DE10394158D2 - Integriertes Halbleitermodul mit einem Markerierungsbereich - Google Patents

Integriertes Halbleitermodul mit einem Markerierungsbereich

Info

Publication number
DE10394158D2
DE10394158D2 DE10394158T DE10394158T DE10394158D2 DE 10394158 D2 DE10394158 D2 DE 10394158D2 DE 10394158 T DE10394158 T DE 10394158T DE 10394158 T DE10394158 T DE 10394158T DE 10394158 D2 DE10394158 D2 DE 10394158D2
Authority
DE
Germany
Prior art keywords
semiconductor module
integrated semiconductor
marking area
marking
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10394158T
Other languages
English (en)
Inventor
Manfred Proell
Stephan Schroeder
Campenhausen Aurel Von
Joerg Kliewer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE10394158T priority Critical patent/DE10394158D2/de
Application granted granted Critical
Publication of DE10394158D2 publication Critical patent/DE10394158D2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE10394158T 2002-12-17 2003-12-10 Integriertes Halbleitermodul mit einem Markerierungsbereich Expired - Fee Related DE10394158D2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10394158T DE10394158D2 (de) 2002-12-17 2003-12-10 Integriertes Halbleitermodul mit einem Markerierungsbereich

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10259049A DE10259049A1 (de) 2002-12-17 2002-12-17 Integriertes Halbleitermodul
PCT/DE2003/004061 WO2004055894A1 (de) 2002-12-17 2003-12-10 Integriertes halbleitermodul mit einem markerierungsbereich
DE10394158T DE10394158D2 (de) 2002-12-17 2003-12-10 Integriertes Halbleitermodul mit einem Markerierungsbereich

Publications (1)

Publication Number Publication Date
DE10394158D2 true DE10394158D2 (de) 2005-11-03

Family

ID=32519027

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10259049A Withdrawn DE10259049A1 (de) 2002-12-17 2002-12-17 Integriertes Halbleitermodul
DE10394158T Expired - Fee Related DE10394158D2 (de) 2002-12-17 2003-12-10 Integriertes Halbleitermodul mit einem Markerierungsbereich

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10259049A Withdrawn DE10259049A1 (de) 2002-12-17 2002-12-17 Integriertes Halbleitermodul

Country Status (3)

Country Link
AU (1) AU2003296524A1 (de)
DE (2) DE10259049A1 (de)
WO (1) WO2004055894A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107492539B (zh) * 2016-06-12 2019-11-01 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法和水印识别方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5771151A (en) * 1980-10-22 1982-05-01 Nec Corp Pakage for semiconductor device
JPS57122544A (en) * 1981-01-23 1982-07-30 Hitachi Ltd Semiconductor device
JPS57147254A (en) * 1981-03-06 1982-09-11 Mitsubishi Electric Corp Electronic component part
JPS5817640A (ja) * 1981-07-24 1983-02-01 Mitsubishi Electric Corp 半導体装置
JPS59175751A (ja) * 1983-03-26 1984-10-04 Mitsubishi Electric Corp 樹脂封止形半導体装置
US4510673A (en) * 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
JPS61117853A (ja) * 1984-11-14 1986-06-05 Oki Electric Ind Co Ltd 集積回路の表示方法
JPS61177748A (ja) * 1985-02-04 1986-08-09 Hitachi Ltd 電子部品
JP2844857B2 (ja) * 1990-06-21 1999-01-13 ソニー株式会社 混成集積回路の製造装置
KR950010865B1 (ko) * 1992-11-27 1995-09-25 금성일렉트론주식회사 공정 데이타 확인/분석이 용이한 반도체 패키지
US5801067A (en) * 1993-10-27 1998-09-01 Ronald Shaw Method for recording and identifying integrated circuit chips and the like
US5984190A (en) * 1997-05-15 1999-11-16 Micron Technology, Inc. Method and apparatus for identifying integrated circuits
US6049624A (en) * 1998-02-20 2000-04-11 Micron Technology, Inc. Non-lot based method for assembling integrated circuit devices
AU2001272081A1 (en) * 2000-02-28 2001-09-03 Ericsson Inc. Integrated circuit package with device specific data storage

Also Published As

Publication number Publication date
AU2003296524A1 (en) 2004-07-09
DE10259049A1 (de) 2004-07-15
WO2004055894A1 (de) 2004-07-01

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee