DE102007055170A1 - Optische Vorformen für Festkörper-Lichtemissionswürfel und Verfahren und Systeme zu deren Herstellung und Zusammenbau - Google Patents
Optische Vorformen für Festkörper-Lichtemissionswürfel und Verfahren und Systeme zu deren Herstellung und Zusammenbau Download PDFInfo
- Publication number
- DE102007055170A1 DE102007055170A1 DE102007055170A DE102007055170A DE102007055170A1 DE 102007055170 A1 DE102007055170 A1 DE 102007055170A1 DE 102007055170 A DE102007055170 A DE 102007055170A DE 102007055170 A DE102007055170 A DE 102007055170A DE 102007055170 A1 DE102007055170 A1 DE 102007055170A1
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- Germany
- Prior art keywords
- preform
- state light
- light emitting
- solid state
- emitting chip
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
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- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/563,840 | 2006-11-28 | ||
| US11/563,840 US20080121911A1 (en) | 2006-11-28 | 2006-11-28 | Optical preforms for solid state light emitting dice, and methods and systems for fabricating and assembling same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102007055170A1 true DE102007055170A1 (de) | 2008-06-12 |
Family
ID=39382087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102007055170A Ceased DE102007055170A1 (de) | 2006-11-28 | 2007-11-19 | Optische Vorformen für Festkörper-Lichtemissionswürfel und Verfahren und Systeme zu deren Herstellung und Zusammenbau |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20080121911A1 (https=) |
| JP (2) | JP2008166740A (https=) |
| DE (1) | DE102007055170A1 (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012045772A1 (de) * | 2010-10-08 | 2012-04-12 | Osram Ag | Optoelektronisches halbleiterbauelement und verfahren zu seiner herstellung |
| WO2012156514A1 (de) * | 2011-05-18 | 2012-11-22 | Osram Opto Semiconductors Gmbh | Optoelektronischer halbleiterchip, optoelektronisches halbleiterbauelement und verfahren zur herstellung eines optoelektronischen halbleiterbauelements |
| DE102012102476A1 (de) * | 2012-03-22 | 2013-09-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
| DE102014101804A1 (de) * | 2013-12-18 | 2015-06-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| EP2382673B1 (de) * | 2009-01-23 | 2019-01-30 | OSRAM Opto Semiconductors GmbH | Optoelektronisches halbleiterbauteil und verfahren zu seiner herstellung |
Families Citing this family (84)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| EP2120271A4 (en) * | 2007-03-01 | 2015-03-25 | Nec Lighting Ltd | LIGHT EMITTING DIODE DEVICE AND LIGHTING APPARATUS |
| JP2010533976A (ja) * | 2007-07-18 | 2010-10-28 | キユーデイー・ビジヨン・インコーポレーテツド | 固体照明に有用な量子ドットベースの光シート |
| US8119028B2 (en) * | 2007-11-14 | 2012-02-21 | Cree, Inc. | Cerium and europium doped single crystal phosphors |
| US8169136B2 (en) | 2008-02-21 | 2012-05-01 | Nitto Denko Corporation | Light emitting device with translucent ceramic plate |
| US8916890B2 (en) * | 2008-03-19 | 2014-12-23 | Cree, Inc. | Light emitting diodes with light filters |
| WO2009151515A1 (en) | 2008-05-06 | 2009-12-17 | Qd Vision, Inc. | Solid state lighting devices including quantum confined semiconductor nanoparticles |
| DE102008054029A1 (de) * | 2008-10-30 | 2010-05-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
| JP5255421B2 (ja) * | 2008-12-15 | 2013-08-07 | 株式会社小糸製作所 | 発光モジュール、発光モジュールの製造方法、および灯具ユニット |
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| JP5630966B2 (ja) * | 2009-04-27 | 2014-11-26 | 日亜化学工業株式会社 | 発光素子チップ組立体およびその製造方法 |
| RU2531848C2 (ru) | 2009-05-19 | 2014-10-27 | Конинклейке Филипс Электроникс Н.В. | Рассеивающая и преобразующая свет пластина для сид |
| CN102473816B (zh) * | 2009-06-30 | 2015-03-11 | 3M创新有限公司 | 基于电流拥挤调节颜色的电致发光装置 |
| US8097894B2 (en) * | 2009-07-23 | 2012-01-17 | Koninklijke Philips Electronics N.V. | LED with molded reflective sidewall coating |
| DE102009039890A1 (de) * | 2009-09-03 | 2011-03-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einem Halbleiterkörper, einer Isolationsschicht und einer planaren Leitstruktur und Verfahren zu dessen Herstellung |
| KR101601622B1 (ko) * | 2009-10-13 | 2016-03-09 | 삼성전자주식회사 | 발광다이오드 소자, 발광 장치 및 발광다이오드 소자의 제조방법 |
| TWI492422B (zh) * | 2010-03-18 | 2015-07-11 | 億光電子工業股份有限公司 | 具有螢光粉層之發光二極體晶片的製作方法 |
| JP2011222852A (ja) * | 2010-04-13 | 2011-11-04 | Nitto Denko Corp | 光半導体装置 |
| JP5497520B2 (ja) * | 2010-04-14 | 2014-05-21 | 株式会社小糸製作所 | 発光モジュールおよび光波長変換部材 |
| WO2011142097A1 (ja) * | 2010-05-13 | 2011-11-17 | パナソニック株式会社 | 実装用基板及びその製造方法、発光モジュール並びに照明装置 |
| WO2011145794A1 (ko) | 2010-05-18 | 2011-11-24 | 서울반도체 주식회사 | 파장변환층을 갖는 발광 다이오드 칩과 그 제조 방법, 및 그것을 포함하는 패키지 및 그 제조 방법 |
| KR101719642B1 (ko) * | 2010-09-15 | 2017-03-24 | 서울반도체 주식회사 | 발광 다이오드 패키지 및 그 제조 방법 |
| US20110309393A1 (en) | 2010-06-21 | 2011-12-22 | Micron Technology, Inc. | Packaged leds with phosphor films, and associated systems and methods |
| US8835199B2 (en) * | 2010-07-28 | 2014-09-16 | GE Lighting Solutions, LLC | Phosphor suspended in silicone, molded/formed and used in a remote phosphor configuration |
| TW201208143A (en) * | 2010-08-06 | 2012-02-16 | Semileds Optoelectronics Co | White LED device and manufacturing method thereof |
| DE102010034915A1 (de) | 2010-08-20 | 2012-02-23 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Streukörper |
| DE102010035490A1 (de) * | 2010-08-26 | 2012-03-01 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelements |
| DE102010044560A1 (de) * | 2010-09-07 | 2012-03-08 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
| US8334646B2 (en) | 2010-09-27 | 2012-12-18 | Osram Sylvania Inc. | LED wavelength-coverting plate with microlenses in multiple layers |
| US8242684B2 (en) * | 2010-09-27 | 2012-08-14 | Osram Sylvania Inc. | LED wavelength-converting plate with microlenses |
| TWI446590B (zh) | 2010-09-30 | 2014-07-21 | 億光電子工業股份有限公司 | 發光二極體封裝結構及其製作方法 |
| EP2631958A1 (en) * | 2010-10-22 | 2013-08-28 | Panasonic Corporation | Mounting board, light emitting device and lamp |
| DE102010050832A1 (de) * | 2010-11-09 | 2012-05-10 | Osram Opto Semiconductors Gmbh | Lumineszenzkonversionselement, Verfahren zu dessen Herstellung und optoelektronisches Bauteil mit Lumineszenzkonversionselement |
| TW201222878A (en) * | 2010-11-23 | 2012-06-01 | Siliconware Precision Industries Co Ltd | Light-permeating cover board, fabrication method thereof, and package structure having LED |
| KR101752426B1 (ko) * | 2010-12-03 | 2017-07-11 | 서울반도체 주식회사 | 발광소자 및 이를 포함하는 발광다이오드 패키지 |
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| US8227271B1 (en) * | 2011-01-27 | 2012-07-24 | Himax Technologies Limited | Packaging method of wafer level chips |
| JP2012160664A (ja) * | 2011-02-02 | 2012-08-23 | Bridgestone Kbg Co Ltd | 青色ledから得られた白色光及びこれに用いるシリコーンテープ |
| EP2503606B1 (en) | 2011-03-25 | 2020-02-26 | Samsung Electronics Co., Ltd. | Light Emitting Diode, Manufacturing Method Thereof, Light Emitting Diode Module, and Manufacturing Method Thereof |
| JP6066253B2 (ja) * | 2011-09-26 | 2017-01-25 | 東芝ライテック株式会社 | 発光装置の製造方法 |
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| US8907362B2 (en) | 2012-01-24 | 2014-12-09 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
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| US20130187540A1 (en) | 2012-01-24 | 2013-07-25 | Michael A. Tischler | Discrete phosphor chips for light-emitting devices and related methods |
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| CN104979432A (zh) * | 2014-04-08 | 2015-10-14 | 刘胜 | 直接发出白光的led芯片封装工艺 |
| CN104979452A (zh) * | 2014-04-08 | 2015-10-14 | 刘胜 | 在晶圆上制造和封装发光二极管芯片的工艺方法 |
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| US20170025589A1 (en) * | 2015-07-22 | 2017-01-26 | Epistar Corporation | Light emitting structure and method for manufacturing the same |
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| CN109937486B (zh) * | 2017-09-28 | 2022-04-05 | 亮锐控股有限公司 | 用于发光器件的波长转换材料 |
| JP6665143B2 (ja) * | 2017-10-02 | 2020-03-13 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| KR101848709B1 (ko) | 2018-01-12 | 2018-04-16 | 주식회사 에코아 | 간판용 led형광등 |
| KR102035423B1 (ko) * | 2018-05-16 | 2019-10-22 | 연세대학교 산학협력단 | 플라즈마 공정 모니터링 장치 및 이를 포함하는 플라즈마 처리장치 |
| WO2020007463A1 (en) * | 2018-07-04 | 2020-01-09 | Osram Opto Semiconductors Gmbh | Luminescence conversion element, optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device |
| WO2021134748A1 (zh) * | 2020-01-02 | 2021-07-08 | 厦门市三安光电科技有限公司 | 发光装置及发光设备 |
| DE102021120136A1 (de) * | 2021-08-03 | 2023-02-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur herstellung eines optoelektronischen bauelements |
| US20230170449A1 (en) * | 2021-12-01 | 2023-06-01 | Creeled, Inc. | Light-emitting diode chips and manufacturing processes thereof |
| EP4548408A1 (en) * | 2022-06-29 | 2025-05-07 | Lumileds LLC | Improved phosphor-converted light emitting device |
| CN117917782A (zh) * | 2022-10-20 | 2024-04-23 | 福建中科芯源光电科技有限公司 | 新型封装rgb三色led器件及其制备方法与应用 |
| CN117317078B (zh) * | 2023-11-28 | 2024-04-19 | 天津德高化成新材料股份有限公司 | 一种适用于垂直芯片的白光csp制备方法及其应用 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE59713024D1 (de) * | 1996-06-26 | 2010-01-28 | Osram Opto Semiconductors Gmbh | Lichtabstrahlender Halbleiterchip und Lichtabstrahlendes Halbleiterbauelement und Verfahren zu dessen Herstellung |
| US7053419B1 (en) * | 2000-09-12 | 2006-05-30 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
| US6791119B2 (en) * | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
| US6888167B2 (en) * | 2001-07-23 | 2005-05-03 | Cree, Inc. | Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding |
| US6740906B2 (en) * | 2001-07-23 | 2004-05-25 | Cree, Inc. | Light emitting diodes including modifications for submount bonding |
| US7928455B2 (en) * | 2002-07-15 | 2011-04-19 | Epistar Corporation | Semiconductor light-emitting device and method for forming the same |
| KR101182041B1 (ko) * | 2002-09-19 | 2012-09-11 | 크리 인코포레이티드 | 경사 측벽을 포함하고 인광물질이 코팅된 발광 다이오드,및 그의 제조방법 |
| US7042020B2 (en) * | 2003-02-14 | 2006-05-09 | Cree, Inc. | Light emitting device incorporating a luminescent material |
| US9142734B2 (en) * | 2003-02-26 | 2015-09-22 | Cree, Inc. | Composite white light source and method for fabricating |
| US6885033B2 (en) * | 2003-03-10 | 2005-04-26 | Cree, Inc. | Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same |
| US7029935B2 (en) * | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
| US7183587B2 (en) * | 2003-09-09 | 2007-02-27 | Cree, Inc. | Solid metal block mounting substrates for semiconductor light emitting devices |
| US7355284B2 (en) * | 2004-03-29 | 2008-04-08 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element |
| US7326583B2 (en) * | 2004-03-31 | 2008-02-05 | Cree, Inc. | Methods for packaging of a semiconductor light emitting device |
| US7279346B2 (en) * | 2004-03-31 | 2007-10-09 | Cree, Inc. | Method for packaging a light emitting device by one dispense then cure step followed by another |
| US7517728B2 (en) * | 2004-03-31 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices including a luminescent conversion element |
| US7361938B2 (en) * | 2004-06-03 | 2008-04-22 | Philips Lumileds Lighting Company Llc | Luminescent ceramic for a light emitting device |
| US7553683B2 (en) * | 2004-06-09 | 2009-06-30 | Philips Lumiled Lighting Co., Llc | Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices |
| US7118262B2 (en) * | 2004-07-23 | 2006-10-10 | Cree, Inc. | Reflective optical elements for semiconductor light emitting devices |
| US7372198B2 (en) * | 2004-09-23 | 2008-05-13 | Cree, Inc. | Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor |
| US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
| US20060124953A1 (en) * | 2004-12-14 | 2006-06-15 | Negley Gerald H | Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same |
| US7322732B2 (en) * | 2004-12-23 | 2008-01-29 | Cree, Inc. | Light emitting diode arrays for direct backlighting of liquid crystal displays |
| JP2006278567A (ja) * | 2005-03-28 | 2006-10-12 | Matsushita Electric Works Ltd | Ledユニット |
| US7112700B1 (en) * | 2005-04-14 | 2006-09-26 | Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College | Efficient and economic asymmetric synthesis of nootkatone, tetrahydronootkatone, their precursors and derivatives |
| JP4971672B2 (ja) * | 2005-09-09 | 2012-07-11 | パナソニック株式会社 | 発光装置 |
-
2006
- 2006-11-28 US US11/563,840 patent/US20080121911A1/en not_active Abandoned
-
2007
- 2007-11-19 DE DE102007055170A patent/DE102007055170A1/de not_active Ceased
- 2007-11-28 JP JP2007307647A patent/JP2008166740A/ja active Pending
-
2011
- 2011-07-01 JP JP2011147460A patent/JP2011188001A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2382673B1 (de) * | 2009-01-23 | 2019-01-30 | OSRAM Opto Semiconductors GmbH | Optoelektronisches halbleiterbauteil und verfahren zu seiner herstellung |
| WO2012045772A1 (de) * | 2010-10-08 | 2012-04-12 | Osram Ag | Optoelektronisches halbleiterbauelement und verfahren zu seiner herstellung |
| WO2012156514A1 (de) * | 2011-05-18 | 2012-11-22 | Osram Opto Semiconductors Gmbh | Optoelektronischer halbleiterchip, optoelektronisches halbleiterbauelement und verfahren zur herstellung eines optoelektronischen halbleiterbauelements |
| US9444022B2 (en) | 2011-05-18 | 2016-09-13 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip, optoelectronic semiconductor component, and a method for producing an optoelectronic semiconductor component |
| US9882097B2 (en) | 2011-05-18 | 2018-01-30 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip, optoelectronic semiconductor component, and a method for producing an optoelectronic semiconductor component |
| DE102012102476A1 (de) * | 2012-03-22 | 2013-09-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
| US9142716B2 (en) | 2012-03-22 | 2015-09-22 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component, and method for the manufacture of an optoelectronic semiconductor component |
| DE102012102476B4 (de) | 2012-03-22 | 2022-09-08 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
| DE102014101804A1 (de) * | 2013-12-18 | 2015-06-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011188001A (ja) | 2011-09-22 |
| US20080121911A1 (en) | 2008-05-29 |
| JP2008166740A (ja) | 2008-07-17 |
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