DE102018004619A1 - CMP-Polierverfahren mit eingestellter Verweilzeit - Google Patents
CMP-Polierverfahren mit eingestellter Verweilzeit Download PDFInfo
- Publication number
- DE102018004619A1 DE102018004619A1 DE102018004619.3A DE102018004619A DE102018004619A1 DE 102018004619 A1 DE102018004619 A1 DE 102018004619A1 DE 102018004619 A DE102018004619 A DE 102018004619A DE 102018004619 A1 DE102018004619 A1 DE 102018004619A1
- Authority
- DE
- Germany
- Prior art keywords
- polishing
- polishing pad
- grooves
- wafer
- series
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/0203—Making porous regions on the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201715623204A | 2017-06-14 | 2017-06-14 | |
US15/623,204 | 2017-06-14 | ||
US201715624943A | 2017-06-16 | 2017-06-16 | |
US15/624,943 | 2017-06-16 | ||
US15/725,936 US10861702B2 (en) | 2017-06-14 | 2017-10-05 | Controlled residence CMP polishing method |
US15/725,936 | 2017-10-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102018004619A1 true DE102018004619A1 (de) | 2018-12-20 |
Family
ID=64457733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102018004619.3A Pending DE102018004619A1 (de) | 2017-06-14 | 2018-06-11 | CMP-Polierverfahren mit eingestellter Verweilzeit |
Country Status (8)
Country | Link |
---|---|
US (1) | US10861702B2 (zh) |
JP (1) | JP7181009B2 (zh) |
KR (1) | KR102660719B1 (zh) |
CN (1) | CN109079586B (zh) |
DE (1) | DE102018004619A1 (zh) |
FR (1) | FR3067628B1 (zh) |
SG (1) | SG10201804562RA (zh) |
TW (1) | TWI762639B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210116759A (ko) | 2020-03-13 | 2021-09-28 | 삼성전자주식회사 | Cmp 패드 및 이를 구비하는 화학적 기계적 연마 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5578362A (en) | 1992-08-19 | 1996-11-26 | Rodel, Inc. | Polymeric polishing pad containing hollow polymeric microelements |
US6120366A (en) | 1998-12-29 | 2000-09-19 | United Microelectronics Corp. | Chemical-mechanical polishing pad |
Family Cites Families (58)
Publication number | Priority date | Publication date | Assignee | Title |
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US4037367A (en) | 1975-12-22 | 1977-07-26 | Kruse James A | Grinding tool |
US4450652A (en) * | 1981-09-04 | 1984-05-29 | Monsanto Company | Temperature control for wafer polishing |
JPS60242975A (ja) * | 1984-05-14 | 1985-12-02 | Kanebo Ltd | 平面研磨装置 |
US5076024A (en) | 1990-08-24 | 1991-12-31 | Intelmatec Corporation | Disk polisher assembly |
US5212910A (en) | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
US5527215A (en) | 1992-01-10 | 1996-06-18 | Schlegel Corporation | Foam buffing pad having a finishing surface with a splash reducing configuration |
US5243790A (en) | 1992-06-25 | 1993-09-14 | Abrasifs Vega, Inc. | Abrasive member |
US6135856A (en) * | 1996-01-19 | 2000-10-24 | Micron Technology, Inc. | Apparatus and method for semiconductor planarization |
US5778481A (en) | 1996-02-15 | 1998-07-14 | International Business Machines Corporation | Silicon wafer cleaning and polishing pads |
US5690540A (en) * | 1996-02-23 | 1997-11-25 | Micron Technology, Inc. | Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers |
US5888121A (en) | 1997-09-23 | 1999-03-30 | Lsi Logic Corporation | Controlling groove dimensions for enhanced slurry flow |
US6749714B1 (en) | 1999-03-30 | 2004-06-15 | Nikon Corporation | Polishing body, polisher, polishing method, and method for producing semiconductor device |
US6220942B1 (en) | 1999-04-02 | 2001-04-24 | Applied Materials, Inc. | CMP platen with patterned surface |
JP2001071256A (ja) | 1999-08-31 | 2001-03-21 | Shinozaki Seisakusho:Kk | 研磨パッドの溝形成方法及び装置並びに研磨パッド |
US6827638B2 (en) * | 2000-01-31 | 2004-12-07 | Shin-Etsu Handotai Co., Ltd. | Polishing device and method |
TW479000B (en) | 2000-02-24 | 2002-03-11 | United Microelectronics Corp | Polish pad for polishing semiconductor wafer |
US6749485B1 (en) | 2000-05-27 | 2004-06-15 | Rodel Holdings, Inc. | Hydrolytically stable grooved polishing pads for chemical mechanical planarization |
US6656019B1 (en) | 2000-06-29 | 2003-12-02 | International Business Machines Corporation | Grooved polishing pads and methods of use |
US8062098B2 (en) * | 2000-11-17 | 2011-11-22 | Duescher Wayne O | High speed flat lapping platen |
JP4087581B2 (ja) | 2001-06-06 | 2008-05-21 | 株式会社荏原製作所 | 研磨装置 |
US7169014B2 (en) * | 2002-07-18 | 2007-01-30 | Micron Technology, Inc. | Apparatuses for controlling the temperature of polishing pads used in planarizing micro-device workpieces |
US7377840B2 (en) | 2004-07-21 | 2008-05-27 | Neopad Technologies Corporation | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
US6783436B1 (en) | 2003-04-29 | 2004-08-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with optimized grooves and method of forming same |
US6918824B2 (en) | 2003-09-25 | 2005-07-19 | Novellus Systems, Inc. | Uniform fluid distribution and exhaust system for a chemical-mechanical planarization device |
US7125318B2 (en) * | 2003-11-13 | 2006-10-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a groove arrangement for reducing slurry consumption |
US6843711B1 (en) | 2003-12-11 | 2005-01-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Chemical mechanical polishing pad having a process-dependent groove configuration |
US6955587B2 (en) | 2004-01-30 | 2005-10-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Grooved polishing pad and method |
JP2005262341A (ja) | 2004-03-16 | 2005-09-29 | Noritake Super Abrasive:Kk | Cmpパッドコンディショナー |
US7329174B2 (en) * | 2004-05-20 | 2008-02-12 | Jsr Corporation | Method of manufacturing chemical mechanical polishing pad |
JP2007081322A (ja) | 2005-09-16 | 2007-03-29 | Jsr Corp | 化学機械研磨パッドの製造方法 |
KR100568258B1 (ko) * | 2004-07-01 | 2006-04-07 | 삼성전자주식회사 | 화학적 기계적 연마용 연마 패드 및 이를 이용하는 화학적기계적 연마 장치 |
USD559066S1 (en) | 2004-10-26 | 2008-01-08 | Jsr Corporation | Polishing pad |
US7169029B2 (en) | 2004-12-16 | 2007-01-30 | 3M Innovative Properties Company | Resilient structured sanding article |
JP3769581B1 (ja) | 2005-05-18 | 2006-04-26 | 東洋ゴム工業株式会社 | 研磨パッドおよびその製造方法 |
KR101279819B1 (ko) | 2005-04-12 | 2013-06-28 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 | 방사-편향 연마 패드 |
US7534162B2 (en) | 2005-09-06 | 2009-05-19 | Freescale Semiconductor, Inc. | Grooved platen with channels or pathway to ambient air |
KR20070070094A (ko) * | 2005-12-28 | 2007-07-03 | 제이에스알 가부시끼가이샤 | 화학 기계 연마 패드 및 화학 기계 연마 방법 |
US20080220702A1 (en) | 2006-07-03 | 2008-09-11 | Sang Fang Chemical Industry Co., Ltd. | Polishing pad having surface texture |
JP4909706B2 (ja) | 2006-10-24 | 2012-04-04 | 東洋ゴム工業株式会社 | 研磨パッド |
US20090137187A1 (en) | 2007-11-21 | 2009-05-28 | Chien-Min Sung | Diagnostic Methods During CMP Pad Dressing and Associated Systems |
US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
TWI360459B (en) * | 2008-04-11 | 2012-03-21 | Bestac Advanced Material Co Ltd | A polishing pad having groove structure for avoidi |
KR20110100080A (ko) * | 2010-03-03 | 2011-09-09 | 삼성전자주식회사 | 화학적 기계적 연마 공정용 연마 패드 및 이를 포함하는 화학적 기계적 연마 설비 |
KR101232787B1 (ko) | 2010-08-18 | 2013-02-13 | 주식회사 엘지화학 | 연마 시스템용 연마 패드 |
US9211628B2 (en) | 2011-01-26 | 2015-12-15 | Nexplanar Corporation | Polishing pad with concentric or approximately concentric polygon groove pattern |
TWI492818B (zh) * | 2011-07-12 | 2015-07-21 | Iv Technologies Co Ltd | 研磨墊、研磨方法以及研磨系統 |
US8920219B2 (en) | 2011-07-15 | 2014-12-30 | Nexplanar Corporation | Polishing pad with alignment aperture |
CN103782372A (zh) | 2011-09-15 | 2014-05-07 | 东丽株式会社 | 研磨垫 |
US9067298B2 (en) * | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
WO2014074521A1 (en) | 2012-11-06 | 2014-05-15 | Cabot Microelectronics Corporation | Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith |
US9649742B2 (en) * | 2013-01-22 | 2017-05-16 | Nexplanar Corporation | Polishing pad having polishing surface with continuous protrusions |
US9415479B2 (en) * | 2013-02-08 | 2016-08-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Conductive chemical mechanical planarization polishing pad |
TWM459065U (zh) | 2013-04-29 | 2013-08-11 | Iv Technologies Co Ltd | 硏磨墊以及硏磨系統 |
TWM475334U (en) | 2013-06-07 | 2014-04-01 | Iv Technologies Co Ltd | Polishing pad |
TWI599447B (zh) | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | 具有偏移同心溝槽圖樣之邊緣排除區的cmp拋光墊 |
JP6197580B2 (ja) * | 2013-10-29 | 2017-09-20 | 株式会社Sumco | キャリアプレート及びワークの両面研磨装置 |
TWI549781B (zh) * | 2015-08-07 | 2016-09-21 | 智勝科技股份有限公司 | 研磨墊、研磨系統及研磨方法 |
CN106564004B (zh) * | 2016-11-17 | 2018-10-19 | 湖北鼎龙控股股份有限公司 | 一种抛光垫 |
-
2017
- 2017-10-05 US US15/725,936 patent/US10861702B2/en active Active
-
2018
- 2018-05-11 CN CN201810445987.6A patent/CN109079586B/zh active Active
- 2018-05-13 TW TW107116214A patent/TWI762639B/zh active
- 2018-05-28 KR KR1020180060275A patent/KR102660719B1/ko active IP Right Grant
- 2018-05-30 SG SG10201804562RA patent/SG10201804562RA/en unknown
- 2018-06-11 DE DE102018004619.3A patent/DE102018004619A1/de active Pending
- 2018-06-11 JP JP2018111063A patent/JP7181009B2/ja active Active
- 2018-06-13 FR FR1855172A patent/FR3067628B1/fr active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5578362A (en) | 1992-08-19 | 1996-11-26 | Rodel, Inc. | Polymeric polishing pad containing hollow polymeric microelements |
US6120366A (en) | 1998-12-29 | 2000-09-19 | United Microelectronics Corp. | Chemical-mechanical polishing pad |
Also Published As
Publication number | Publication date |
---|---|
JP7181009B2 (ja) | 2022-11-30 |
FR3067628A1 (fr) | 2018-12-21 |
CN109079586B (zh) | 2021-05-14 |
KR20180136374A (ko) | 2018-12-24 |
TW201905998A (zh) | 2019-02-01 |
SG10201804562RA (en) | 2019-01-30 |
JP2019030956A (ja) | 2019-02-28 |
CN109079586A (zh) | 2018-12-25 |
KR102660719B1 (ko) | 2024-04-26 |
US20180366332A1 (en) | 2018-12-20 |
US10861702B2 (en) | 2020-12-08 |
FR3067628B1 (fr) | 2022-04-01 |
TWI762639B (zh) | 2022-05-01 |
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