DE112007002936B8 - Plattierelement und Verfahren zum Herstellen desselben - Google Patents

Plattierelement und Verfahren zum Herstellen desselben Download PDF

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Publication number
DE112007002936B8
DE112007002936B8 DE112007002936T DE112007002936T DE112007002936B8 DE 112007002936 B8 DE112007002936 B8 DE 112007002936B8 DE 112007002936 T DE112007002936 T DE 112007002936T DE 112007002936 T DE112007002936 T DE 112007002936T DE 112007002936 B8 DE112007002936 B8 DE 112007002936B8
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DE
Germany
Prior art keywords
producing
same
plating element
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE112007002936T
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English (en)
Other versions
DE112007002936B4 (de
DE112007002936T5 (de
Inventor
Takashi Nomura
Mitsuru Sakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of DE112007002936T5 publication Critical patent/DE112007002936T5/de
Publication of DE112007002936B4 publication Critical patent/DE112007002936B4/de
Application granted granted Critical
Publication of DE112007002936B8 publication Critical patent/DE112007002936B8/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/1209—Plural particulate metal components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12153—Interconnected void structure [e.g., permeable, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12458—All metal or with adjacent metals having composition, density, or hardness gradient
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/24992—Density or compression of components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE112007002936T 2007-01-04 2007-12-28 Plattierelement und Verfahren zum Herstellen desselben Expired - Fee Related DE112007002936B8 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007000226A JP4895827B2 (ja) 2007-01-04 2007-01-04 めっき部材およびその製造方法
JP2007-000226 2007-01-04
PCT/JP2007/075428 WO2008082004A1 (ja) 2007-01-04 2007-12-28 めっき部材およびその製造方法

Publications (3)

Publication Number Publication Date
DE112007002936T5 DE112007002936T5 (de) 2009-10-08
DE112007002936B4 DE112007002936B4 (de) 2013-07-25
DE112007002936B8 true DE112007002936B8 (de) 2013-10-02

Family

ID=39588664

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112007002936T Expired - Fee Related DE112007002936B8 (de) 2007-01-04 2007-12-28 Plattierelement und Verfahren zum Herstellen desselben

Country Status (5)

Country Link
US (1) US8021761B2 (de)
JP (1) JP4895827B2 (de)
CN (1) CN101522958A (de)
DE (1) DE112007002936B8 (de)
WO (1) WO2008082004A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283303A (ja) * 2009-06-08 2010-12-16 Renesas Electronics Corp 半導体装置及びその製造方法
JP5634149B2 (ja) * 2010-07-16 2014-12-03 ルネサスエレクトロニクス株式会社 半導体装置
JP2012253292A (ja) * 2011-06-07 2012-12-20 Murata Mfg Co Ltd 電子部品
WO2013066454A2 (en) * 2011-08-02 2013-05-10 Massachusetts Institute Of Technology Tuning nano-scale grain size distribution in multilayered alloys electrodeposited using ionic solutions, including a1-mn and similar alloys
JP6201474B2 (ja) * 2013-07-18 2017-09-27 Tdk株式会社 積層コンデンサ
CN112470297B (zh) 2019-06-06 2022-09-06 新唐科技日本株式会社 半导体发光元件以及半导体发光装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19820770A1 (de) * 1998-05-08 1999-11-11 Max Planck Gesellschaft Verfahren zur elektrochemischen Beschichtung eines Substrats oder eines Gegenstandes sowie Gegenstand mit einer nach dem Verfahren hergestellten Beschichtung
DE102005024910A1 (de) * 2005-05-31 2006-12-07 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zur In-Line-Steuerung der Lothöcker-Abscheidung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3579550B2 (ja) * 1996-09-30 2004-10-20 株式会社大和化成研究所 電気・電子回路部品
JP2000174191A (ja) * 1998-12-07 2000-06-23 Hitachi Ltd 半導体装置およびその製造方法
JP2001053211A (ja) * 1999-08-12 2001-02-23 Nec Corp 半導体装置とそのめっき方法
JP4157308B2 (ja) * 2001-06-27 2008-10-01 シャープ株式会社 めっき膜の形成方法及び該方法によりめっき膜が形成された電子部品
JP2003147580A (ja) * 2001-11-13 2003-05-21 Murata Mfg Co Ltd 金属端子、金属端子の製造方法および電子部品
JP2004128399A (ja) 2002-10-07 2004-04-22 Nec Electronics Corp 電子部品
JP4434669B2 (ja) 2003-09-11 2010-03-17 Ｎｅｃエレクトロニクス株式会社 電子部品
JP4185480B2 (ja) * 2004-09-28 2008-11-26 富士通マイクロエレクトロニクス株式会社 積層無鉛めっきを用いた半導体装置及びその製造方法
JP4654895B2 (ja) * 2005-12-05 2011-03-23 住友金属鉱山株式会社 鉛フリーめっき皮膜の形成方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19820770A1 (de) * 1998-05-08 1999-11-11 Max Planck Gesellschaft Verfahren zur elektrochemischen Beschichtung eines Substrats oder eines Gegenstandes sowie Gegenstand mit einer nach dem Verfahren hergestellten Beschichtung
DE102005024910A1 (de) * 2005-05-31 2006-12-07 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zur In-Line-Steuerung der Lothöcker-Abscheidung

Also Published As

Publication number Publication date
DE112007002936B4 (de) 2013-07-25
DE112007002936T5 (de) 2009-10-08
US8021761B2 (en) 2011-09-20
US20100040899A1 (en) 2010-02-18
CN101522958A (zh) 2009-09-02
JP2008166645A (ja) 2008-07-17
JP4895827B2 (ja) 2012-03-14
WO2008082004A1 (ja) 2008-07-10

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R018 Grant decision by examination section/examining division
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Representative=s name: KUHNEN & WACKER PATENT- UND RECHTSANWALTSBUERO, DE

R020 Patent grant now final

Effective date: 20131026

R084 Declaration of willingness to licence
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee