * 2022-11-18 2023-12-11 友達光電股份有限公司 顯示面板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8198109B2 (en) * 2010-08-27 2012-06-12 Quarkstar Llc Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
TWI641125B (zh) * 2017-05-03 2018-11-11 啟端光電股份有限公司 底部發光型微發光二極體顯示器及其修補方法

Also Published As

Publication number Publication date
US20220140210A1 (en) 2022-05-05
CN113646910A (zh) 2021-11-12
WO2020165185A1 (de) 2020-08-20
KR20210120106A (ko) 2021-10-06
JP2022520561A (ja) 2022-03-31

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R082 Change of representative

Representative=s name: SCHEELE JAEGER WETZEL PATENTANWAELTE PARTNERSC, DE

R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0033620000

Ipc: H01L0033600000