DE112015003784B4 - Halbleiter-Leistungsmodul und Halbleiteransteuerungsvorrichtung - Google Patents
Halbleiter-Leistungsmodul und Halbleiteransteuerungsvorrichtung Download PDFInfo
- Publication number
- DE112015003784B4 DE112015003784B4 DE112015003784.5T DE112015003784T DE112015003784B4 DE 112015003784 B4 DE112015003784 B4 DE 112015003784B4 DE 112015003784 T DE112015003784 T DE 112015003784T DE 112015003784 B4 DE112015003784 B4 DE 112015003784B4
- Authority
- DE
- Germany
- Prior art keywords
- terminal
- main
- mutual inductance
- switching element
- main electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/082—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
- H03K17/0828—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit in composite switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/0027—Measuring means of, e.g. currents through or voltages across the switch
Landscapes
- Inverter Devices (AREA)
- Electronic Switches (AREA)
- Emergency Protection Circuit Devices (AREA)
- Power Conversion In General (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-196129 | 2014-09-26 | ||
JP2014196129A JP6373702B2 (ja) | 2014-09-26 | 2014-09-26 | 半導体パワーモジュール及び半導体駆動装置 |
PCT/JP2015/075728 WO2016047455A1 (ja) | 2014-09-26 | 2015-09-10 | 半導体パワーモジュール及び半導体駆動装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE112015003784T5 DE112015003784T5 (de) | 2017-06-01 |
DE112015003784B4 true DE112015003784B4 (de) | 2024-12-12 |
Family
ID=55580982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112015003784.5T Active DE112015003784B4 (de) | 2014-09-26 | 2015-09-10 | Halbleiter-Leistungsmodul und Halbleiteransteuerungsvorrichtung |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6373702B2 (enrdf_load_stackoverflow) |
DE (1) | DE112015003784B4 (enrdf_load_stackoverflow) |
WO (1) | WO2016047455A1 (enrdf_load_stackoverflow) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3442019A4 (en) | 2016-04-06 | 2019-12-04 | Shindengen Electric Manufacturing Co., Ltd. | POWER MODULE |
JP6667630B2 (ja) * | 2016-06-22 | 2020-03-18 | 株式会社日立産機システム | 電力変換装置 |
JP2018200953A (ja) | 2017-05-26 | 2018-12-20 | ルネサスエレクトロニクス株式会社 | 電子装置 |
JP6815517B2 (ja) * | 2017-08-03 | 2021-01-20 | 株式会社日立製作所 | 電力変換装置および電力変換装置を搭載した車両 |
JP2021083262A (ja) * | 2019-11-21 | 2021-05-27 | 株式会社デンソー | インバータ装置 |
CN111416520B (zh) * | 2020-02-25 | 2022-03-18 | 厦门大学 | 基于磁通相消的同步整流占空比丢失补偿方法与变换器 |
JP7286582B2 (ja) | 2020-03-24 | 2023-06-05 | 株式会社東芝 | 半導体装置 |
JP7407675B2 (ja) * | 2020-08-18 | 2024-01-04 | 株式会社 日立パワーデバイス | パワー半導体モジュールおよび電力変換装置 |
JP2023081134A (ja) | 2021-11-30 | 2023-06-09 | 富士電機株式会社 | 半導体モジュール、半導体装置、及び車両 |
JP2023109317A (ja) | 2022-01-27 | 2023-08-08 | 株式会社 日立パワーデバイス | パワー半導体モジュール |
JP2023140611A (ja) * | 2022-03-23 | 2023-10-05 | 株式会社 日立パワーデバイス | 半導体装置、電力変換装置 |
JPWO2023233536A1 (enrdf_load_stackoverflow) * | 2022-05-31 | 2023-12-07 | ||
DE112023000749T5 (de) | 2022-10-13 | 2024-11-14 | Fuji Electric Co., Ltd. | Halbleitermodul |
JP2025043923A (ja) * | 2023-09-19 | 2025-04-01 | 株式会社東芝 | 半導体装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000324846A (ja) | 1999-05-14 | 2000-11-24 | Hitachi Ltd | 電力変換装置 |
JP2007259533A (ja) | 2006-03-22 | 2007-10-04 | Hitachi Ltd | 半導体素子の保護回路 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH098620A (ja) * | 1995-06-20 | 1997-01-10 | Fuji Electric Co Ltd | 絶縁ゲート型バイポーラトランジスタの過電流保護回路 |
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2014
- 2014-09-26 JP JP2014196129A patent/JP6373702B2/ja active Active
-
2015
- 2015-09-10 WO PCT/JP2015/075728 patent/WO2016047455A1/ja active Application Filing
- 2015-09-10 DE DE112015003784.5T patent/DE112015003784B4/de active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000324846A (ja) | 1999-05-14 | 2000-11-24 | Hitachi Ltd | 電力変換装置 |
JP2007259533A (ja) | 2006-03-22 | 2007-10-04 | Hitachi Ltd | 半導体素子の保護回路 |
Also Published As
Publication number | Publication date |
---|---|
JP2016066974A (ja) | 2016-04-28 |
WO2016047455A1 (ja) | 2016-03-31 |
DE112015003784T5 (de) | 2017-06-01 |
JP6373702B2 (ja) | 2018-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R018 | Grant decision by examination section/examining division | ||
R081 | Change of applicant/patentee |
Owner name: MINEBEA POWER SEMICONDUCTOR DEVICE INC., HITAC, JP Free format text: FORMER OWNER: HITACHI POWER SEMICONDUCTOR DEVICE, LTD., HITACHI-SHI, LBARAKI, JP |