DE102007017546B4 - Mehrzahl von Multichipmodulen und Verfahren zur Herstellung - Google Patents
Mehrzahl von Multichipmodulen und Verfahren zur Herstellung Download PDFInfo
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- DE102007017546B4 DE102007017546B4 DE102007017546A DE102007017546A DE102007017546B4 DE 102007017546 B4 DE102007017546 B4 DE 102007017546B4 DE 102007017546 A DE102007017546 A DE 102007017546A DE 102007017546 A DE102007017546 A DE 102007017546A DE 102007017546 B4 DE102007017546 B4 DE 102007017546B4
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/733,679 US7872350B2 (en) | 2007-04-10 | 2007-04-10 | Multi-chip module |
US11/733,679 | 2007-04-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102007017546A1 DE102007017546A1 (de) | 2008-10-30 |
DE102007017546B4 true DE102007017546B4 (de) | 2012-10-25 |
Family
ID=39777288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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DE102007017546A Expired - Fee Related DE102007017546B4 (de) | 2007-04-10 | 2007-04-16 | Mehrzahl von Multichipmodulen und Verfahren zur Herstellung |
Country Status (2)
Country | Link |
---|---|
US (1) | US7872350B2 (pt-PT) |
DE (1) | DE102007017546B4 (pt-PT) |
Families Citing this family (11)
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US9103902B2 (en) * | 2007-05-09 | 2015-08-11 | Infineon Technologies Ag | Packaged antenna and method for producing same |
US20110075392A1 (en) | 2009-09-29 | 2011-03-31 | Astec International Limited | Assemblies and Methods for Directly Connecting Integrated Circuits to Electrically Conductive Sheets |
US9589872B2 (en) * | 2012-03-28 | 2017-03-07 | Infineon Technologies Americas Corp. | Integrated dual power converter package having internal driver IC |
US9171784B2 (en) | 2012-03-28 | 2015-10-27 | International Rectifier Corporation | Dual power converter package using external driver IC |
US9082759B2 (en) | 2012-11-27 | 2015-07-14 | Infineon Technologies Ag | Semiconductor packages and methods of formation thereof |
US10840005B2 (en) | 2013-01-25 | 2020-11-17 | Vishay Dale Electronics, Llc | Low profile high current composite transformer |
US10998124B2 (en) | 2016-05-06 | 2021-05-04 | Vishay Dale Electronics, Llc | Nested flat wound coils forming windings for transformers and inductors |
KR102464202B1 (ko) | 2016-08-31 | 2022-11-04 | 비쉐이 데일 일렉트로닉스, 엘엘씨 | 낮은 직류 저항을 갖는 고전류 코일을 구비한 인덕터 |
DE202018003198U1 (de) * | 2018-07-10 | 2018-08-09 | Continental Automotive Gmbh | Stromrichter, elektrische Antriebsanordnung mit einem Stromrichter |
TWI733454B (zh) * | 2020-05-18 | 2021-07-11 | 矽品精密工業股份有限公司 | 電子裝置、電子封裝件及其封裝基板 |
US11948724B2 (en) | 2021-06-18 | 2024-04-02 | Vishay Dale Electronics, Llc | Method for making a multi-thickness electro-magnetic device |
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Also Published As
Publication number | Publication date |
---|---|
US20080251912A1 (en) | 2008-10-16 |
US7872350B2 (en) | 2011-01-18 |
DE102007017546A1 (de) | 2008-10-30 |
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