DE1071170B - - Google Patents

Info

Publication number
DE1071170B
DE1071170B DENDAT1071170D DE1071170DA DE1071170B DE 1071170 B DE1071170 B DE 1071170B DE NDAT1071170 D DENDAT1071170 D DE NDAT1071170D DE 1071170D A DE1071170D A DE 1071170DA DE 1071170 B DE1071170 B DE 1071170B
Authority
DE
Germany
Prior art keywords
insulating
lie
components
marked
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DENDAT1071170D
Other languages
German (de)
English (en)
Publication date
Publication of DE1071170B publication Critical patent/DE1071170B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DENDAT1071170D Pending DE1071170B (enrdf_load_stackoverflow)

Publications (1)

Publication Number Publication Date
DE1071170B true DE1071170B (enrdf_load_stackoverflow) 1959-12-17

Family

ID=595917

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT1071170D Pending DE1071170B (enrdf_load_stackoverflow)

Country Status (1)

Country Link
DE (1) DE1071170B (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3501710A1 (de) * 1985-01-19 1986-07-24 Allied Corp., Morristown, N.J. Leiterplatte mit integralen positioniermitteln
EP0797379A3 (de) * 1996-03-18 1998-01-07 KRONE Aktiengesellschaft Leiterplatte und Verfahren zum lagegegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte
EP0761075A4 (en) * 1994-05-25 1998-09-23 Univ James Cook PCB SOCKET
EP2117285A1 (de) * 2008-04-29 2009-11-11 Siemens Aktiengesellschaft Österreich Schaltungsträger zur Aufnahme eines Ferrit-Bauelements

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB758688A (en) * 1953-04-07 1956-10-10 T S Skillman And Company Pty L Improvements in printed circuit arrangements
US2777039A (en) * 1954-06-29 1957-01-08 Standard Coil Prod Co Inc Resistor elements adapted for use in connection with printed circuits
GB784709A (en) * 1953-08-13 1957-10-16 Standard Coil Prod Co Inc Fixed frequency amplifier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB758688A (en) * 1953-04-07 1956-10-10 T S Skillman And Company Pty L Improvements in printed circuit arrangements
GB784709A (en) * 1953-08-13 1957-10-16 Standard Coil Prod Co Inc Fixed frequency amplifier
US2777039A (en) * 1954-06-29 1957-01-08 Standard Coil Prod Co Inc Resistor elements adapted for use in connection with printed circuits

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3501710A1 (de) * 1985-01-19 1986-07-24 Allied Corp., Morristown, N.J. Leiterplatte mit integralen positioniermitteln
US4688867A (en) * 1985-01-19 1987-08-25 Allied Corporation Circuit board with integral positioning means
EP0761075A4 (en) * 1994-05-25 1998-09-23 Univ James Cook PCB SOCKET
EP0797379A3 (de) * 1996-03-18 1998-01-07 KRONE Aktiengesellschaft Leiterplatte und Verfahren zum lagegegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte
US5999412A (en) * 1996-03-18 1999-12-07 Krone Aktiengesellschaft Printed-circuit board and method for the precise assembly and soldering of electronic components on the surface of the printed-circuit board
EP2117285A1 (de) * 2008-04-29 2009-11-11 Siemens Aktiengesellschaft Österreich Schaltungsträger zur Aufnahme eines Ferrit-Bauelements

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