DE10196362T1 - Leistungsdiode mit weichem Ausschaltverhalten (Soft Recovery) und darauf bezogenes Verfahren - Google Patents
Leistungsdiode mit weichem Ausschaltverhalten (Soft Recovery) und darauf bezogenes VerfahrenInfo
- Publication number
- DE10196362T1 DE10196362T1 DE10196362T DE10196362T DE10196362T1 DE 10196362 T1 DE10196362 T1 DE 10196362T1 DE 10196362 T DE10196362 T DE 10196362T DE 10196362 T DE10196362 T DE 10196362T DE 10196362 T1 DE10196362 T1 DE 10196362T1
- Authority
- DE
- Germany
- Prior art keywords
- soft
- behavior
- related process
- power diode
- recovery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title 1
- 238000011084 recovery Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/36—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the concentration or distribution of impurities in the bulk material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/927—Different doping levels in different parts of PN junction to produce shaped depletion layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Bipolar Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/603,605 US6737731B1 (en) | 2000-06-26 | 2000-06-26 | Soft recovery power diode |
US09/603,605 | 2000-06-26 | ||
PCT/US2001/019990 WO2002001643A2 (en) | 2000-06-26 | 2001-06-22 | Soft recovery power diode and related method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE10196362T1 true DE10196362T1 (de) | 2003-05-22 |
DE10196362B4 DE10196362B4 (de) | 2007-04-05 |
Family
ID=24416158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10196362T Expired - Lifetime DE10196362B4 (de) | 2000-06-26 | 2001-06-22 | Leistungsdiode mit weichem Ausschaltverhalten (Soft Recovery) und darauf bezogenes Verfahren |
Country Status (7)
Country | Link |
---|---|
US (1) | US6737731B1 (de) |
JP (1) | JP4608181B2 (de) |
CN (1) | CN1211865C (de) |
AU (1) | AU2001270086A1 (de) |
DE (1) | DE10196362B4 (de) |
TW (1) | TW507384B (de) |
WO (1) | WO2002001643A2 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7169634B2 (en) * | 2003-01-15 | 2007-01-30 | Advanced Power Technology, Inc. | Design and fabrication of rugged FRED |
US7199442B2 (en) * | 2004-07-15 | 2007-04-03 | Fairchild Semiconductor Corporation | Schottky diode structure to reduce capacitance and switching losses and method of making same |
DE102004048607A1 (de) | 2004-10-06 | 2006-04-13 | Robert Bosch Gmbh | Halbleiterbauelement |
JP4843253B2 (ja) * | 2005-05-23 | 2011-12-21 | 株式会社東芝 | 電力用半導体装置 |
US7728409B2 (en) * | 2005-11-10 | 2010-06-01 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device and method of manufacturing the same |
JP2009049045A (ja) * | 2007-08-13 | 2009-03-05 | Kansai Electric Power Co Inc:The | ソフトリカバリーダイオード |
JP5309360B2 (ja) * | 2008-07-31 | 2013-10-09 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
US8933506B2 (en) * | 2011-01-31 | 2015-01-13 | Alpha And Omega Semiconductor Incorporated | Diode structures with controlled injection efficiency for fast switching |
CN102832121B (zh) * | 2011-06-17 | 2015-04-01 | 中国科学院微电子研究所 | 快恢复二极管制造方法 |
CN103311314B (zh) * | 2012-03-11 | 2016-08-03 | 深圳市立德电控科技有限公司 | 快恢复二极管及制作该二极管的方法 |
CN103311278B (zh) * | 2012-03-11 | 2016-03-02 | 深圳市依思普林科技有限公司 | 快恢复二极管及制作该二极管的方法 |
CN102820323B (zh) * | 2012-09-07 | 2014-11-05 | 温州大学 | 纳米碳化硅/晶体碳化硅双缓变结快速恢复二极管及其制备方法 |
CN107922202A (zh) * | 2015-09-01 | 2018-04-17 | 日立化成株式会社 | 气凝胶 |
JP6846119B2 (ja) * | 2016-05-02 | 2021-03-24 | 株式会社 日立パワーデバイス | ダイオード、およびそれを用いた電力変換装置 |
CN107623045A (zh) * | 2017-09-30 | 2018-01-23 | 绍兴上虞欧菲光电科技有限公司 | 一种二极管 |
CN108598153B (zh) * | 2018-06-29 | 2023-12-29 | 南京晟芯半导体有限公司 | 软恢复功率半导体二极管及其制备方法 |
CN111653611A (zh) * | 2020-07-20 | 2020-09-11 | 电子科技大学 | 一种改善半导体器件反向恢复特性的方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1547287A (fr) * | 1966-12-19 | 1968-11-22 | Lucas Industries Ltd | Diode semiconductrice |
FR2395605A1 (fr) | 1977-06-21 | 1979-01-19 | Thomson Csf | Structure de diode a avalanche a rendement ameliore et diode utilisant une telle structure |
JPS5929469A (ja) | 1982-08-11 | 1984-02-16 | Hitachi Ltd | 半導体装置 |
JPS59189679A (ja) | 1983-04-13 | 1984-10-27 | Hitachi Ltd | ダイオ−ド |
JPS6453582A (en) * | 1987-08-25 | 1989-03-01 | Toko Inc | Variable capacitance diode device |
FR2638892B1 (fr) | 1988-11-09 | 1992-12-24 | Sgs Thomson Microelectronics | Procede de modulation de la quantite d'or diffusee dans un substrat de silicium et diode rapide obtenue par ce procede |
US5017950A (en) * | 1989-01-19 | 1991-05-21 | Toko, Inc. | Variable-capacitance diode element having wide capacitance variation range |
DE4201183A1 (de) | 1992-01-17 | 1993-07-22 | Eupec Gmbh & Co Kg | Leistungsdiode |
JP2509127B2 (ja) * | 1992-03-04 | 1996-06-19 | 財団法人半導体研究振興会 | 静電誘導デバイス |
US5608244A (en) | 1992-04-28 | 1997-03-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor diode with reduced recovery current |
JPH06314801A (ja) | 1993-03-05 | 1994-11-08 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JP2854212B2 (ja) * | 1993-03-12 | 1999-02-03 | ローム株式会社 | サージ吸収用ダイオード |
JP3994443B2 (ja) | 1995-05-18 | 2007-10-17 | 三菱電機株式会社 | ダイオード及びその製造方法 |
DE19713962C1 (de) | 1997-04-04 | 1998-07-02 | Siemens Ag | Leistungsdiode (FCI-Diode) |
JP3968912B2 (ja) * | 1999-05-10 | 2007-08-29 | 富士電機デバイステクノロジー株式会社 | ダイオード |
-
2000
- 2000-06-26 US US09/603,605 patent/US6737731B1/en not_active Expired - Lifetime
-
2001
- 2001-06-22 DE DE10196362T patent/DE10196362B4/de not_active Expired - Lifetime
- 2001-06-22 AU AU2001270086A patent/AU2001270086A1/en not_active Abandoned
- 2001-06-22 WO PCT/US2001/019990 patent/WO2002001643A2/en active Application Filing
- 2001-06-22 CN CNB018117856A patent/CN1211865C/zh not_active Expired - Lifetime
- 2001-06-22 JP JP2002505688A patent/JP4608181B2/ja not_active Expired - Lifetime
- 2001-06-26 TW TW090115470A patent/TW507384B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW507384B (en) | 2002-10-21 |
US6737731B1 (en) | 2004-05-18 |
WO2002001643A3 (en) | 2002-04-18 |
AU2001270086A1 (en) | 2002-01-08 |
CN1441968A (zh) | 2003-09-10 |
JP2004502305A (ja) | 2004-01-22 |
WO2002001643A2 (en) | 2002-01-03 |
CN1211865C (zh) | 2005-07-20 |
DE10196362B4 (de) | 2007-04-05 |
JP4608181B2 (ja) | 2011-01-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
8125 | Change of the main classification |
Ipc: H01L 29861 |
|
8364 | No opposition during term of opposition | ||
R071 | Expiry of right |