CN116895629A - 半导体装置的引线框、半导体装置的一体型引线框及半导体装置 - Google Patents

半导体装置的引线框、半导体装置的一体型引线框及半导体装置 Download PDF

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Publication number
CN116895629A
CN116895629A CN202310297556.0A CN202310297556A CN116895629A CN 116895629 A CN116895629 A CN 116895629A CN 202310297556 A CN202310297556 A CN 202310297556A CN 116895629 A CN116895629 A CN 116895629A
Authority
CN
China
Prior art keywords
terminal
semiconductor device
lead frame
end portion
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310297556.0A
Other languages
English (en)
Chinese (zh)
Inventor
冲和史
柴田祥吾
横山脩平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN116895629A publication Critical patent/CN116895629A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/438—Shapes or dispositions of side rails, e.g. having holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
CN202310297556.0A 2022-03-29 2023-03-24 半导体装置的引线框、半导体装置的一体型引线框及半导体装置 Pending CN116895629A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-053153 2022-03-29
JP2022053153A JP7766537B2 (ja) 2022-03-29 2022-03-29 半導体装置のリードフレーム及び半導体装置の一体型リードフレーム

Publications (1)

Publication Number Publication Date
CN116895629A true CN116895629A (zh) 2023-10-17

Family

ID=88019369

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310297556.0A Pending CN116895629A (zh) 2022-03-29 2023-03-24 半导体装置的引线框、半导体装置的一体型引线框及半导体装置

Country Status (4)

Country Link
US (1) US20230317572A1 (https=)
JP (1) JP7766537B2 (https=)
CN (1) CN116895629A (https=)
DE (1) DE102023102543A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024112603A (ja) * 2023-02-08 2024-08-21 三菱電機株式会社 半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS602777B2 (ja) * 1983-10-21 1985-01-23 株式会社日立製作所 電子装置用リ−ドフレ−ム
JPH05144992A (ja) * 1991-11-18 1993-06-11 Mitsubishi Electric Corp 半導体装置およびその製造方法ならびにその製造に使用されるリードフレームおよびその製造方法
JPH07312403A (ja) * 1994-05-17 1995-11-28 Fujitsu Ltd 半導体装置及びその製造方法及び実装基板
JP4073559B2 (ja) 1998-10-30 2008-04-09 三菱電機株式会社 半導体装置
JP3436254B2 (ja) * 2001-03-01 2003-08-11 松下電器産業株式会社 リードフレームおよびその製造方法
JP6988362B2 (ja) * 2017-10-19 2022-01-05 株式会社デンソー 半導体モジュール
US11631623B2 (en) * 2018-09-06 2023-04-18 Mitsubishi Electric Corporation Power semiconductor device and method of manufacturing the same, and power conversion device
JP2020167233A (ja) * 2019-03-28 2020-10-08 太陽誘電株式会社 モジュールおよびその製造方法

Also Published As

Publication number Publication date
DE102023102543A1 (de) 2023-10-05
US20230317572A1 (en) 2023-10-05
JP2023146128A (ja) 2023-10-12
JP7766537B2 (ja) 2025-11-10

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