DE102008047395A1 - Integrierte Schaltung mit induktivem Bauelement und ferromagnetischem Material - Google Patents

Integrierte Schaltung mit induktivem Bauelement und ferromagnetischem Material Download PDF

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Publication number
DE102008047395A1
DE102008047395A1 DE102008047395A DE102008047395A DE102008047395A1 DE 102008047395 A1 DE102008047395 A1 DE 102008047395A1 DE 102008047395 A DE102008047395 A DE 102008047395A DE 102008047395 A DE102008047395 A DE 102008047395A DE 102008047395 A1 DE102008047395 A1 DE 102008047395A1
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DE
Germany
Prior art keywords
ferromagnetic material
substrate
integrated circuit
inductive component
ferromagnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102008047395A
Other languages
German (de)
English (en)
Other versions
DE102008047395B4 (de
Inventor
Bernhard Knott
Josef Hoeglauer
Uwe Jansen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of DE102008047395A1 publication Critical patent/DE102008047395A1/de
Application granted granted Critical
Publication of DE102008047395B4 publication Critical patent/DE102008047395B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE102008047395A 2007-09-25 2008-09-16 Integrierte Schaltung mit induktivem Bauelement und ferromagnetischem Material und Verfahren zum Herstellen einer integrierten Schaltung Active DE102008047395B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/860,848 2007-09-25
US11/860,848 US8149080B2 (en) 2007-09-25 2007-09-25 Integrated circuit including inductive device and ferromagnetic material

Publications (2)

Publication Number Publication Date
DE102008047395A1 true DE102008047395A1 (de) 2009-07-23
DE102008047395B4 DE102008047395B4 (de) 2011-04-14

Family

ID=40471002

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008047395A Active DE102008047395B4 (de) 2007-09-25 2008-09-16 Integrierte Schaltung mit induktivem Bauelement und ferromagnetischem Material und Verfahren zum Herstellen einer integrierten Schaltung

Country Status (2)

Country Link
US (1) US8149080B2 (zh-CN)
DE (1) DE102008047395B4 (zh-CN)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011050228B4 (de) * 2010-06-07 2013-08-01 Infineon Technologies Ag Halbleiter-Package und Verfahren zur Herstellung eines Halbleiter-Packages mit Induktionsspule

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9761553B2 (en) * 2012-10-19 2017-09-12 Taiwan Semiconductor Manufacturing Company Limited Inductor with conductive trace
KR20140083577A (ko) * 2012-12-26 2014-07-04 삼성전기주식회사 공통모드필터 및 이의 제조방법
KR20140094324A (ko) * 2013-01-22 2014-07-30 삼성전기주식회사 공통모드필터 및 이의 제조방법
US10115661B2 (en) * 2013-02-08 2018-10-30 Qualcomm Incorporated Substrate-less discrete coupled inductor structure
US20140225706A1 (en) * 2013-02-13 2014-08-14 Qualcomm Incorporated In substrate coupled inductor structure
KR20160117943A (ko) * 2015-04-01 2016-10-11 삼성전기주식회사 코일 부품
KR20180013072A (ko) * 2016-07-28 2018-02-07 삼성전기주식회사 코일 부품 및 그 제조 방법
US10923417B2 (en) 2017-04-26 2021-02-16 Taiwan Semiconductor Manufacturing Company Limited Integrated fan-out package with 3D magnetic core inductor
KR101792469B1 (ko) 2017-09-07 2017-10-31 삼성전기주식회사 공통모드필터 및 이의 제조방법
DE102018204366A1 (de) * 2018-03-22 2019-09-26 Robert Bosch Gmbh Induktives Bauelement und Hochfrequenz-Filtervorrichtung
US20230116340A1 (en) * 2021-10-08 2023-04-13 Wits Co., Ltd. Method of manufacturing wireless charging coil module coated with magnetic material on surface of coil

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JPS63220504A (ja) 1987-03-10 1988-09-13 Toyama Pref Gov 樹脂結合型磁性体組成物及びその成形体製造法
DE4117878C2 (de) 1990-05-31 1996-09-26 Toshiba Kawasaki Kk Planares magnetisches Element
JPH0582736A (ja) * 1991-07-15 1993-04-02 Matsushita Electric Ind Co Ltd インダクタ
US5465475A (en) * 1992-07-30 1995-11-14 Ricoh Co., Ltd. Method of forming a thin film magnetic head
US5643804A (en) * 1993-05-21 1997-07-01 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a hybrid integrated circuit component having a laminated body
JPH0817656A (ja) 1994-06-29 1996-01-19 T I F:Kk 半導体装置の磁気シールド方式および磁気シールド膜形成方法
US5793272A (en) 1996-08-23 1998-08-11 International Business Machines Corporation Integrated circuit toroidal inductor
US6191468B1 (en) * 1999-02-03 2001-02-20 Micron Technology, Inc. Inductor with magnetic material layers
US6856228B2 (en) * 1999-11-23 2005-02-15 Intel Corporation Integrated inductor
GB2379558A (en) 2001-09-11 2003-03-12 Baker R Electromagnetic component and its method of manufacture
US20030112110A1 (en) * 2001-09-19 2003-06-19 Mark Pavier Embedded inductor for semiconductor device circuit
US7042325B2 (en) * 2002-05-31 2006-05-09 International Rectifier Corporation Planar transformer arrangement
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US6996892B1 (en) * 2005-03-24 2006-02-14 Rf Micro Devices, Inc. Circuit board embedded inductor
US7485511B2 (en) * 2005-06-01 2009-02-03 Semiconductor Energy Laboratory Co., Ltd. Integrated circuit device and method for manufacturing integrated circuit device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011050228B4 (de) * 2010-06-07 2013-08-01 Infineon Technologies Ag Halbleiter-Package und Verfahren zur Herstellung eines Halbleiter-Packages mit Induktionsspule
US8513771B2 (en) 2010-06-07 2013-08-20 Infineon Technologies Ag Semiconductor package with integrated inductor
DE102011050228B9 (de) * 2010-06-07 2013-11-21 Infineon Technologies Ag Halbleiter-Package und Verfahren zur Herstellung eines Halbleiter-Packages mit Induktionsspule

Also Published As

Publication number Publication date
DE102008047395B4 (de) 2011-04-14
US8149080B2 (en) 2012-04-03
US20090079529A1 (en) 2009-03-26

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Effective date: 20110830