DE112014006648A5 - Verfahren zum Bonden von Substraten mit Verteilen eines Verbindungsmaterials durch annähern der Substrate - Google Patents

Verfahren zum Bonden von Substraten mit Verteilen eines Verbindungsmaterials durch annähern der Substrate Download PDF

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Publication number
DE112014006648A5
DE112014006648A5 DE112014006648.6T DE112014006648T DE112014006648A5 DE 112014006648 A5 DE112014006648 A5 DE 112014006648A5 DE 112014006648 T DE112014006648 T DE 112014006648T DE 112014006648 A5 DE112014006648 A5 DE 112014006648A5
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Prior art keywords
substrates
bonding
approximating
spreading
bonding material
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DE112014006648.6T
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English (en)
Inventor
Jürgen Burggraf
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EV Group E Thallner GmbH
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EV Group E Thallner GmbH
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Publication of DE112014006648A5 publication Critical patent/DE112014006648A5/de
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
    • B32B17/10899—Making laminated safety glass or glazing; Apparatus therefor by introducing interlayers of synthetic resin
    • B32B17/10908—Making laminated safety glass or glazing; Apparatus therefor by introducing interlayers of synthetic resin in liquid form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
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    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83102—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus using surface energy, e.g. capillary forces
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83194—Lateral distribution of the layer connectors
    • H—ELECTRICITY
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83862—Heat curing
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83868—Infrared [IR] curing
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83874—Ultraviolet [UV] curing

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US11203182B2 (en) * 2017-01-17 2021-12-21 Sekisui Chemical Co., Ltd. Filling-bonding material, protective sheet-equipped filling-bonding material, laminated body, optical device, and protective panel for optical device
JP7523983B2 (ja) * 2020-07-22 2024-07-29 キオクシア株式会社 半導体装置及び半導体装置の製造方法

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JP2000191985A (ja) * 1998-12-25 2000-07-11 Seiko Epson Corp 部材の貼り合わせ方法、貼り合わせ体の製造方法及び貼り合わせ装置
JP2002285132A (ja) * 2001-03-23 2002-10-03 Omron Corp 部材貼り合わせ方法及びその装置
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JP2004325788A (ja) 2003-04-24 2004-11-18 Sony Corp 光学的検査方法及び光学的検査装置、並びに液晶表示装置の製造方法
CN101317205B (zh) * 2005-11-29 2010-11-03 精工电子有限公司 显示装置的制造方法以及粘合方法
JP4537974B2 (ja) * 2006-04-12 2010-09-08 パナソニック株式会社 部品実装機
US20080216952A1 (en) * 2007-03-06 2008-09-11 Cheng Uei Precision Industry Co., Ltd. Adhesive Method Of Optical Components
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JP2010174077A (ja) * 2009-01-27 2010-08-12 Sekisui Chem Co Ltd 電子部品用接着剤
TWI489565B (zh) * 2009-03-10 2015-06-21 Sekisui Chemical Co Ltd Semiconductor wafer laminated body manufacturing method and semiconductor device
JP2010229272A (ja) * 2009-03-26 2010-10-14 Seiko Epson Corp 接合方法および接合体
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SI2567257T1 (sl) * 2010-05-06 2021-09-30 Immunolight, Llc. Lepilni vezivni sestavek in postopek uporabe
WO2012051003A2 (en) * 2010-10-11 2012-04-19 Henkel Corporation Self-aligning adhesive using solvent and solventless organic resin system in electronic packaging
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JP5612043B2 (ja) * 2012-09-03 2014-10-22 オリジン電気株式会社 接合部材の製造方法及び接合部材製造装置
DE102013113241B4 (de) 2013-11-29 2019-02-21 Ev Group E. Thallner Gmbh Verfahren zum Prägen von Strukturen

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KR20170023816A (ko) 2017-03-06
KR102311945B1 (ko) 2021-10-13
SG11201610458WA (en) 2017-01-27
CN106459676B (zh) 2020-01-10
KR20210018968A (ko) 2021-02-18
CN106459676A (zh) 2017-02-22
JP6495947B2 (ja) 2019-04-03
TW201601204A (zh) 2016-01-01
AT523072B1 (de) 2021-05-15
US9929124B2 (en) 2018-03-27
TWI651771B (zh) 2019-02-21
US20170117247A1 (en) 2017-04-27
JP2017527981A (ja) 2017-09-21
AT523072A5 (de) 2021-05-15

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