DE10354007A1 - Verfahren zur Herstellung eines Dünnschichtkondensators mit niedrigem Leckstrom und hoher Durchschlagspannung - Google Patents
Verfahren zur Herstellung eines Dünnschichtkondensators mit niedrigem Leckstrom und hoher Durchschlagspannung Download PDFInfo
- Publication number
- DE10354007A1 DE10354007A1 DE2003154007 DE10354007A DE10354007A1 DE 10354007 A1 DE10354007 A1 DE 10354007A1 DE 2003154007 DE2003154007 DE 2003154007 DE 10354007 A DE10354007 A DE 10354007A DE 10354007 A1 DE10354007 A1 DE 10354007A1
- Authority
- DE
- Germany
- Prior art keywords
- dielectric material
- electrode
- plating
- plating electrode
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 34
- 230000015556 catabolic process Effects 0.000 title abstract description 13
- 238000002360 preparation method Methods 0.000 title abstract 3
- 238000005516 engineering process Methods 0.000 title description 2
- 238000007747 plating Methods 0.000 claims abstract description 114
- 239000003989 dielectric material Substances 0.000 claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 229920002120 photoresistant polymer Polymers 0.000 claims description 36
- 239000010409 thin film Substances 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 238000005253 cladding Methods 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 7
- 230000008020 evaporation Effects 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 238000000206 photolithography Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 5
- 239000003973 paint Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 75
- 238000003801 milling Methods 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 239000010408 film Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 238000007740 vapor deposition Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 101100434911 Mus musculus Angpt1 gene Proteins 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002/336208 | 2002-11-20 | ||
| JP2002336208A JP2004172348A (ja) | 2002-11-20 | 2002-11-20 | 薄膜コンデンサの形成方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10354007A1 true DE10354007A1 (de) | 2004-06-17 |
Family
ID=32321797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2003154007 Ceased DE10354007A1 (de) | 2002-11-20 | 2003-11-19 | Verfahren zur Herstellung eines Dünnschichtkondensators mit niedrigem Leckstrom und hoher Durchschlagspannung |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2004172348A (zh) |
| CN (1) | CN1311484C (zh) |
| DE (1) | DE10354007A1 (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100740436B1 (ko) | 2005-10-28 | 2007-07-19 | 주식회사 코미코 | 전해 도금 방식을 이용한 세라믹 소자의 전극 형성 방법 |
| JP4453711B2 (ja) | 2007-03-30 | 2010-04-21 | Ｔｄｋ株式会社 | 薄膜部品及び製造方法 |
| CN110648844B (zh) * | 2019-09-26 | 2021-07-23 | 浙江星隆电子材料有限公司 | 一种金属化薄膜的制备方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3123367B2 (ja) * | 1994-11-17 | 2001-01-09 | 松下電器産業株式会社 | 厚膜コンデンサ素子およびその製造方法 |
| US20020072189A1 (en) * | 1999-12-17 | 2002-06-13 | Haroun Baher S. | Via capacitor |
| CN1377050A (zh) * | 2001-03-26 | 2002-10-30 | 光颉科技股份有限公司 | 制造复合式无源元件的方法 |
-
2002
- 2002-11-20 JP JP2002336208A patent/JP2004172348A/ja not_active Withdrawn
-
2003
- 2003-11-10 CN CNB2003101156108A patent/CN1311484C/zh not_active Expired - Fee Related
- 2003-11-19 DE DE2003154007 patent/DE10354007A1/de not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN1311484C (zh) | 2007-04-18 |
| CN1503284A (zh) | 2004-06-09 |
| JP2004172348A (ja) | 2004-06-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8131 | Rejection |