JP7766537B2 - 半導体装置のリードフレーム及び半導体装置の一体型リードフレーム - Google Patents

半導体装置のリードフレーム及び半導体装置の一体型リードフレーム

Info

Publication number
JP7766537B2
JP7766537B2 JP2022053153A JP2022053153A JP7766537B2 JP 7766537 B2 JP7766537 B2 JP 7766537B2 JP 2022053153 A JP2022053153 A JP 2022053153A JP 2022053153 A JP2022053153 A JP 2022053153A JP 7766537 B2 JP7766537 B2 JP 7766537B2
Authority
JP
Japan
Prior art keywords
terminal
lead frame
terminals
tip
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022053153A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023146128A (ja
JP2023146128A5 (https=
Inventor
和史 沖
祥吾 柴田
脩平 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2022053153A priority Critical patent/JP7766537B2/ja
Priority to US18/069,699 priority patent/US20230317572A1/en
Priority to DE102023102543.0A priority patent/DE102023102543A1/de
Priority to CN202310297556.0A priority patent/CN116895629A/zh
Publication of JP2023146128A publication Critical patent/JP2023146128A/ja
Publication of JP2023146128A5 publication Critical patent/JP2023146128A5/ja
Application granted granted Critical
Publication of JP7766537B2 publication Critical patent/JP7766537B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/438—Shapes or dispositions of side rails, e.g. having holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2022053153A 2022-03-29 2022-03-29 半導体装置のリードフレーム及び半導体装置の一体型リードフレーム Active JP7766537B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022053153A JP7766537B2 (ja) 2022-03-29 2022-03-29 半導体装置のリードフレーム及び半導体装置の一体型リードフレーム
US18/069,699 US20230317572A1 (en) 2022-03-29 2022-12-21 Lead frame of semiconductor device, integrated-type lead frame of semiconductor device, and semiconductor device
DE102023102543.0A DE102023102543A1 (de) 2022-03-29 2023-02-02 Leiterrahmen einer Halbleitervorrichtung, integrierter Leiterrahmen einer Halbleitervorrichtung und Halbleitervorrichtung
CN202310297556.0A CN116895629A (zh) 2022-03-29 2023-03-24 半导体装置的引线框、半导体装置的一体型引线框及半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022053153A JP7766537B2 (ja) 2022-03-29 2022-03-29 半導体装置のリードフレーム及び半導体装置の一体型リードフレーム

Publications (3)

Publication Number Publication Date
JP2023146128A JP2023146128A (ja) 2023-10-12
JP2023146128A5 JP2023146128A5 (https=) 2024-08-02
JP7766537B2 true JP7766537B2 (ja) 2025-11-10

Family

ID=88019369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022053153A Active JP7766537B2 (ja) 2022-03-29 2022-03-29 半導体装置のリードフレーム及び半導体装置の一体型リードフレーム

Country Status (4)

Country Link
US (1) US20230317572A1 (https=)
JP (1) JP7766537B2 (https=)
CN (1) CN116895629A (https=)
DE (1) DE102023102543A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024112603A (ja) * 2023-02-08 2024-08-21 三菱電機株式会社 半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261228A (ja) 2001-03-01 2002-09-13 Matsushita Electric Ind Co Ltd リードフレーム
JP2019075523A (ja) 2017-10-19 2019-05-16 株式会社デンソー 半導体モジュール
WO2020050325A1 (ja) 2018-09-06 2020-03-12 三菱電機株式会社 パワー半導体装置およびその製造方法、ならびに電力変換装置
JP2020167233A (ja) 2019-03-28 2020-10-08 太陽誘電株式会社 モジュールおよびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS602777B2 (ja) * 1983-10-21 1985-01-23 株式会社日立製作所 電子装置用リ−ドフレ−ム
JPH05144992A (ja) * 1991-11-18 1993-06-11 Mitsubishi Electric Corp 半導体装置およびその製造方法ならびにその製造に使用されるリードフレームおよびその製造方法
JPH07312403A (ja) * 1994-05-17 1995-11-28 Fujitsu Ltd 半導体装置及びその製造方法及び実装基板
JP4073559B2 (ja) 1998-10-30 2008-04-09 三菱電機株式会社 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261228A (ja) 2001-03-01 2002-09-13 Matsushita Electric Ind Co Ltd リードフレーム
JP2019075523A (ja) 2017-10-19 2019-05-16 株式会社デンソー 半導体モジュール
WO2020050325A1 (ja) 2018-09-06 2020-03-12 三菱電機株式会社 パワー半導体装置およびその製造方法、ならびに電力変換装置
JP2020167233A (ja) 2019-03-28 2020-10-08 太陽誘電株式会社 モジュールおよびその製造方法

Also Published As

Publication number Publication date
CN116895629A (zh) 2023-10-17
DE102023102543A1 (de) 2023-10-05
US20230317572A1 (en) 2023-10-05
JP2023146128A (ja) 2023-10-12

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