DE102017211606A1 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung Download PDF

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Publication number
DE102017211606A1
DE102017211606A1 DE102017211606.4A DE102017211606A DE102017211606A1 DE 102017211606 A1 DE102017211606 A1 DE 102017211606A1 DE 102017211606 A DE102017211606 A DE 102017211606A DE 102017211606 A1 DE102017211606 A1 DE 102017211606A1
Authority
DE
Germany
Prior art keywords
housing
electrode
heat sink
semiconductor device
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102017211606.4A
Other languages
German (de)
English (en)
Inventor
Yasuo Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE102017211606A1 publication Critical patent/DE102017211606A1/de
Granted legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
DE102017211606.4A 2016-07-15 2017-07-07 Halbleitervorrichtung Granted DE102017211606A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016140001A JP6598740B2 (ja) 2016-07-15 2016-07-15 半導体装置
JP2016-140001 2016-07-15

Publications (1)

Publication Number Publication Date
DE102017211606A1 true DE102017211606A1 (de) 2018-01-18

Family

ID=60783084

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102017211606.4A Granted DE102017211606A1 (de) 2016-07-15 2017-07-07 Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US10121719B2 (https=)
JP (1) JP6598740B2 (https=)
CN (1) CN107622987B (https=)
DE (1) DE102017211606A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019135271A1 (de) * 2019-12-19 2021-06-24 Seg Automotive Germany Gmbh Leistungsmodul, Stromrichter und Kraftfahrzeugkomponente
DE102022133512A1 (de) * 2022-12-15 2024-06-20 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Gehäuse, einer leistungselektronischen Baugruppe und mit einem Formkörper

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7183551B2 (ja) * 2018-03-15 2022-12-06 富士電機株式会社 半導体装置
CN120457545A (zh) * 2023-01-11 2025-08-08 三菱电机株式会社 功率模块

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045399A (ja) 2009-11-17 2010-02-25 Mitsubishi Electric Corp パワー半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2816239B2 (ja) * 1990-06-15 1998-10-27 株式会社日立製作所 樹脂封止型半導体装置
JP2000113428A (ja) * 1998-10-08 2000-04-21 Tdk Corp 薄膜デバイス、薄膜磁気ヘッドおよび磁気抵抗効果素子並びにそれらの製造方法
JP2002246515A (ja) * 2001-02-20 2002-08-30 Mitsubishi Electric Corp 半導体装置
JP4007143B2 (ja) * 2002-10-09 2007-11-14 日産自動車株式会社 電子部品、電子部品の製造方法及び製造装置
US8477492B2 (en) * 2010-08-19 2013-07-02 Apple Inc. Formed PCB
JP2014187346A (ja) * 2013-02-22 2014-10-02 Tokyo Electron Ltd 焼結銀被覆膜の作製方法及び焼成装置及び半導体装置
JP6301602B2 (ja) * 2013-07-22 2018-03-28 ローム株式会社 パワーモジュールおよびその製造方法
JP6057926B2 (ja) * 2014-01-09 2017-01-11 三菱電機株式会社 半導体装置
DE102014114808B4 (de) * 2014-10-13 2018-03-08 Infineon Technologies Ag Elektronikmodul und Verfahren zur Herstellung eines Elektronikmoduls

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010045399A (ja) 2009-11-17 2010-02-25 Mitsubishi Electric Corp パワー半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019135271A1 (de) * 2019-12-19 2021-06-24 Seg Automotive Germany Gmbh Leistungsmodul, Stromrichter und Kraftfahrzeugkomponente
DE102022133512A1 (de) * 2022-12-15 2024-06-20 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Gehäuse, einer leistungselektronischen Baugruppe und mit einem Formkörper

Also Published As

Publication number Publication date
US20180019181A1 (en) 2018-01-18
CN107622987B (zh) 2020-04-21
US10121719B2 (en) 2018-11-06
CN107622987A (zh) 2018-01-23
JP6598740B2 (ja) 2019-10-30
JP2018011005A (ja) 2018-01-18

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R084 Declaration of willingness to licence
R016 Response to examination communication
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023420000

Ipc: H10W0040700000

R016 Response to examination communication
R018 Grant decision by examination section/examining division