JPS57147254A - Electronic component part - Google Patents

Electronic component part

Info

Publication number
JPS57147254A
JPS57147254A JP56031948A JP3194881A JPS57147254A JP S57147254 A JPS57147254 A JP S57147254A JP 56031948 A JP56031948 A JP 56031948A JP 3194881 A JP3194881 A JP 3194881A JP S57147254 A JPS57147254 A JP S57147254A
Authority
JP
Japan
Prior art keywords
display
electronic component
machine
symbol
component part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56031948A
Other languages
Japanese (ja)
Inventor
Akira Komiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56031948A priority Critical patent/JPS57147254A/en
Publication of JPS57147254A publication Critical patent/JPS57147254A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Details Of Resistors (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To efficiently and accurately identify the display of an electronic component part by describing the display on the electronic part with a symbol capable of readily reading and recognizing by a machine. CONSTITUTION:A display is described on the surface of an integrated circuit element as an electronic part with a symbol 3 capable of reading and recognizing by a machine. The symbol used for the display includes a bar code 3, a letter of OCR-A format 4. In this manner, the display described on the electronic part can be readily, rapidly and accurately read and recognized with a simple and inexpensive machine.
JP56031948A 1981-03-06 1981-03-06 Electronic component part Pending JPS57147254A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56031948A JPS57147254A (en) 1981-03-06 1981-03-06 Electronic component part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56031948A JPS57147254A (en) 1981-03-06 1981-03-06 Electronic component part

Publications (1)

Publication Number Publication Date
JPS57147254A true JPS57147254A (en) 1982-09-11

Family

ID=12345179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56031948A Pending JPS57147254A (en) 1981-03-06 1981-03-06 Electronic component part

Country Status (1)

Country Link
JP (1) JPS57147254A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60183445U (en) * 1984-05-16 1985-12-05 ロ−ム株式会社 Package type electronic components
JPH0529986U (en) * 1991-03-13 1993-04-20 テイーデイーケイ株式会社 Electronic component storage case
WO2004055894A1 (en) * 2002-12-17 2004-07-01 Infineon Technologies Ag Integrated semiconductor module comprising an identification region
EP2251834A1 (en) * 2006-02-13 2010-11-17 Jacob Weitman Method and means for delivering, handling and using coded information

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60183445U (en) * 1984-05-16 1985-12-05 ロ−ム株式会社 Package type electronic components
JPH0529986U (en) * 1991-03-13 1993-04-20 テイーデイーケイ株式会社 Electronic component storage case
WO2004055894A1 (en) * 2002-12-17 2004-07-01 Infineon Technologies Ag Integrated semiconductor module comprising an identification region
EP2251834A1 (en) * 2006-02-13 2010-11-17 Jacob Weitman Method and means for delivering, handling and using coded information

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