DE102006032431B4 - Verfahren und Vorrichtung zur Detektion von mechanischen Defekten in einem aus Halbleitermaterial bestehenden Stabstück - Google Patents

Verfahren und Vorrichtung zur Detektion von mechanischen Defekten in einem aus Halbleitermaterial bestehenden Stabstück Download PDF

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Publication number
DE102006032431B4
DE102006032431B4 DE102006032431A DE102006032431A DE102006032431B4 DE 102006032431 B4 DE102006032431 B4 DE 102006032431B4 DE 102006032431 A DE102006032431 A DE 102006032431A DE 102006032431 A DE102006032431 A DE 102006032431A DE 102006032431 B4 DE102006032431 B4 DE 102006032431B4
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DE
Germany
Prior art keywords
rod
semiconductor wafers
flat surface
semiconductor
rod piece
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
DE102006032431A
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German (de)
English (en)
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DE102006032431A1 (de
Inventor
Dr. Dipl.-Phys. Köster Ludwig
Dr.-Phys. Czurratis Peter
Dr. Dipl.-Ing. Krämer Klaus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
SAM TEC GmbH
Original Assignee
Siltronic AG
SAM TEC GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic AG, SAM TEC GmbH filed Critical Siltronic AG
Priority to DE102006032431A priority Critical patent/DE102006032431B4/de
Priority to SG200703478-8A priority patent/SG138524A1/en
Priority to JP2007159543A priority patent/JP2008003085A/ja
Priority to TW96121736A priority patent/TWI356165B/zh
Priority to US11/764,854 priority patent/US8038895B2/en
Priority to KR1020070061291A priority patent/KR100904693B1/ko
Priority to CN2007101120477A priority patent/CN101093212B/zh
Publication of DE102006032431A1 publication Critical patent/DE102006032431A1/de
Priority to JP2010090640A priority patent/JP5331745B2/ja
Application granted granted Critical
Publication of DE102006032431B4 publication Critical patent/DE102006032431B4/de
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/11—Analysing solids by measuring attenuation of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/07—Analysing solids by measuring propagation velocity or propagation time of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/225—Supports, positioning or alignment in moving situation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
    • G01N29/265—Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the sensor relative to a stationary material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/044—Internal reflections (echoes), e.g. on walls or defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/262—Linear objects
    • G01N2291/2626—Wires, bars, rods

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
DE102006032431A 2006-06-22 2006-07-13 Verfahren und Vorrichtung zur Detektion von mechanischen Defekten in einem aus Halbleitermaterial bestehenden Stabstück Active DE102006032431B4 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102006032431A DE102006032431B4 (de) 2006-06-22 2006-07-13 Verfahren und Vorrichtung zur Detektion von mechanischen Defekten in einem aus Halbleitermaterial bestehenden Stabstück
SG200703478-8A SG138524A1 (en) 2006-06-22 2007-05-15 Method and apparatus for detection of mechanical defects in an ingot piece composed of semiconductor material
TW96121736A TWI356165B (en) 2006-06-22 2007-06-15 Method for the production of a multiplicity of sem
JP2007159543A JP2008003085A (ja) 2006-06-22 2007-06-15 半導体材料から成るインゴットブロックの機械的欠陥を検出する方法および装置
US11/764,854 US8038895B2 (en) 2006-06-22 2007-06-19 Method and appartus for detection of mechanical defects in an ingot piece composed of semiconductor material
KR1020070061291A KR100904693B1 (ko) 2006-06-22 2007-06-21 반도체 재료로 구성된 잉곳 부재의 기계적 결함을 검출하는방법 및 장치
CN2007101120477A CN101093212B (zh) 2006-06-22 2007-06-22 检测由半导体材料构成的锭件中机械缺陷的方法和设备
JP2010090640A JP5331745B2 (ja) 2006-06-22 2010-04-09 半導体ウェハを製造する方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006028650 2006-06-22
DE102006028650.2 2006-06-22
DE102006032431A DE102006032431B4 (de) 2006-06-22 2006-07-13 Verfahren und Vorrichtung zur Detektion von mechanischen Defekten in einem aus Halbleitermaterial bestehenden Stabstück

Publications (2)

Publication Number Publication Date
DE102006032431A1 DE102006032431A1 (de) 2007-12-27
DE102006032431B4 true DE102006032431B4 (de) 2011-12-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE102006032431A Active DE102006032431B4 (de) 2006-06-22 2006-07-13 Verfahren und Vorrichtung zur Detektion von mechanischen Defekten in einem aus Halbleitermaterial bestehenden Stabstück

Country Status (4)

Country Link
JP (1) JP5331745B2 (ja)
CN (1) CN101093212B (ja)
DE (1) DE102006032431B4 (ja)
TW (1) TWI356165B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7952187B2 (en) * 2008-03-31 2011-05-31 General Electric Company System and method of forming a wafer scale package
DE102008002832B4 (de) 2008-04-24 2010-12-09 Institut für Akustomikroskopie Dr. Krämer GmbH Verfahren und Vorrichtung zur zerstörungsfreien Detektion von Defekten im Inneren von Halbleitermaterial
US8508239B2 (en) * 2009-05-05 2013-08-13 Lam Research Corporation Non-destructive signal propagation system and method to determine substrate integrity
DE202009018526U1 (de) 2009-10-15 2011-12-09 Institut für Akustomikroskopie Dr. Krämer GmbH Vorrichtung zur zerstörungsfreien Inspektion des Inneren von Bauteilen und Transducer hierfür
DE102009044254A1 (de) 2009-10-15 2011-05-05 Institut für Akustomikroskopie Dr. Krämer GmbH Vorrichtung zur zerstörungsfreien Inspektion des Inneren von Bauteilen und Transducer hierfür
WO2012117088A1 (de) 2011-03-03 2012-09-07 Institut für Akustomikroskopie Dr. Krämer GmbH Vorrichtung zur zerstörungsfreien inspektion des inneren von bauteilen
CN102928280A (zh) * 2012-11-15 2013-02-13 苏州华碧微科检测技术有限公司 一种超声波扫描器件处理方法
CN104022182A (zh) * 2014-05-29 2014-09-03 浙江矽盛电子有限公司 一种硅片的生产控制、分选方法
JP5931263B1 (ja) * 2015-10-14 2016-06-08 株式会社日立パワーソリューションズ 超音波映像装置
JP7012538B2 (ja) * 2018-01-11 2022-01-28 株式会社ディスコ ウエーハの評価方法
DE102019208670A1 (de) 2019-06-14 2020-12-17 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben aus Silizium
FI3940124T3 (fi) 2020-07-14 2024-04-03 Siltronic Ag Kidekappale yksikiteisestä piistä

Citations (10)

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Publication number Priority date Publication date Assignee Title
DE2504988A1 (de) * 1974-02-15 1976-01-08 Univ Leland Stanford Junior Akustisches mikroskop
DE2936882A1 (de) * 1979-09-12 1981-04-02 Kraftwerk Union AG, 4330 Mülheim Pruefeinrichtung zur feststellung und analyse von materialfehlern
JPH0238356A (ja) * 1988-03-23 1990-02-07 Natl Inst For Res In Inorg Mater ビスマス系超電導セラミック厚膜の形成方法
US5381693A (en) * 1991-04-26 1995-01-17 Canon Kabushiki Kaisha Ultrasonic imaging apparatus with synthesized focus and setting range markings
US6047600A (en) * 1998-08-28 2000-04-11 Topaz Technologies, Inc. Method for evaluating piezoelectric materials
WO2001086281A1 (en) * 2000-05-05 2001-11-15 Acoustical Technologies Singapore Pte Ltd. Acoustic microscope
WO2002040987A1 (en) * 2000-11-17 2002-05-23 Sonoscan, Inc. Automated acoustic micro imaging system and method
US6439054B1 (en) * 2000-05-31 2002-08-27 Honeywell International Inc. Methods of testing sputtering target materials
WO2005076633A1 (en) * 2004-02-03 2005-08-18 Lg Electronic Inc. Recording medium and recording and reproducing methods and apparatuses
DE102006005448A1 (de) * 2005-04-11 2006-10-12 Krämer Scientific Instruments GmbH Verfahren und Vorrichtung zur akustischen Rastermikroskopie

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JPS4919940B1 (ja) * 1970-02-02 1974-05-21
JPS5917154A (ja) * 1982-07-20 1984-01-28 Kobe Steel Ltd 超音波法による欠陥の検出方法
JPS5960354A (ja) * 1982-09-30 1984-04-06 Toshiba Corp 超音波探傷装置
JPS61241659A (ja) * 1985-04-19 1986-10-27 Hitachi Micro Comput Eng Ltd 検査装置
JPS63121748A (ja) * 1986-11-10 1988-05-25 Hitachi Constr Mach Co Ltd 超音波探傷装置
JPH02238356A (ja) * 1989-03-13 1990-09-20 Toshiba Ceramics Co Ltd 半導体単結晶インゴットの判定方法
JPH11278983A (ja) * 1998-03-27 1999-10-12 Sumitomo Metal Ind Ltd 結晶切断方法
JP4247007B2 (ja) * 2003-01-31 2009-04-02 富士通株式会社 半導体ウエハの評価方法および半導体装置の製造方法
JP3861833B2 (ja) * 2003-03-14 2006-12-27 株式会社日立製作所 超音波検査方法及び装置
CN100372059C (zh) * 2003-12-24 2008-02-27 上海宏力半导体制造有限公司 形成半导体材料晶片的方法及其结构

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2504988A1 (de) * 1974-02-15 1976-01-08 Univ Leland Stanford Junior Akustisches mikroskop
DE2936882A1 (de) * 1979-09-12 1981-04-02 Kraftwerk Union AG, 4330 Mülheim Pruefeinrichtung zur feststellung und analyse von materialfehlern
JPH0238356A (ja) * 1988-03-23 1990-02-07 Natl Inst For Res In Inorg Mater ビスマス系超電導セラミック厚膜の形成方法
US5381693A (en) * 1991-04-26 1995-01-17 Canon Kabushiki Kaisha Ultrasonic imaging apparatus with synthesized focus and setting range markings
US6047600A (en) * 1998-08-28 2000-04-11 Topaz Technologies, Inc. Method for evaluating piezoelectric materials
WO2001086281A1 (en) * 2000-05-05 2001-11-15 Acoustical Technologies Singapore Pte Ltd. Acoustic microscope
US6439054B1 (en) * 2000-05-31 2002-08-27 Honeywell International Inc. Methods of testing sputtering target materials
WO2002040987A1 (en) * 2000-11-17 2002-05-23 Sonoscan, Inc. Automated acoustic micro imaging system and method
WO2005076633A1 (en) * 2004-02-03 2005-08-18 Lg Electronic Inc. Recording medium and recording and reproducing methods and apparatuses
DE102006005448A1 (de) * 2005-04-11 2006-10-12 Krämer Scientific Instruments GmbH Verfahren und Vorrichtung zur akustischen Rastermikroskopie

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP 02038356 A (abstract) 1990 *
jp22-38356A (abstract). 1990.

Also Published As

Publication number Publication date
JP2010175560A (ja) 2010-08-12
CN101093212B (zh) 2011-02-16
JP5331745B2 (ja) 2013-10-30
TW200801508A (en) 2008-01-01
TWI356165B (en) 2012-01-11
CN101093212A (zh) 2007-12-26
DE102006032431A1 (de) 2007-12-27

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Effective date: 20120302