JP6495947B2 - 基板の近接により接合材料を分配することで基板を貼り合わせる方法 - Google Patents
基板の近接により接合材料を分配することで基板を貼り合わせる方法 Download PDFInfo
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- JP6495947B2 JP6495947B2 JP2016573584A JP2016573584A JP6495947B2 JP 6495947 B2 JP6495947 B2 JP 6495947B2 JP 2016573584 A JP2016573584 A JP 2016573584A JP 2016573584 A JP2016573584 A JP 2016573584A JP 6495947 B2 JP6495947 B2 JP 6495947B2
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Description
・ 層厚の調節及び/又は
・ ウェッジエラー補償及び/又は
・ 液体分配
に関して自動調節する。
V=t×A
V=t×r2×π=t×(d/2)2×π
である。
s=1−V/V0
である。
m=ρ×V=ρ×t×r2×π=ρ×t×(d/2)2×π
・ 親水性−親水性
・ 疎水性−親水性
・ 親水性−疎水性
・ 誘導結合型プラズマ
・ 容量結合型プラズマ
・ リモートプラズマ
である。
1o,1o′ 第1の接合面
1u 周囲輪郭
2,2′ 第2の基板
2o,2o′ 第2の接合面
2u 周囲輪郭
3,3′,3′′,3′′′,3IV 接合材料
3o,3o′,3o′′,3o′′′,3oIV 液体表面
4,4′ 凸部領域
5 (液滴状の)接合材料
5o 液滴表面
6 凹部領域
7 接合層
8 堆積管
8o 堆積管開口部
t 厚み
G 重力
K 毛管力
D 堆積管直径
Claims (6)
- 第1の下側の基板(1)と第2の上側の基板(2)とを、前記基板(1,2)の間に配置された接合材料(3,5)からなる接合層(7)によって貼り合わせる方法において、
特に次の順序で、次の段階、
− 前記第1の下側の基板(1)に前記接合材料(3,5)をスピン塗布又はスプレー塗布により被覆する段階と、
− 前記第2の上側の基板(2)に前記接合材料(3,5)の1つの液滴を液体の形で施す段階と、
− 前記基板(1,2)を近接することにより前記接合材料(3,5)を前記基板(1,2)の間に分配し、前記分配は、前記液体接合材料(3,5)の毛管力によって自動的に行われ、前記両方の基板(1,2)の一方を、前記液滴と前記第1の下側の基板(1)上の前記接合材料(3,5)との接触後に解放し、それにより厚みtの前記接合層(7)の形を形成し、前記接合材料(3,5)は、余剰にならない量で施される段階と、
を含む方法。 - 前記接合材料(3,5)を、前記接合層(7)の厚みt及び前記基板(1,2)の少なくとも一方の直径により予め設定されている量、特に余剰にならない量で施す、
請求項1に記載の方法。 - 前記接合材料(3,5)を、両方の基板、特に互いに対応する領域に施す、
請求項1又は2に記載の方法。 - 前記分配及び/又は近接を、少なくとも部分的に、前記液体接合材料(3,5)の毛管力により及び/又は前記基板(1,2)の一方の重力Gによるだけで行う、
請求項1から3までのいずれか1項に記載の方法。 - 前記基板(1,2)の接合面(1o,2o)を、前記接合材料(3,5)を施す前に、被覆する及び/又はプラズマで処理する、
請求項1から4までのいずれか1項に記載の方法。 - 前記接合材料(3,5)を、前記分配及び前記基板(1,2)の近接の間及び/又はその後に硬化させる、
請求項1から5までのいずれか1項に記載の方法。
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PCT/EP2014/063603 WO2015197126A1 (de) | 2014-06-26 | 2014-06-26 | Verfahren zum bonden von substraten mit verteilen eines verbindungsmaterials durch annähern der substrate |
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JP2017527981A JP2017527981A (ja) | 2017-09-21 |
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JP2016573584A Active JP6495947B2 (ja) | 2014-06-26 | 2014-06-26 | 基板の近接により接合材料を分配することで基板を貼り合わせる方法 |
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US (1) | US9929124B2 (ja) |
JP (1) | JP6495947B2 (ja) |
KR (2) | KR102311945B1 (ja) |
CN (1) | CN106459676B (ja) |
AT (1) | AT523072B1 (ja) |
DE (1) | DE112014006648A5 (ja) |
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JP7523983B2 (ja) * | 2020-07-22 | 2024-07-29 | キオクシア株式会社 | 半導体装置及び半導体装置の製造方法 |
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JP2000191985A (ja) * | 1998-12-25 | 2000-07-11 | Seiko Epson Corp | 部材の貼り合わせ方法、貼り合わせ体の製造方法及び貼り合わせ装置 |
JP2002285132A (ja) * | 2001-03-23 | 2002-10-03 | Omron Corp | 部材貼り合わせ方法及びその装置 |
TW200305623A (en) * | 2002-04-25 | 2003-11-01 | Unaxis Balzers Ag | Method to produce a wedge-free adhesion-seam |
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JP2004325788A (ja) | 2003-04-24 | 2004-11-18 | Sony Corp | 光学的検査方法及び光学的検査装置、並びに液晶表示装置の製造方法 |
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US20080216952A1 (en) * | 2007-03-06 | 2008-09-11 | Cheng Uei Precision Industry Co., Ltd. | Adhesive Method Of Optical Components |
US20090183819A1 (en) * | 2007-12-27 | 2009-07-23 | Tsutomu Matsuhira | Manufacturing method for a display device |
JP2009289915A (ja) * | 2008-05-28 | 2009-12-10 | Sharp Corp | 半導体装置の製造方法及び製造装置 |
JP2010174077A (ja) * | 2009-01-27 | 2010-08-12 | Sekisui Chem Co Ltd | 電子部品用接着剤 |
TWI489565B (zh) * | 2009-03-10 | 2015-06-21 | Sekisui Chemical Co Ltd | Semiconductor wafer laminated body manufacturing method and semiconductor device |
JP2010229272A (ja) * | 2009-03-26 | 2010-10-14 | Seiko Epson Corp | 接合方法および接合体 |
JP2011133847A (ja) * | 2009-11-27 | 2011-07-07 | Canon Inc | 透光性基板の接着方法及びディスプレイの製造方法 |
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WO2012051003A2 (en) * | 2010-10-11 | 2012-04-19 | Henkel Corporation | Self-aligning adhesive using solvent and solventless organic resin system in electronic packaging |
CN103299416A (zh) * | 2011-01-17 | 2013-09-11 | Ev集团E·索尔纳有限责任公司 | 用于从载体基质剥离产品基质的方法 |
WO2013016859A1 (en) * | 2011-07-30 | 2013-02-07 | Stokvis Tapes (Shanghai) Co. Ltd. | Layered display device and fabrication method thereof |
JP5990037B2 (ja) * | 2012-05-18 | 2016-09-07 | 東京応化工業株式会社 | 重ね合わせ装置および重ね合わせ方法 |
EP2695923B1 (de) * | 2012-08-07 | 2018-07-04 | PiOptix GmbH | Verfahren zur durchsichtigen Verklebung von transparenten Schichten |
JP5612043B2 (ja) * | 2012-09-03 | 2014-10-22 | オリジン電気株式会社 | 接合部材の製造方法及び接合部材製造装置 |
DE102013113241B4 (de) | 2013-11-29 | 2019-02-21 | Ev Group E. Thallner Gmbh | Verfahren zum Prägen von Strukturen |
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2014
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Also Published As
Publication number | Publication date |
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DE112014006648A5 (de) | 2017-01-26 |
WO2015197126A1 (de) | 2015-12-30 |
KR20170023816A (ko) | 2017-03-06 |
KR102311945B1 (ko) | 2021-10-13 |
SG11201610458WA (en) | 2017-01-27 |
CN106459676B (zh) | 2020-01-10 |
KR20210018968A (ko) | 2021-02-18 |
CN106459676A (zh) | 2017-02-22 |
TW201601204A (zh) | 2016-01-01 |
AT523072B1 (de) | 2021-05-15 |
US9929124B2 (en) | 2018-03-27 |
TWI651771B (zh) | 2019-02-21 |
US20170117247A1 (en) | 2017-04-27 |
JP2017527981A (ja) | 2017-09-21 |
AT523072A5 (de) | 2021-05-15 |
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