DE102014119390A1 - Optoelektronisches Bauelement und Verfahren zu seiner Herstellung - Google Patents

Optoelektronisches Bauelement und Verfahren zu seiner Herstellung Download PDF

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Publication number
DE102014119390A1
DE102014119390A1 DE102014119390.3A DE102014119390A DE102014119390A1 DE 102014119390 A1 DE102014119390 A1 DE 102014119390A1 DE 102014119390 A DE102014119390 A DE 102014119390A DE 102014119390 A1 DE102014119390 A1 DE 102014119390A1
Authority
DE
Germany
Prior art keywords
lead frame
optoelectronic
semiconductor chip
optoelectronic component
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102014119390.3A
Other languages
German (de)
English (en)
Inventor
Matthias Sperl
Tobias Gebuhr
David Racz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102014119390.3A priority Critical patent/DE102014119390A1/de
Priority to PCT/EP2015/080803 priority patent/WO2016102474A1/fr
Publication of DE102014119390A1 publication Critical patent/DE102014119390A1/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
DE102014119390.3A 2014-12-22 2014-12-22 Optoelektronisches Bauelement und Verfahren zu seiner Herstellung Withdrawn DE102014119390A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102014119390.3A DE102014119390A1 (de) 2014-12-22 2014-12-22 Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
PCT/EP2015/080803 WO2016102474A1 (fr) 2014-12-22 2015-12-21 Composant optoélectronique et procédé de fabrication de celui-ci

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014119390.3A DE102014119390A1 (de) 2014-12-22 2014-12-22 Optoelektronisches Bauelement und Verfahren zu seiner Herstellung

Publications (1)

Publication Number Publication Date
DE102014119390A1 true DE102014119390A1 (de) 2016-06-23

Family

ID=55024138

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102014119390.3A Withdrawn DE102014119390A1 (de) 2014-12-22 2014-12-22 Optoelektronisches Bauelement und Verfahren zu seiner Herstellung

Country Status (2)

Country Link
DE (1) DE102014119390A1 (fr)
WO (1) WO2016102474A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016114483A1 (de) * 2016-08-04 2018-02-08 Ic-Haus Gmbh Optoelektronisches Bauelement
DE102016114478A1 (de) * 2016-08-04 2018-02-08 Osram Opto Semiconductors Gmbh Verfahren zum herstellen eines trägers für ein optoelektronisches bauelement
DE102018118762A1 (de) * 2018-08-02 2020-02-06 Osram Opto Semiconductors Gmbh Laserbauelement mit einem Laserchip
DE102018130540A1 (de) * 2018-11-30 2020-06-04 Osram Opto Semiconductors Gmbh Optoelektronisches halbleiterlaserbauelement und verfahren zur herstellung eines optoelektronischen halbleiterlaserbauelements
DE102019119371A1 (de) * 2019-07-17 2021-01-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauteil und verfahren zur herstellung eines bauteils
DE102019220215A1 (de) * 2019-12-19 2021-06-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung von Halbleiterbauelementen und Halbleiterbauelement

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090218588A1 (en) * 2007-12-06 2009-09-03 Paul Panaccione Chip-scale packaged light-emitting devices
DE102009032253A1 (de) * 2009-07-08 2011-01-13 Osram Opto Semiconductors Gmbh Elektronisches Bauteil
US20120313131A1 (en) * 2010-03-30 2012-12-13 Dai Nippon Printing Co., Ltd. Led leadframe or led substrate, semiconductor device, and method for manufacturing led leadframe or led substrate
US20130187188A1 (en) * 2012-01-20 2013-07-25 Nichia Corporation Molded package and light emitting device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100025722A1 (en) * 2006-11-14 2010-02-04 Harison Toshiba Lighting Corp. Light emitting device, its manufacturing method and its mounted substrate
DE102009023854B4 (de) * 2009-06-04 2023-11-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement
JP5383611B2 (ja) * 2010-01-29 2014-01-08 株式会社東芝 Ｌｅｄパッケージ
US9159893B2 (en) * 2010-09-03 2015-10-13 Nichia Corporation Light emitting device including lead having terminal part and exposed part, and method for manufacturing the same
DE102012109905B4 (de) * 2012-10-17 2021-11-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterbauteilen
JP6127468B2 (ja) * 2012-11-22 2017-05-17 日亜化学工業株式会社 発光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090218588A1 (en) * 2007-12-06 2009-09-03 Paul Panaccione Chip-scale packaged light-emitting devices
DE102009032253A1 (de) * 2009-07-08 2011-01-13 Osram Opto Semiconductors Gmbh Elektronisches Bauteil
US20120313131A1 (en) * 2010-03-30 2012-12-13 Dai Nippon Printing Co., Ltd. Led leadframe or led substrate, semiconductor device, and method for manufacturing led leadframe or led substrate
US20130187188A1 (en) * 2012-01-20 2013-07-25 Nichia Corporation Molded package and light emitting device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016114483A1 (de) * 2016-08-04 2018-02-08 Ic-Haus Gmbh Optoelektronisches Bauelement
DE102016114478A1 (de) * 2016-08-04 2018-02-08 Osram Opto Semiconductors Gmbh Verfahren zum herstellen eines trägers für ein optoelektronisches bauelement
DE102018118762A1 (de) * 2018-08-02 2020-02-06 Osram Opto Semiconductors Gmbh Laserbauelement mit einem Laserchip
DE102018130540A1 (de) * 2018-11-30 2020-06-04 Osram Opto Semiconductors Gmbh Optoelektronisches halbleiterlaserbauelement und verfahren zur herstellung eines optoelektronischen halbleiterlaserbauelements
DE102019119371A1 (de) * 2019-07-17 2021-01-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauteil und verfahren zur herstellung eines bauteils
DE102019220215A1 (de) * 2019-12-19 2021-06-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung von Halbleiterbauelementen und Halbleiterbauelement

Also Published As

Publication number Publication date
WO2016102474A1 (fr) 2016-06-30

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee