DE102016114145A1 - Testsystem zur Überprüfung von elektrischen Verbindungen von elektronischen Bauteilen mit einer Leiterplatte - Google Patents

Testsystem zur Überprüfung von elektrischen Verbindungen von elektronischen Bauteilen mit einer Leiterplatte Download PDF

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Publication number
DE102016114145A1
DE102016114145A1 DE102016114145.3A DE102016114145A DE102016114145A1 DE 102016114145 A1 DE102016114145 A1 DE 102016114145A1 DE 102016114145 A DE102016114145 A DE 102016114145A DE 102016114145 A1 DE102016114145 A1 DE 102016114145A1
Authority
DE
Germany
Prior art keywords
circuit board
test system
test
module
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102016114145.3A
Other languages
German (de)
English (en)
Inventor
Thomas Böhler
Matthias Brudermann
Christoph Werle
Markus Wucher
Daniel Kollmer
Adam Ludovic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser Flowtec AG
Original Assignee
Endress and Hauser Flowtec AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser Flowtec AG filed Critical Endress and Hauser Flowtec AG
Priority to DE102016114145.3A priority Critical patent/DE102016114145A1/de
Priority to RU2019105819A priority patent/RU2715045C1/ru
Priority to US16/321,961 priority patent/US10955492B2/en
Priority to PCT/EP2017/067813 priority patent/WO2018024464A1/de
Priority to EP17745998.9A priority patent/EP3491404B1/de
Priority to CN201780048032.0A priority patent/CN109564255B/zh
Publication of DE102016114145A1 publication Critical patent/DE102016114145A1/de
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/55—Testing for incorrect line connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards
    • G01R31/71—Testing of solder joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
DE102016114145.3A 2016-08-01 2016-08-01 Testsystem zur Überprüfung von elektrischen Verbindungen von elektronischen Bauteilen mit einer Leiterplatte Withdrawn DE102016114145A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE102016114145.3A DE102016114145A1 (de) 2016-08-01 2016-08-01 Testsystem zur Überprüfung von elektrischen Verbindungen von elektronischen Bauteilen mit einer Leiterplatte
RU2019105819A RU2715045C1 (ru) 2016-08-01 2017-07-14 Тестовая система для контроля электрических соединений электронных элементов с печатной платой
US16/321,961 US10955492B2 (en) 2016-08-01 2017-07-14 Test system for checking electrical connections of electronic components to a printed circuit board
PCT/EP2017/067813 WO2018024464A1 (de) 2016-08-01 2017-07-14 Testsystem zur überprüfung von elektrischen verbindungen von elektronischen bauteilen mit einer leiterplatte
EP17745998.9A EP3491404B1 (de) 2016-08-01 2017-07-14 Testsystem zur überprüfung von elektrischen verbindungen von elektronischen bauteilen mit einer leiterplatte
CN201780048032.0A CN109564255B (zh) 2016-08-01 2017-07-14 用于对电子构件与电路板的电连接进行查验的测试系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102016114145.3A DE102016114145A1 (de) 2016-08-01 2016-08-01 Testsystem zur Überprüfung von elektrischen Verbindungen von elektronischen Bauteilen mit einer Leiterplatte

Publications (1)

Publication Number Publication Date
DE102016114145A1 true DE102016114145A1 (de) 2018-02-01

Family

ID=59501391

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102016114145.3A Withdrawn DE102016114145A1 (de) 2016-08-01 2016-08-01 Testsystem zur Überprüfung von elektrischen Verbindungen von elektronischen Bauteilen mit einer Leiterplatte

Country Status (6)

Country Link
US (1) US10955492B2 (ru)
EP (1) EP3491404B1 (ru)
CN (1) CN109564255B (ru)
DE (1) DE102016114145A1 (ru)
RU (1) RU2715045C1 (ru)
WO (1) WO2018024464A1 (ru)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113340919A (zh) * 2021-07-02 2021-09-03 南通海舟电子科技有限公司 一种智能控制电路板的控制系统

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016114142A1 (de) * 2016-08-01 2018-02-01 Endress+Hauser Flowtec Ag Leiterplatte mit Kontaktierungsanordnung
CN112986863B (zh) * 2021-02-04 2024-04-12 三一重能股份有限公司 温度检测系统的线路检测方法、装置和电子设备
CN116859291A (zh) * 2022-03-28 2023-10-10 长鑫存储技术有限公司 电源映射检测方法、装置、电子设备及介质
US11892520B2 (en) 2022-03-28 2024-02-06 Changxin Memory Technologies, Inc. Method and device for power supply mapping detection, electronic device, and medium

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0633478A2 (en) 1993-07-05 1995-01-11 SPEA S.r.l. Sistemi per l'Elettronica e l'Automazione Method and device for testing electronic circuit boards
US6259265B1 (en) * 1998-10-13 2001-07-10 Samsung Electronics Co., Ltd. Unified test system and method for testing printed circuit boards
US20060107118A1 (en) * 2004-10-25 2006-05-18 Alperin Joshua N Apparatus to facilitate functional shock and vibration testing of device connections and related method

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4227148A (en) * 1978-08-10 1980-10-07 Century Mfg. Co. External means for increasing the sensitivity of a moving magnet type of meter
RU2020499C1 (ru) * 1991-04-23 1994-09-30 Винницкий политехнический институт Способ обнаружения обрывов и коротких замыканий в электрическом монтаже
US6525555B1 (en) * 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
US6518779B1 (en) * 1997-10-20 2003-02-11 Matsushita Electrical Industrial Do., Ltd. Probe card
US7319341B1 (en) * 2003-08-28 2008-01-15 Altera Corporation Method of maintaining signal integrity across a capacitive coupled solder bump
US6919718B2 (en) 2003-11-10 2005-07-19 Unisys Corporation System for testing a group of IC-chips having a chip holding subassembly that is built-in and loaded/unloaded automatically
JP4277807B2 (ja) * 2005-02-08 2009-06-10 船井電機株式会社 ディスク装置
TWI339737B (en) * 2005-04-27 2011-04-01 Aehr Test Systems Contactor assembly, cartridge, and apparatus and method for testing integrated circuit of device
CN2804873Y (zh) 2005-05-20 2006-08-09 郭红建 简易治具
TWI263293B (en) 2005-09-28 2006-10-01 Star Techn Inc Probe card for integrated circuits
US7557592B2 (en) 2006-06-06 2009-07-07 Formfactor, Inc. Method of expanding tester drive and measurement capability
CN201345474Y (zh) 2008-12-30 2009-11-11 英华达（上海）科技有限公司 具有弹性结构的供电装置
WO2012002935A1 (en) * 2010-06-29 2012-01-05 Teradyne, Inc. Calibrating a channel of a test system
CN103792481B (zh) 2012-11-02 2016-08-03 纬创资通股份有限公司 电路板自动测试装置及电路板自动测试方法
CN103076553A (zh) 2012-12-28 2013-05-01 北京世纪东方国铁科技股份有限公司 一种实装电路板的测试装置
KR20150008707A (ko) * 2013-07-15 2015-01-23 삼성전자주식회사 독출 데이터를 마스킹하는 메모리 장치 및 이의 테스트 방법
CN203825156U (zh) * 2014-05-13 2014-09-10 遂宁市维海电子科技有限公司 一种电路板检测装置
KR20160058521A (ko) * 2014-11-17 2016-05-25 에스케이하이닉스 주식회사 반도체 장치 및 이의 동작 방법
CN204479734U (zh) 2014-12-31 2015-07-15 北京恒源利通电力技术有限公司 故障指示器测试工装
KR102486558B1 (ko) * 2015-06-24 2023-01-10 삼성전자주식회사 회로 기판 및 이를 구비한 반도체 패키지
CN204832257U (zh) 2015-07-16 2015-12-02 国网四川省电力公司乐山供电公司 多功能可移动式试验电源控制箱
CN205049608U (zh) * 2015-09-23 2016-02-24 深圳市依珂芯能源科技有限公司 一种移动电源pcba板测试装置
CN105676110A (zh) 2016-01-27 2016-06-15 系新电子技术（苏州）有限公司 一种电路板测试系统
CN105738797B (zh) 2016-03-31 2019-02-12 上海与德通讯技术有限公司 主板测试组件及测试方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0633478A2 (en) 1993-07-05 1995-01-11 SPEA S.r.l. Sistemi per l'Elettronica e l'Automazione Method and device for testing electronic circuit boards
US6259265B1 (en) * 1998-10-13 2001-07-10 Samsung Electronics Co., Ltd. Unified test system and method for testing printed circuit boards
US20060107118A1 (en) * 2004-10-25 2006-05-18 Alperin Joshua N Apparatus to facilitate functional shock and vibration testing of device connections and related method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113340919A (zh) * 2021-07-02 2021-09-03 南通海舟电子科技有限公司 一种智能控制电路板的控制系统

Also Published As

Publication number Publication date
RU2715045C1 (ru) 2020-02-21
EP3491404A1 (de) 2019-06-05
EP3491404B1 (de) 2020-04-15
US20190265290A1 (en) 2019-08-29
US10955492B2 (en) 2021-03-23
CN109564255B (zh) 2022-01-11
CN109564255A (zh) 2019-04-02
WO2018024464A1 (de) 2018-02-08

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Representative=s name: HAHN, CHRISTIAN, DIPL.-PHYS. DR.RER.NAT., DE

R163 Identified publications notified
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee