DE102009042349B4 - Semipolare wurtzitische Gruppe-III-Nitrid basierte Halbleiterschichten und darauf basierende Halbleiterbauelemente - Google Patents
Semipolare wurtzitische Gruppe-III-Nitrid basierte Halbleiterschichten und darauf basierende Halbleiterbauelemente Download PDFInfo
- Publication number
- DE102009042349B4 DE102009042349B4 DE102009042349A DE102009042349A DE102009042349B4 DE 102009042349 B4 DE102009042349 B4 DE 102009042349B4 DE 102009042349 A DE102009042349 A DE 102009042349A DE 102009042349 A DE102009042349 A DE 102009042349A DE 102009042349 B4 DE102009042349 B4 DE 102009042349B4
- Authority
- DE
- Germany
- Prior art keywords
- iii nitride
- group iii
- semipolar
- growth
- semiconductor layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3416—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2902—Materials being Group IVA materials
- H10P14/2905—Silicon, silicon germanium or germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2926—Crystal orientations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3202—Materials thereof
- H10P14/3214—Materials thereof being Group IIIA-VA semiconductors
- H10P14/3216—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3466—Crystal orientation
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009042349A DE102009042349B4 (de) | 2009-09-20 | 2009-09-20 | Semipolare wurtzitische Gruppe-III-Nitrid basierte Halbleiterschichten und darauf basierende Halbleiterbauelemente |
| CN2010800526159A CN102668027A (zh) | 2009-09-20 | 2010-09-16 | 基于半极化纤锌矿型第iii族氮化物的半导体层和基于前者的半导体元件 |
| JP2012530124A JP2013505590A (ja) | 2009-09-20 | 2010-09-16 | 半極性ウルツ鉱型iii族窒化物をベースとする半導体層、及び当該窒化物をベースとする半導体部材 |
| PCT/DE2010/001094 WO2011032546A1 (de) | 2009-09-20 | 2010-09-16 | Semipolare wurtzitische gruppe-iii-nitrid basierte halbleiterschichten und darauf basierende halbleiterbauelemente |
| EP10776926A EP2478551A1 (de) | 2009-09-20 | 2010-09-16 | Semipolare wurtzitische gruppe-iii-nitrid basierte halbleiterschichten und darauf basierende halbleiterbauelemente |
| US13/496,957 US20120217617A1 (en) | 2009-09-20 | 2010-09-16 | Semi-Polar Wurtzite Group III Nitride Based Semiconductor Layers and Semiconductor Components Based Thereon |
| KR1020127009222A KR20120083399A (ko) | 2009-09-20 | 2010-09-16 | 반극성 우르츠광 3족 질화물계 반도체층 및 이를 기반으로 한 반도체 부품 |
| TW099131883A TW201126757A (en) | 2009-09-20 | 2010-09-20 | Semipolar or nonpolar wurtzite group-III nitride layers and semiconductor components based thereon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009042349A DE102009042349B4 (de) | 2009-09-20 | 2009-09-20 | Semipolare wurtzitische Gruppe-III-Nitrid basierte Halbleiterschichten und darauf basierende Halbleiterbauelemente |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE102009042349A1 DE102009042349A1 (de) | 2011-03-31 |
| DE102009042349B4 true DE102009042349B4 (de) | 2011-06-16 |
Family
ID=43480844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102009042349A Expired - Fee Related DE102009042349B4 (de) | 2009-09-20 | 2009-09-20 | Semipolare wurtzitische Gruppe-III-Nitrid basierte Halbleiterschichten und darauf basierende Halbleiterbauelemente |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20120217617A1 (https=) |
| EP (1) | EP2478551A1 (https=) |
| JP (1) | JP2013505590A (https=) |
| KR (1) | KR20120083399A (https=) |
| CN (1) | CN102668027A (https=) |
| DE (1) | DE102009042349B4 (https=) |
| TW (1) | TW201126757A (https=) |
| WO (1) | WO2011032546A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9299560B2 (en) * | 2012-01-13 | 2016-03-29 | Applied Materials, Inc. | Methods for depositing group III-V layers on substrates |
| US9368582B2 (en) | 2013-11-04 | 2016-06-14 | Avogy, Inc. | High power gallium nitride electronics using miscut substrates |
| DE102014102039A1 (de) * | 2014-02-18 | 2015-08-20 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Nitrid-Verbindungshalbleiterschicht |
| WO2018177552A1 (en) * | 2017-03-31 | 2018-10-04 | Cambridge Enterprise Limited | Zincblende structure group iii-nitride |
| CN111448674B (zh) * | 2017-12-05 | 2023-08-22 | 阿卜杜拉国王科技大学 | 用于形成分级纤锌矿iii族氮化物合金层的方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2743901B2 (ja) * | 1996-01-12 | 1998-04-28 | 日本電気株式会社 | 窒化ガリウムの結晶成長方法 |
| JP3500281B2 (ja) * | 1997-11-05 | 2004-02-23 | 株式会社東芝 | 窒化ガリウム系半導体素子およびその製造方法 |
| JP2001093834A (ja) * | 1999-09-20 | 2001-04-06 | Sanyo Electric Co Ltd | 半導体素子および半導体ウエハならびにその製造方法 |
| JP3888374B2 (ja) * | 2004-03-17 | 2007-02-28 | 住友電気工業株式会社 | GaN単結晶基板の製造方法 |
| JP2007095858A (ja) * | 2005-09-28 | 2007-04-12 | Toshiba Ceramics Co Ltd | 化合物半導体デバイス用基板およびそれを用いた化合物半導体デバイス |
| JP2008021889A (ja) * | 2006-07-14 | 2008-01-31 | Covalent Materials Corp | 窒化物半導体単結晶 |
| US20080296626A1 (en) * | 2007-05-30 | 2008-12-04 | Benjamin Haskell | Nitride substrates, thin films, heterostructures and devices for enhanced performance, and methods of making the same |
-
2009
- 2009-09-20 DE DE102009042349A patent/DE102009042349B4/de not_active Expired - Fee Related
-
2010
- 2010-09-16 CN CN2010800526159A patent/CN102668027A/zh active Pending
- 2010-09-16 KR KR1020127009222A patent/KR20120083399A/ko not_active Withdrawn
- 2010-09-16 US US13/496,957 patent/US20120217617A1/en not_active Abandoned
- 2010-09-16 WO PCT/DE2010/001094 patent/WO2011032546A1/de not_active Ceased
- 2010-09-16 EP EP10776926A patent/EP2478551A1/de not_active Withdrawn
- 2010-09-16 JP JP2012530124A patent/JP2013505590A/ja active Pending
- 2010-09-20 TW TW099131883A patent/TW201126757A/zh unknown
Non-Patent Citations (2)
| Title |
|---|
| "Maskless selectivee growth of semi-polar (11-22) GaN on Si(311) substrate by metal organic vapor phase epitaxy", M. Yang et. Al., J. Cryst. Growth 311 (2008) 2914-8 * |
| "Metal organic vapor phase epitaxy growth of single crystalline GaN on planar Si (211) substrate", R. Ravash et al., Appl. Phys. Lett. 95, 242101 (2009) * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013505590A (ja) | 2013-02-14 |
| US20120217617A1 (en) | 2012-08-30 |
| WO2011032546A1 (de) | 2011-03-24 |
| CN102668027A (zh) | 2012-09-12 |
| KR20120083399A (ko) | 2012-07-25 |
| DE102009042349A1 (de) | 2011-03-31 |
| TW201126757A (en) | 2011-08-01 |
| EP2478551A1 (de) | 2012-07-25 |
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Legal Events
| Date | Code | Title | Description |
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| OP8 | Request for examination as to paragraph 44 patent law | ||
| R020 | Patent grant now final |
Effective date: 20110917 |
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| R082 | Change of representative |
Representative=s name: EISENFUEHR, SPEISER & PARTNER, DE Representative=s name: EISENFUEHR, SPEISER & PARTNER, 10178 BERLIN, DE |
|
| R081 | Change of applicant/patentee |
Owner name: AZZURRO SEMICONDUCTORS AG, DE Free format text: FORMER OWNER: OTTO-VON-GUERICKE-UNIVERSITAET MAGDEBURG, 39106 MAGDEBURG, DE Effective date: 20120330 |
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| R082 | Change of representative |
Representative=s name: EISENFUEHR SPEISER PATENTANWAELTE RECHTSANWAEL, DE Effective date: 20120330 Effective date: 20120330 |
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| R082 | Change of representative |
Representative=s name: EISENFUEHR SPEISER PATENTANWAELTE RECHTSANWAEL, DE |
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| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee | ||
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20150401 |