DE102019120248A1 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung Download PDF

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Publication number
DE102019120248A1
DE102019120248A1 DE102019120248.5A DE102019120248A DE102019120248A1 DE 102019120248 A1 DE102019120248 A1 DE 102019120248A1 DE 102019120248 A DE102019120248 A DE 102019120248A DE 102019120248 A1 DE102019120248 A1 DE 102019120248A1
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Prior art keywords
circuit board
semiconductor element
encapsulation
semiconductor device
semiconductor
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Ceased
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DE102019120248.5A
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German (de)
English (en)
Inventor
Takuya Kadoguchi
Satoshi TAKAHAGI
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Denso Corp
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Toyota Motor Corp
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Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of DE102019120248A1 publication Critical patent/DE102019120248A1/de
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
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    • H01L2924/181—Encapsulation

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