DE10084933T1 - Optische Empfangsvorrichtung und Haltevorrichtung und ein entsprechendes Anordnungsverfahren - Google Patents

Optische Empfangsvorrichtung und Haltevorrichtung und ein entsprechendes Anordnungsverfahren

Info

Publication number
DE10084933T1
DE10084933T1 DE10084933T DE10084933T DE10084933T1 DE 10084933 T1 DE10084933 T1 DE 10084933T1 DE 10084933 T DE10084933 T DE 10084933T DE 10084933 T DE10084933 T DE 10084933T DE 10084933 T1 DE10084933 T1 DE 10084933T1
Authority
DE
Germany
Prior art keywords
optical receiving
arrangement method
corresponding arrangement
receiving device
holding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE10084933T
Other languages
English (en)
Other versions
DE10084933B3 (de
Inventor
Takayuki Suzuki
Yoshitaka Terada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of DE10084933T1 publication Critical patent/DE10084933T1/de
Application granted granted Critical
Publication of DE10084933B3 publication Critical patent/DE10084933B3/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/11—Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
    • H04B10/114—Indoor or close-range type systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
DE10084933T 1999-08-25 2000-08-24 Optischer Empfänger sowie zugehörige Haltevorrichtung und zugehöriges Verfahren zum Anordnen Expired - Lifetime DE10084933B3 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11/238460 1999-08-25
JP23846099 1999-08-25
PCT/JP2000/005714 WO2001015348A1 (fr) 1999-08-25 2000-08-24 Recepteur optique, support et agencement

Publications (2)

Publication Number Publication Date
DE10084933T1 true DE10084933T1 (de) 2002-07-25
DE10084933B3 DE10084933B3 (de) 2012-01-19

Family

ID=17030566

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10084933T Expired - Lifetime DE10084933B3 (de) 1999-08-25 2000-08-24 Optischer Empfänger sowie zugehörige Haltevorrichtung und zugehöriges Verfahren zum Anordnen

Country Status (5)

Country Link
US (1) US6858830B2 (de)
JP (1) JP4068842B2 (de)
AU (1) AU6729100A (de)
DE (1) DE10084933B3 (de)
WO (1) WO2001015348A1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030142984A1 (en) * 2002-01-25 2003-07-31 Yoshifumi Masuda Optical communication circuit chip, optical/electrical common transmission apparatus, optical transmission apparatus, and electric apparatus using same
US6906306B2 (en) * 2002-04-30 2005-06-14 Jds Uniphase Corporation Photodiode optical power monitor
US7539423B2 (en) * 2003-01-10 2009-05-26 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Loss of signal detection and programmable behavior after error detection
CA2569265C (en) 2003-07-24 2012-10-09 Reflex Photonique Inc./Reflex Photonics Inc. Encapsulated optical package
JP2005093610A (ja) * 2003-09-16 2005-04-07 Sumitomo Electric Ind Ltd 光受信器
JP4133897B2 (ja) * 2004-03-29 2008-08-13 シャープ株式会社 光受信機
JP2006040976A (ja) * 2004-07-22 2006-02-09 Hamamatsu Photonics Kk 光検出器
JP4379328B2 (ja) * 2004-12-20 2009-12-09 住友電気工業株式会社 光受信器
JP2007124473A (ja) * 2005-10-31 2007-05-17 Yokogawa Electric Corp 光通信装置
US7570109B2 (en) * 2005-11-04 2009-08-04 Lite-On Technology Corp. System and method for demodulating amplitude modulated signals
JP2008022249A (ja) * 2006-07-12 2008-01-31 Dx Antenna Co Ltd 増幅器
DE102006045271B4 (de) * 2006-09-22 2012-12-06 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Verfahren zur Herstellung eines optischen Sende- und/oder Empfangsmoduls
JP2008085529A (ja) * 2006-09-27 2008-04-10 Hitachi Kokusai Electric Inc 光伝送システム
EP2416372B1 (de) 2009-03-30 2017-04-19 AutoNetworks Technologies, Ltd. Optisches kommunikationsmodul und verfahren zur herstellung eines optischen kommunikationsmoduls
JP2010238751A (ja) 2009-03-30 2010-10-21 Autonetworks Technologies Ltd 光通信モジュール
WO2010113910A1 (ja) 2009-03-30 2010-10-07 株式会社オートネットワーク技術研究所 光通信モジュール及び光通信モジュールの製造方法
JP5222233B2 (ja) 2009-06-16 2013-06-26 株式会社オートネットワーク技術研究所 光通信モジュール
US8882368B2 (en) 2009-12-03 2014-11-11 Autonetworks Technologies, Ltd. Optical communication module
US20140010555A1 (en) * 2012-07-06 2014-01-09 Alcatel-Lucent Usa Inc. PON Video Overlay Amplifier Circuit
KR102050548B1 (ko) * 2015-01-27 2020-01-08 쿠앙치 인텔리전트 포토닉 테크놀로지 리미티드 광통신 발사장치 및 접수장치
KR102343627B1 (ko) * 2017-04-28 2021-12-24 주식회사 아도반테스토 증폭기, 바이어스 전압 트리밍 회로, 입력 신호 증폭 방법 및 바이어스 전압 트리밍 방법
WO2018228773A1 (en) 2017-06-13 2018-12-20 Firecomms Limited A wide dynamic range optical receiver
US20190074908A1 (en) * 2017-09-06 2019-03-07 Nokia Solutions And Networks Oy Coherent optical receiver for medium- and short-reach links
CN114556809A (zh) * 2019-10-09 2022-05-27 昕诺飞控股有限公司 光学无线通信系统和设备
JP6869393B1 (ja) * 2020-03-12 2021-05-12 シチズン千葉精密株式会社 位置変換器、および検出器の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60242740A (ja) * 1984-05-17 1985-12-02 Fujitsu Ltd 光通信システム
JPS62202566A (ja) * 1986-02-28 1987-09-07 Canon Inc 半導体受光装置
DE3706252A1 (de) * 1986-02-28 1987-09-03 Canon Kk Halbleiterfotosensor
JPS6377171A (ja) * 1986-09-19 1988-04-07 Matsushita Electric Ind Co Ltd 光受信器
JPH03120877A (ja) * 1989-10-04 1991-05-23 Sumitomo Electric Ind Ltd 受光素子
JPH09321343A (ja) * 1996-05-31 1997-12-12 Dowa Mining Co Ltd 光通信用の部品装置
US5864591A (en) * 1997-03-27 1999-01-26 Integration Associates, Inc. Apparatus and method for suppression of feedback in a communications receiver
JPH1140840A (ja) * 1997-07-16 1999-02-12 Sumitomo Electric Ind Ltd 光受信器
US6384948B1 (en) * 1998-09-30 2002-05-07 The United States Of America As Represented By The Secretary Of The Navy High-sensitivity, high-speed digital optical photoreceiver
US6493490B1 (en) * 2000-12-18 2002-12-10 Terabeam Corporation Method and apparatus for receiving and aligning an optical communications beam with an integrated

Also Published As

Publication number Publication date
WO2001015348A1 (fr) 2001-03-01
DE10084933B3 (de) 2012-01-19
JP4068842B2 (ja) 2008-03-26
US20020020803A1 (en) 2002-02-21
US6858830B2 (en) 2005-02-22
AU6729100A (en) 2001-03-19

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8128 New person/name/address of the agent

Representative=s name: GROSSE, BOCKHORNI, SCHUMACHER, 81476 MUENCHEN

8110 Request for examination paragraph 44
8128 New person/name/address of the agent

Representative=s name: GROSSE, SCHUMACHER, KNAUER, VON HIRSCHHAUSEN, 8033

R018 Grant decision by examination section/examining division
R020 Patent grant now final

Effective date: 20120420

R071 Expiry of right