DE102023102543A1 - Leiterrahmen einer Halbleitervorrichtung, integrierter Leiterrahmen einer Halbleitervorrichtung und Halbleitervorrichtung - Google Patents

Leiterrahmen einer Halbleitervorrichtung, integrierter Leiterrahmen einer Halbleitervorrichtung und Halbleitervorrichtung Download PDF

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Publication number
DE102023102543A1
DE102023102543A1 DE102023102543.0A DE102023102543A DE102023102543A1 DE 102023102543 A1 DE102023102543 A1 DE 102023102543A1 DE 102023102543 A DE102023102543 A DE 102023102543A DE 102023102543 A1 DE102023102543 A1 DE 102023102543A1
Authority
DE
Germany
Prior art keywords
terminals
tip end
semiconductor device
lead frame
recess portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102023102543.0A
Other languages
German (de)
English (en)
Inventor
Kazufumi Oki
Shogo Shibata
Shuhei Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE102023102543A1 publication Critical patent/DE102023102543A1/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/438—Shapes or dispositions of side rails, e.g. having holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
DE102023102543.0A 2022-03-29 2023-02-02 Leiterrahmen einer Halbleitervorrichtung, integrierter Leiterrahmen einer Halbleitervorrichtung und Halbleitervorrichtung Pending DE102023102543A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-053153 2022-03-29
JP2022053153A JP7766537B2 (ja) 2022-03-29 2022-03-29 半導体装置のリードフレーム及び半導体装置の一体型リードフレーム

Publications (1)

Publication Number Publication Date
DE102023102543A1 true DE102023102543A1 (de) 2023-10-05

Family

ID=88019369

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102023102543.0A Pending DE102023102543A1 (de) 2022-03-29 2023-02-02 Leiterrahmen einer Halbleitervorrichtung, integrierter Leiterrahmen einer Halbleitervorrichtung und Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US20230317572A1 (https=)
JP (1) JP7766537B2 (https=)
CN (1) CN116895629A (https=)
DE (1) DE102023102543A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024112603A (ja) * 2023-02-08 2024-08-21 三菱電機株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138343A (ja) 1998-10-30 2000-05-16 Mitsubishi Electric Corp 半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS602777B2 (ja) * 1983-10-21 1985-01-23 株式会社日立製作所 電子装置用リ−ドフレ−ム
JPH05144992A (ja) * 1991-11-18 1993-06-11 Mitsubishi Electric Corp 半導体装置およびその製造方法ならびにその製造に使用されるリードフレームおよびその製造方法
JPH07312403A (ja) * 1994-05-17 1995-11-28 Fujitsu Ltd 半導体装置及びその製造方法及び実装基板
JP3436254B2 (ja) * 2001-03-01 2003-08-11 松下電器産業株式会社 リードフレームおよびその製造方法
JP6988362B2 (ja) * 2017-10-19 2022-01-05 株式会社デンソー 半導体モジュール
US11631623B2 (en) * 2018-09-06 2023-04-18 Mitsubishi Electric Corporation Power semiconductor device and method of manufacturing the same, and power conversion device
JP2020167233A (ja) * 2019-03-28 2020-10-08 太陽誘電株式会社 モジュールおよびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138343A (ja) 1998-10-30 2000-05-16 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
CN116895629A (zh) 2023-10-17
US20230317572A1 (en) 2023-10-05
JP2023146128A (ja) 2023-10-12
JP7766537B2 (ja) 2025-11-10

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R012 Request for examination validly filed
R016 Response to examination communication
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023495000

Ipc: H10W0070400000