JPS57122544A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57122544A
JPS57122544A JP56007945A JP794581A JPS57122544A JP S57122544 A JPS57122544 A JP S57122544A JP 56007945 A JP56007945 A JP 56007945A JP 794581 A JP794581 A JP 794581A JP S57122544 A JPS57122544 A JP S57122544A
Authority
JP
Japan
Prior art keywords
bar code
type
identifying
automatically
thoroughly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56007945A
Other languages
Japanese (ja)
Inventor
Shuichi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56007945A priority Critical patent/JPS57122544A/en
Publication of JPS57122544A publication Critical patent/JPS57122544A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To thoroughly automate with a testing step by providing an identifying mark made of a bar code at a part (side face) of a package, and optically discriminating the type of a semiconductor device, thereby automatically and accurately identifying the devices of small quantity and many kinds. CONSTITUTION:An element type identification bar code 16 is printed on the side face of a package 10 mounted with and sealed from a pellet. A photosensor 18 is mounted as an identifying unit at the side faced with the side formed with the bar code 16 to detect the reflecting light of the light projected to the bar code 16, thereby automatically optically identifying the type to discriminate it. Subsequently, a controller is driven by the identification information, an optimum test program is, for example, automatically loaded, and the step is then performed. In this manner, the devices of small quantity and many kinds can be recognized, and discriminated for each type, and can be automated thoroughly with the other steps.
JP56007945A 1981-01-23 1981-01-23 Semiconductor device Pending JPS57122544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56007945A JPS57122544A (en) 1981-01-23 1981-01-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56007945A JPS57122544A (en) 1981-01-23 1981-01-23 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57122544A true JPS57122544A (en) 1982-07-30

Family

ID=11679625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56007945A Pending JPS57122544A (en) 1981-01-23 1981-01-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57122544A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS632888A (en) * 1986-06-23 1988-01-07 Mitsubishi Metal Corp Group management system for single crystal pulling-up device
JPS639138U (en) * 1986-07-03 1988-01-21
WO2004055894A1 (en) * 2002-12-17 2004-07-01 Infineon Technologies Ag Integrated semiconductor module comprising an identification region
KR100839003B1 (en) * 1997-05-15 2008-06-18 마이크론 테크놀로지 인코포레이티드 Method and apparatus for identifying integrated circuits
US9430685B2 (en) 2006-12-29 2016-08-30 Intel Corporation Substrate markings

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5210772B2 (en) * 1974-08-16 1977-03-26
JPS5771151A (en) * 1980-10-22 1982-05-01 Nec Corp Pakage for semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5210772B2 (en) * 1974-08-16 1977-03-26
JPS5771151A (en) * 1980-10-22 1982-05-01 Nec Corp Pakage for semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS632888A (en) * 1986-06-23 1988-01-07 Mitsubishi Metal Corp Group management system for single crystal pulling-up device
JPH0751476B2 (en) * 1986-06-23 1995-06-05 三菱マテリアル株式会社 Group control system for single crystal pulling equipment
JPS639138U (en) * 1986-07-03 1988-01-21
KR100839003B1 (en) * 1997-05-15 2008-06-18 마이크론 테크놀로지 인코포레이티드 Method and apparatus for identifying integrated circuits
USRE40623E1 (en) 1997-05-15 2009-01-20 Micron Technology, Inc. Method and apparatus for identifying integrated circuits
WO2004055894A1 (en) * 2002-12-17 2004-07-01 Infineon Technologies Ag Integrated semiconductor module comprising an identification region
US9430685B2 (en) 2006-12-29 2016-08-30 Intel Corporation Substrate markings

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